Abstract: A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die is electrically bonded to the first die and includes a through substrate via. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via, and the redistribution layer includes a barrier layer and a conductive layer. The conductive layer of the redistribution layer continuously extends between opposite surfaces of the dielectric layer, and a conductive post of the through via extends from the surface of the dielectric layer towards the first die, and the conductive layer of the redistribution layer is separated from the through substrate via by the barrier layer.

Abstract: A method of forming an integrated circuit package includes attaching a first die to an interposer. The interposer includes a first die connector and a second die connector on the interposer and a first dielectric layer covering at least one sidewall of the first die connector and at least one sidewall of the second die connector. The first die is coupled to the first die connector and to the first dielectric layer and the second die connector is exposed by the first die. The method further includes recessing the first dielectric layer to expose at least one sidewall of the second die connector and attaching a second die to the interposer, the second die being coupled to the second die connector.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A method of preparing polylactic acid (PLA) microsphere and polylactic-co-glycolic acid (PLGA) microsphere is provided, including the following steps. A first solution is provided, including polylactic acid or polylactic-co-glycolic acid and an organic solvent. A second solution is provided, including polyvinyl alcohol, sodium carboxymethyl cellulose and an aqueous solution. The first solution is added to the second solution and, at the same time, the second solution is agitated until polylactic acid is solidified to form a plurality of polylactic acid microspheres, or until polylactic-co-glycolic acid is solidified to form a plurality of polylactic-co-glycolic acid microspheres. The polylactic acid microspheres or polylactic-co-glycolic acid microspheres are collected.

Abstract: In one embodiment, a method includes capturing images of a first user wearing a VR display device in a real-world environment. The method includes receiving a VR rendering of a VR environment. The VR rendering is from the perspective of the mobile computing device with respect to the VR display device. The method includes generating a first MR rendering of the first user in the VR environment. The first MR rendering of the first user is based on a compositing of the images of the first user and the VR rendering. The method includes receiving an indication of a user interaction with one or more elements of the VR environment in the first MR rendering. The method includes generating, in real-time responsive to the indication of the user interaction with the one or more elements, a second MR rendering of the first user in the VR environment. The one or more elements are modified according to the interaction.

Abstract: A mouse device includes a multi-touch region on a button. The mouse device includes a touchpad, a press switch, a button cover and a control board. The touchpad triggers a corresponding touch signal when any one of a plurality of touch regions respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to accept a pressing operation of pressing toward an inner side to press the touchpad, and to press the press switch through the touchpad. When receiving the touch signal and the switch signal, the control board triggers the input event of the pressed touch region.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Methods, computer program products, and systems are presented. The method computer program products, and systems can include, for instance: obtaining workload characterizing data, wherein the workload characterizing data characterizes a plurality of workloads of a cluster; assessing workloads of the plurality of workloads with use of characterizing data of the workload characterizing data; generating prompting data in dependence on the assessing of the workloads of the plurality of workloads, wherein the prompting data prompts for merging of identified workloads of the plurality of workloads; and presenting the prompting data to a user.

Abstract: An image adjustment method, applied to an image sensing system comprising an image sensor, comprising: (a) sensing a target image by the image sensor; (b) dividing the target image to a plurality of image regions; (c) acquiring location information of at least one first target feature in the image regions; (d) computing brightness information of each of the image regions; (e) generating adjustment curves according to the brightness information and according to required brightness values of each of the image regions; and (f) adjusting brightness values of the image regions according to the adjustment curves. The step (d) adjusts the brightness information according to the location information or the step (e) adjusts the adjustment curves according to the location information.

Abstract: A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures, wherein the array comprises a number (M) of active TSV structures; a number (N) of contact structures, the contact structures comprising a plurality of pairs configured to receive an input test signal and provide an output test signal, respectively; and a plurality of binary-tree branches, each of the plurality of binary-tree branches electrically coupling a first one of the active TSV structures to a second one of the active TSV structures and a third one of the active TSV structures.

Abstract: A method includes depositing a first work function layer over a first and second gate trench. The method includes depositing a second work function layer over the first work function layer. The method includes etching the second work function layer in the first gate trench while covering the second work function layer in the second gate trench, causing the first work function layer in the first gate trench to contain metal dopants that are left from the second work function layer etched in the first gate trench. The method includes forming a first active gate structure and second active gate structure, which include the first work function layer and the metal dopants left from the second work function layer in the first gate trench, and the first work function layer and no metal dopants left behind from the second work function layer, respectively.

Abstract: A method, computer program product, and computer system for generating and using a layering resource representation of a resource in a container orchestration platform. An owner controller creates a base layer of the layering resource representation. The base layer is a resource field tree of the entire resource. After the base layer is created, one or more collaborator controllers create respective one or more overlay layers of the layering resource representation. Each overlay layer is a sub-tree of the resource field tree. Each collaborator controller is authorized to update each field of the sub-tree created by each collaborator controller and is not authorized to update any other field of the resource field tree. Any field of the sub-tree that is updated by the collaborator controller that created the sub-tree replaces any previous updating of any field by the owner controller.

Abstract: The invention provides a fracture opening simulation device for hard brittle mudstone and shale with organic matter, it includes a simulated support, the lower part of the simulated support is connected with a storage bucket bottom block plate through a screw, the middle of the simulated support is provided with a support socket with a circular structure, the upper surface of the storage bucket bottom block plate is provided with a circular convex structure of a block plate boss, the block plate boss is closely inserted in the support socket, the upper surface of the simulated support is fixed connected with a core column storage barrel.

Abstract: A die stack structure includes an interconnection structure, a logic die, a control die, a first insulating encapsulant, a dummy die, a memory cube and a second insulating encapsulant. The logic die is electrically connected to the interconnection structure. The logic die comprises a first dielectric bonding structure. The control die is laterally separated from the logic die and electrically connected to the interconnection structure. The first insulating encapsulant laterally encapsulates the logic die and the control die. The dummy die is stacked on the logic die, the logic die is located between the interconnection structure and the dummy die, the dummy die comprises a second dielectric bonding structure, and a bonding interface is located between the first dielectric bonding structure and the second dielectric bonding structure. The memory cube is stacked on and electrically connected to the control die, wherein the control die is located between the interconnection structure and the memory cube.

Abstract: The present invention relates to the field of LIDAR technology, and in particular to an optical package structure for a LIDAR. An optical package structure for a LIDAR includes a housing; a laser transceiver component arranged in the housing, and configured to emit a laser and to receive for detection; a temperature control component arranged in the housing and connected to the laser transceiver component; and a conduction circuit board arranged on the housing and electrically connected to an external circuit board. The conduction circuit board is arranged to be electrically connected to the laser transceiver component.

Abstract: Embodiments provide a mouse device that includes with a plurality of touch areas on one or more mouse buttons. The mouse device includes a touch panel, a press switch, a button cover and a control panel. The touch panel triggers a corresponding touch signal when any one of the plurality of touch areas respectively corresponding to a plurality of input events is pressed. A switch signal is triggered when the press switch is pressed. The button cover is used to receive a pressing operation of pressing, toward inside, the touch panel, and press the press switch via the touch panel. When receiving the touch signal and the switch signal, the control panel triggers the input event of the pressed touch area.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: An image sensor structure and methods of forming the same are provided. An image sensor structure according to the present disclosure includes a semiconductor substrate including a photodiode, a transfer gate transistor disposed over the semiconductor substrate and having a first channel area, a first dielectric layer disposed over the semiconductor substrate, a semiconductor layer disposed over the first dielectric layer, a source follower transistor disposed over the semiconductor layer and having a second channel area, a row select transistor disposed over the semiconductor layer and having a third channel area, and a reset transistor disposed over the semiconductor layer and having a fourth channel area. The second channel area is greater than the first channel area, the third channel area or the fourth channel area.

Abstract: A selenium-chelating pea oligopeptide, a preparation method thereof and use thereof. After the selenium-chelating pea oligopeptide is subjected to digestion treatment in at least one of following three ways, a change rate of selenium content not more than 3% with respect to the selenium content before the digestion treatment: hydrolyzing for 4 hours by a pepsin at a pH value of 2 and a temperature of 37° C.; hydrolyzing for 6 hours by a trypsin at a pH value of 7.5 and a temperature of 37° C.; maintaining the temperature constant at 37° C., firstly hydrolyzing for 4 hours by the pepsin at a pH value of 2, and then continuing to hydrolyze for 6 hours by a trypsin at a pH value of 6.8. The preparation method thereof includes mixing and reacting an aqueous solution of pea oligopeptide and sodium selenite, and then being subjected to alcohol precipitation and drying.

Abstract: A method of programming a memory device including a cell is provided. A first program pulse is applied to the cell. Middle program pulses are applied to the cell after the application of the first program pulse. A last program pulse is applied to the cell after the application of the middle program pulses. A pulse width of the last program pulse is wider than a pulse width of each of the middle program pulses and the first program pulse.