Abstract: Capability orchestration in a cloud-native environment includes one or more new combined capability definitions generated by one or more processing units based on existing capability definitions and a combined capability manifest to form a hierarchy of capability definitions. A capability request directed to one or more capabilities can be received by the one or more processing units. One or more capability definitions corresponding to the one or more capabilities can be determined from the hierarchy of capability definitions by the one or more processing units based on the capability request. Deployable resources can be derived by the one or more processing units based on the determined one or more capability definitions. The one or more capabilities can be generated by the one or more processing units based on the derived deployable resources.

Abstract: A HDR tone mapping system includes several modules. A semantic segmentation module is used to extract semantic information from the input image. An image decomposition module is used to decompose the input image to a high-bit base layer and a detail layer. A statistics module is used to generate statistics of pixels of the input image according to the semantic information. A curve computation module is used to generate a tone curve from the statistics. A compression module is used to compress the high-bit base layer to a low-bit base layer according to the tone curve, the statistics and the semantic information. A detail adjustment module is used to tune the detail layer according to the semantic information and the statistics to generate an adjusted detail layer. An image reconstruction module is used to combine the adjusted detail layer and the low-bit base layer to generate an output image.

Abstract: The temperature control apparatus comprises a heat exchanging unit and a working fluid. The heat exchanging unit is independently disposed and divided into a first heat exchanging portion disposed at a first environment and a second heat exchanging portion disposed at a second environment. The heat exchanging unit has a plurality of heat-dissipating fins and a pipe running in the first heat exchanging portion and then running in the second heat exchanging portion. The pipe has an inlet and an outlet disposed in the first and second heat exchanging portions respectively. The pipe has a larger pipe diameter around the inlet and the outlet, and has a smaller pipe diameter away from the inlet and the outlet. The smaller pipe diameter of the pipe has the capillary function for regulating the pressure of the working fluid in the first and second heat exchanging portions.

Abstract: A method of making a semiconductor structure includes forming a pixel array region on a substrate. The method further includes forming a first seal ring region on the substrate, wherein the first seal ring region surrounds the pixel array region, and the first seal ring region includes a first seal ring. The method further includes forming a first isolation feature in the first seal ring region, wherein forming the first isolation feature includes filling a first opening with a dielectric material, wherein the first isolation feature is a continuous structure surrounding the pixel array region. The method further includes forming a second isolation feature between the first isolation feature and the pixel array region, wherein forming the second isolation feature includes filling a second opening with the dielectric material.

Abstract: A method for degrading polyethylene terephthalate is provided. The method includes: providing polyethylene terephthalate material, providing a catalyst composite including a porous carrier having a pore size of 45 ? to 250 ? and a metal compound including at least one selected from a group consisting of zinc oxide, zinc hydroxide, zinc carbonate, magnesium oxide, calcium oxide, zirconium oxide, and titanium dioxide, in which the metal oxide is loaded on the porous carrier; and performing a degradation reaction, in which the polyethylene terephthalate material is reacted with the catalyst composite in the presence of an alcohol solvent.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: A method of manufacturing a semiconductor device, the method includes bonding a first die and a second die to a first side of a wafer, wherein after bonding the first die and the second die to the first side of the wafer, a gap is disposed between the first die and the second die, wherein a first portion of the gap has a first width that is larger than a second width of a second portion of the gap, depositing a third dielectric layer on top surfaces and sidewalls of the first die and the second die, as well as on a bottom surface within the gap, forming a molding material over the third dielectric layer to fill the gap, and performing a planarization process to expose top surfaces of the first die and the second die.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: Disclosed in the present application is a hybrid automatic repeat request feedback method, which comprises the steps that: an HARQ-ACK codebook includes HARQ-ACK information of M PDSCHs, the M PDSCHs are all scheduled by first-type PDCCHs, and the first-type PDCCHs are used for activating an SPS configuration; the order of the HARQ-ACK information of the M PDSCHs in the HARQ-ACK codebook is arranged according to at least one parameter value among cell indexes, BWP indexes, SPS configuration indexes and PDSCH transmission moments of the M PDSCHs. The embodiments of the present application also provide a hybrid automatic repeat request feedback method with the participation of second-type PDCCHs for releasing SPS and dynamically configured third-type PDCCHs. The present application also provides a terminal device and a network device to which the method is applied. The present application solves the problem of how to generate an HARQ-ACK codebook when there are multiple PDSCHs in an SPS configuration condition.

Abstract: A method includes placing a first package component. The first package component includes a first alignment mark and a first dummy alignment mark. A second package component is aligned to the first package component. The second package component includes a second alignment mark and a second dummy alignment mark. The aligning is performed using the first alignment mark for positioning the first package component, and using the second alignment mark for position the second package component. The second package component is bonded to the first package component to form a package, with the first alignment mark being bonded to the second dummy alignment mark.

Abstract: A memory device includes a memory string, and a control logic coupled to the memory string. The control logic is configured to perform a first programming operation and a second programming operation on a selected memory cell of the memory string, after the first programming operation and before the second programming operation, apply a ground voltage to a first word line coupled to the selected memory cell, and apply a first voltage to a second word line coupled to an unselected memory cell of the memory string, wherein the first voltage is higher than the ground voltage.

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, an identification of a startup of a data processing system may be made. Based on the identification, a determination may be made regarding whether a device is present in an expansion slot of the data processing system. If the device is present, then another determination may be made regarding whether identification information is able to be obtained from the device. If obtained, the identification information may be interpreted to obtain communication link bifurcation settings for the device. Default communication link training settings may then be updated based on the bifurcation settings to obtain updated training settings. Communication link training may then be initiated for a communication link using the updated training settings.

Abstract: A method of forming an integrated circuit package includes attaching a first die to an interposer. The interposer includes a first die connector and a second die connector on the interposer and a first dielectric layer covering at least one sidewall of the first die connector and at least one sidewall of the second die connector. The first die is coupled to the first die connector and to the first dielectric layer and the second die connector is exposed by the first die. The method further includes recessing the first dielectric layer to expose at least one sidewall of the second die connector and attaching a second die to the interposer, the second die being coupled to the second die connector.

Abstract: A package structure includes first and second dies, an insulation structure, a through via, a dielectric layer and a redistribution layer. The second die electrically bonded to the first die includes a through substrate via. The insulation structure is disposed on the first die and laterally surrounds the second die. The through via penetrates through the insulation structure to electrically connect to the first die. The dielectric layer is disposed on the second die and the insulation structure. The redistribution layer is embedded in the dielectric layer and electrically connected to the through via. The redistribution layer includes a first barrier layer and a conductive layer on the first barrier layer. The through substrate via is electrically connected to the redistribution layer, and the conductive layer is in contact with a conductive post of the through via and separated from the through substrate via by the first barrier layer therebetween.

Abstract: A test circuit coupled to a memory device and configured to read data stored in the memory device during a memory dump, includes a dump controller and a pattern generator. The dump controller triggers the pattern generator to start a pattern generating operation in response to a setting of memory dump mode by a processor. The pattern generator generates multiple control signals in the pattern generating operation and provides the control signals to the memory device. The control signals include an address signal, a memory enable signal and a read enable signal. The address signal includes multiple memory addresses arranged in multiple consecutive clock cycles of the processor. The consecutive clock cycles of the processor is provided to read the data stored in the memory addresses.

Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method implemented on a computing device having at least one processor, storage, and a communication platform connected to a network for determining blood pressure includes: receiving a request to determine a blood pressure of a first subject from a terminal, obtaining data relating to the first subject, the data relating to the first subject including data relating to heart activity of the first subject and personal information relating to the first subject, extracting target features relating to the first subject from the data relating to the first subject, determining a preliminary blood pressure of the first subject using a prediction model based on the target features relating to the first subject, determining a predicted blood pressure of the first subject using an optimization model based on the preliminary blood pressure and sending the predicted blood pressure of the first subject to the terminal in response to the request.

Abstract: An embodiment is a structure including a first fin over a substrate, a second fin over the substrate, the second fin being adjacent the first fin, an isolation region surrounding the first fin and the second fin, a gate structure along sidewalls and over upper surfaces of the first fin and the second fin, the gate structure defining channel regions in the first fin and the second fin, a source/drain region on the first fin and the second fin adjacent the gate structure, and an air gap separating the source/drain region from a top surface of the substrate.

Abstract: Disclosed are a processing apparatus, a corrugated plate, and a storage container. The processing apparatus includes a pair of slide plates, a pair of press plates, a shaping block, and a driving mechanism. The driving mechanism includes a slide plate driving portion linked to a shaping block driving portion, allowing the slide plate driving portion drives the pair of slide plates to approach each other at a first predetermined speed, the shaping block driving portion moves the shaping block downward at a second predetermined speed, and the first and second predetermined speed are specifically correlated with respect to a predetermined forming profile of an intersection portion. The processing apparatus of the present disclosure causes running speeds of various portions that move in different directions to extrude a blank plate to be specifically associated, so that the formation process is particularly applicable to a corrugated plate having the predetermined corrugated shape.