Abstract: The invention provides methods and apparatuses of forming a silicon nitride layer on a semiconductor wafer is located on a susceptor within a semiconductor processing chamber. A carrier gas, a nitrogen source gas, and a silicon source gas are introduced into the semiconductor processing chamber and a semiconductor wafer is exposed to the mixture of gases at a pressure in the chamber in the range of approximately 100 on to 500 Torr.

Abstract: Disclosed is an improved probe housing mechanism that will allow for the quick release of a probe tip from a testing tool. The invention includes a probe housing, a double cantilevered beam for holding a probe tip, and a releasable spring mechanism for holding the beam into place. The spring mechanism can be released by squeezing the spring together or by releasing a non-removable locking screw, thereby allowing the beam to be slidably removed from the probe housing for easy replacement.

Abstract: A bed-of-nails type or needle-card type test probe has clusters of parallel buckling beams arranged in a spaced arrangement. The buckling beams are arranged and electrically connected within a cluster so that a contaminant, which may be on the device being tested, does not reduce the accuracy of the test measurements. In particular, the spacing of the buckling beams is such that multiple buckling beams are capable of contacting a single feature on an electronics package to be tested. The buckling beams deflect independently of each other in response to compressive force, and the buckling beams within a cluster are electrically connected in parallel to each other to define redundant, independent conductive paths through the buckling beams. In this way, if a contaminant prevents one of the buckling beams of the cluster from making electrical contact with the feature to be tested, the other one or more of the buckling beams of the cluster will make the required electrical connection.

Abstract: A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.

Abstract: Disclosed is an interposer and test structure for making contact between a substrate and a test bed. One embodiment of the interposer has a floating, rigid conductive element in a nonconductive body which makes temporary contact between the test bed and the substrate. In another embodiment of the invention, the interposer includes two layers of material, in which one layer includes pogo pins for contacting the substrate and the other layer includes pads for contacting the test bed. The pogo pins are on a grid spacing corresponding to that of the substrate input/output pads while the interposer pads are on a grid spacing corresponding to that of the pogo pin contactors of the test bed.

Abstract: A buckling beam probe assembly and a process to make the assembly using insulated metal to hold the vertical beam probe wires. The buckling beam probe assembly electrically connects a test apparatus with contact pads on the surface of a device to be tested. The assembly comprises a plurality of buckling beam wires each having a head, a body, and a tail and being pressed vertically onto the contact pads and buckling laterally to adapt to height differences of the contact pads caused by irregularities on the surface of the device to be tested. A top plate has a first plurality of apertures receiving the heads of the plurality of buckling beam wires. A bottom plate has a second plurality of apertures receiving the tails of the plurality of buckling beam wires. A plurality of intermediate metal sections are positioned between the top plate and the bottom plate.

Abstract: A fixture for testing circuits includes a rectangular array of conductive test pads, alternating with insulating areas in a checkerboard-like pattern. In a first embodiment, the entire array is printed on a central portion of a plastic membrane, with outer portions of the membrane carrying electrical lines from the test pads to connectors. In a second embodiment, the rectangular array is formed on surfaces of a number of closely packet plastic membranes, each of which has tabs extending away from the testing surface to connectors. The test fixture is generic, not being configured for testing a particular circuit configuration. To compensate for conditions of linear misalignment, the rectangular array is moved in a raster pattern having a size equal to the cell size of the rectangular array. To compensate for conditions of angular misalignment, the array may be rotated after such misalignment is measured, or test results may be compared with exemplary data for a number of misalignment conditions.

Abstract: Disclosed is an improved probe housing mechanism that will allow for the quick release of a probe tip from a testing tool. The invention includes a probe housing, a double cantilevered beam for holding a probe tip, and a releasable spring mechanism for holding the beam into place. The spring mechanism can be released by squeezing the spring together or by releasing a non-removable locking screw, thereby allowing the beam to be slidably removed from the probe housing for easy replacement.

Abstract: A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.

Abstract: A method of preparing biodegradable, water-resistant, moldable paper board or molded paper utensil which includes the steps of: (a) preparing a pulp aqueous slurry at a consistency of about 4%; (b) adding surfactant selected from the group consisting of rosin soap, sodium oleate, sodium stearate, and sodium palmitate to the pulp aqueous slurry; (c) adding between 25-75% weight of a biodegradable and water-resistant agent selected from the group consisting of calcium stearate, cellulose stearate, calcium palmitate and cellulose palmitate to the pulp aqueous slurry to form a slurry mixture; (d) refining the slurry mixture at a consistency of about 4% to a desired drainage; (e) diluting the refined slurry mixture and adding thereto an aggregating agent as alum to form a furnish; (f) forming the furnish to obtain a dry moldable soft paper board; (g) preheating the moldable paper board obtained in step (f) at a temperature from 110.degree. to 170.degree. C.

Abstract: A flexible conductive sheet includes a polymeric film coated with conductive metals. The flexible conductive sheet may be used in a shorting pad probe tip for a substrate tester by loosely wrapping the flexible conductive sheet around a compliant mandrel. The flexible conductive sheet may also be used for shielding an integrated circuit from radio frequency interference. The polymer film may be polyimide.

Abstract: A shorting pad probe tip for a substrate tester includes a compliant mandrel, a flexible conductive sheet and a nest plate. The flexible conductive sheet is loosely wrapped around the compliant mandrel. The compliant mandrel and flexible conductive sheet are secured together to the supporting nest plate. At least one side of the flexible conductive sheet is electrically conductive such that when the probe tip is brought in contact with the substrate to be tested, I/O pads on the surface of the substrate become electrically connected. In one embodiment the flexible conductive sheet is metallized polyimide.

Abstract: A biodegradable and water-resistant paper product which has the compositions of 8-30% weight of a biodegradable and water-resistant agent selected from the group consisting of calcium stearate, cellulose stearate, calcium palmitate and cellulose palmitate, 92-70% weight of pulp, based on the sum of the dry weight of pulp and water-resistant agent; surfactant selected from the group consisting of rosin soap, sodium oleate, sodium stearate, and sodium palmitate; and aggregating agent as alum.

Abstract: A method and apparatus for locating shorts in multi-layer electronic packages during manufacture allows repair of the shorts and improved yields of the packages. A multi-layer package is fitted in a fixture after forming a thin film layer of metalization, and test is performed to detect shorts in the package. If a short is detected, a low current, high frequency signal is injected in pins on a bottom surface of the package. An approximate two dimensional location of the short is sensed by detecting an electromagnetic force induced by a magnetic field inductively coupled to a sensor proximate to the short on a top surface of the multi-layer package. The approximate location of the short is then inspected to precisely locate the short.

Abstract: A method of preparing biodegradable water-resistant paper utensils which includes the steps of: (a) preparing a pulp aqueous slurry at a consistency of about 4%; (b) adding surfactant to the slurry; (c) thereafter, adding between 8 and 30 percent weight of a biodegradable and water-resistant agent to the slurry to form a slurry mixture; (d) refining the slurry mixture at a consistency of about 4 percent to a desired drainage; (e) diluting the refined slurry mixture and adding an aggregating agent thereto to form a furnish; and (f) after step (e), forming the furnish to obtain biodegradable, water-resistant paper board or directly a paper utensil. The forming step can be through a hot-press at a temperature of 115.degree. to 170.degree. C.

Abstract: A compact circuit breaker utilizing an electronic trip unit for overcurrent determination contains a compact slot motor and a compact arc chute to minimize and control the arc that occurs when the circuit breaker fixed and movable contacts become separated upon intense overcurrent conditions. The fixed contact is arranged on a fixed contact arm that includes an arc runner for rapidly directing the arc into the arc chute.

Abstract: A compact circuit breaker utilizing an electronic trip unit for overcurrent determination contains a compact slot motor and a compact arc chute to minimize and control the arc that occurs when the circuit breaker contacts become separated upon intense overcurrent conditions.

Abstract: An integrated protection unit is a circuit breaker which includes basic overcurrent protection facility along with selective electrical accessories. A molded plastic accessory access cover secured to the integrated protection unit cover protects the accessory components contained within the circuit breaker cover from the environment. An auxiliary switch unit is one such accessory component which can be field-installed without affecting the integrity of the circuit breaker overcurrent protection components.

Abstract: A molded case circuit breaker movable contact arm or carrier electrically connects with the circuit breaker trip unit or load terminal without requiring a flexible electrical conducting braid. The contact carrier is pivotally arranged within a contact carrier support to which the trip unit or load terminal lug is attached. The contact carrier pivot pin is supported on a pair of parallel posts extending from the contact carrier and a spring clip is positioned around the parallel posts and the pivoting end of the contact carrier to promote good electric transport without interfering with the rotational movement of the contact carrier.