Abstract: Methods for improving channel boosting and reducing program disturb during programming of memory cells within a memory array are described. The memory array may comprise a NAND flash memory structure, such as a vertical NAND structure or a bit cost scalable (BiCS) NAND structure. In some cases, by applying continuous voltage ramping to unselected word lines during or throughout a programming operation, the boosting of channels associated with program inhibited memory cells may be improved. In one example, the slope and timing of a Vpass waveform applied to a group of unselected word lines (e.g., the neighboring word lines of the selected word line) during the programming operation may be set based on the location of the selected word line within the memory array and the locations of the group of unselected word lines within the memory array.

Abstract: A memory device and associated techniques for reducing disturbs of select gate transistors and dummy memory cells in a memory device. In one approach, a ramp up of the voltage of a dummy word line is delayed relative to a ramp up of a voltage of data word lines in a program phase of a program loop, after a pre-charge phase of the program loop. Another possible approach delays the ramp up of a first dummy memory cell while the voltage of a second dummy memory cell is maintained at an elevated level throughout the pre-charge phase and the program phase. In another aspect, the disturb countermeasure is used when the selected data memory cell is relatively close to the source-end of the memory string and phased out when the selected data memory cell is relatively close to the drain-end of the memory string.

Abstract: Disturbs are reduced during programming and read operations for drain-side memory cells in a string by controlling dummy word line portions separately in selected and unselected sub-blocks. One or more of the dummy word line layers are separated so that they can be driven with different voltages. This allows the channel gradient to be optimized to reduce the likelihood of disturbs. In another aspect, a stack of alternating conductive and dielectric layers is formed in two parts, with lower pillars which comprise select gate transistors, source-side dummy memory cells and data memory cells, below upper pillars which comprise drain-side dummy memory cells and select gate transistors. The upper pillars are relatively narrow to provide a more compact structure. Moreover, the centerline of some upper pillars can be offset from the centerline of corresponding lower pillars to provide room for an isolation region.

Abstract: A memory device and associated techniques for reducing program disturb of memory cells which are formed in a two-tier stack with an increased distance between memory cells at an interface between the tiers. After a verify test in a program loop, a different timing is used for decreasing the word line voltages of the interface memory cells compared to the remaining memory cells. In one aspect, the start of the decrease of the word line voltages of the interface memory cells is delayed. In another aspect, the word line voltages of the interface memory cells is decreased to an intermediate level and held for a time period before being decreased further. In another aspect, the word line voltages of the interface memory cells are decreased at a lower rate.

Abstract: A memory device and associated techniques for reducing hot electron injection type of disturbs of memory cells. In one approach, after a pre-charge operation, voltages of a first group of adjacent word lines comprising a selected word line (WLn) and one or more drain-side word lines of WLn are increased after voltages of remaining word lines are increased. In another approach, after the pre-charge operation, voltages of the first group of adjacent word lines are increased in steps while voltages of remaining word lines are continuously increased. In another approach, voltages of the first group of adjacent word lines are increased from a negative voltage while voltages of remaining word lines are increased from 0 V. In another aspect, the disturb countermeasures can be implemented according to the position of WLn in a multi-tier stack.

Abstract: A memory device and associated techniques for reducing hot electron injection type of disturbs of memory cells. In one approach, after a pre-charge operation, voltages of a first group of adjacent word lines comprising a selected word line (WLn) and one or more drain-side word lines of WLn are increased after voltages of remaining word lines are increased. In another approach, after the pre-charge operation, voltages of the first group of adjacent word lines are increased in steps while voltages of remaining word lines are continuously increased. In another approach, voltages of the first group of adjacent word lines are increased from a negative voltage while voltages of remaining word lines are increased from 0 V. In another aspect, the disturb countermeasures can be implemented according to the position of WLn in a multi-tier stack.

Abstract: A memory device and associated techniques for reducing program disturb of memory cells which are formed in a two-tier stack with an increased distance between memory cells at an interface between the tiers. After a verify test in a program loop, a different timing is used for decreasing the word line voltages of the interface memory cells compared to the remaining memory cells. In one aspect, the start of the decrease of the word line voltages of the interface memory cells is delayed. In another aspect, the word line voltages of the interface memory cells is decreased to an intermediate level and held for a time period before being decreased further. In another aspect, the word line voltages of the interface memory cells are decreased at a lower rate.

Abstract: A memory device and associated techniques for reducing disturbs of select gate transistors and dummy memory cells in a memory device. In one approach, a ramp up of the voltage of a dummy word line is delayed relative to a ramp up of a voltage of data word lines in a program phase of a program loop, after a pre-charge phase of the program loop. Another possible approach delays the ramp up of a first dummy memory cell while the voltage of a second dummy memory cell is maintained at an elevated level throughout the pre-charge phase and the program phase. In another aspect, the disturb countermeasure is used when the selected data memory cell is relatively close to the source-end of the memory string and phased out when the selected data memory cell is relatively close to the drain-end of the memory string.

Abstract: A memory device and associated techniques for reducing read disturb of memory cells during a sensing process. Select gate transistors are transitioned to a conductive state one or more time during a sensing process, at the drain and/or source ends of the memory strings in an unselected sub-block. The transitioning can occur periodically, multiple times during the sensing process. When the select gate transistors are in a conductive state, accumulated holes in the channel can be removed. This help provide a faster decrease of the channel potential when the unselected word line voltages are ramped down at the end of the sensing process. The duration of a disturb-inducing channel gradient which is created next to the edge data memory cell is reduced so that read disturb of this cell is also reduced.

Abstract: A memory device and associated techniques for reducing read disturb of memory cells during a sensing process. Select gate transistors are transitioned to a conductive state one or more time during a sensing process, at the drain and/or source ends of the memory strings in an unselected sub-block. The transitioning can occur periodically, multiple times during the sensing process. When the select gate transistors are in a conductive state, accumulated holes in the channel can be removed. This help provide a faster decrease of the channel potential when the unselected word line voltages are ramped down at the end of the sensing process. The duration of a disturb-inducing channel gradient which is created next to the edge data memory cell is reduced so that read disturb of this cell is also reduced.

Abstract: A memory device and associated techniques for reducing read disturb of memory cells during a sensing process. The drain-end select gate transistors of unselected sub-blocks are made temporarily conductive for a time period during the ramp up of the unselected word line voltages to reduce the amount of capacitive coupling up of the respective memory string channel. This reduces a channel gradient which can exist in the memory string channels, thereby also reducing the read disturb. Further, the time period is greater when the selected word line is in a source-end or midrange subset of the word lines than when the selected word line is in a drain-end subset of the word lines. Another option involves omitting the injection disturb countermeasure, or providing a less severe injection disturb countermeasure, when the unselected sub-blocks are unprogrammed.

Abstract: A three-dimensional stacked memory device provides uniform programming speeds for a block of memory cells. The channel layers of the memory strings which are relatively close to a local interconnect of a stack are doped to account for a reduced blocking oxide thickness. Channel layers of remaining memory strings are undoped. The doping can be performing by masking the channel layers which are to remain undoped while exposing the other memory holes to a dopant. The dopant can be provided, e.g., in a carrier gas, spin on glass or other solid, or by plasma doping. An n-type dopant such as antimony, arsenic or phosphorus may be used. Heating causes the dopants to diffuse into the channel layer. Another approach deposits doped silicon for some of the channel layers and undoped silicon for other channel layers.

Abstract: A memory device and associated techniques for reducing read disturb of memory cells during a sensing process. The drain-end select gate transistors of unselected sub-blocks are made temporarily conductive for a time period during the ramp up of the unselected word line voltages to reduce the amount of capacitive coupling up of the respective memory string channel. This reduces a channel gradient which can exist in the memory string channels, thereby also reducing the read disturb. Further, the time period is greater when the selected word line is in a source-end or midrange subset of the word lines than when the selected word line is in a drain-end subset of the word lines. Another option involves omitting the injection disturb countermeasure, or providing a less severe injection disturb countermeasure, when the unselected sub-blocks are unprogrammed.

Abstract: A memory device and associated techniques for optimizing the channel boosting level in an unselected NAND string during a read operation for a selected NAND string. A tracking circuit tracks an indicator of a floating voltage of unselected word lines of a block. For example, this can include tracking a time since a last sensing operation, and determining whether a power on event has occurred without a subsequent sensing operation. In response to a read command, the indicator is used to set parameters in the read operation which can reduce disturbs. This can include setting a duration and/or a magnitude of a select gate voltage pulse during the increase of the voltage of the unselected word lines. The duration and/or a magnitude of the control gate voltage pulse can also be set based on a temperature.

Abstract: Non-volatile storage systems and method of operating non-volatile storage systems are disclosed. A crept up voltage on a memory cell control gate adjacent to a select gate is prevented, reduced, and/or discharged. In some aspects, the crept up voltage is not allowed to happen on the memory cell next to the select gate after a sensing operation. In some aspects, the voltage may creep up on the memory cell control gate after a sensing operation, but it is discharged. Reducing and/or preventing the crept up voltage may reduce the electric field between the dummy memory cell and select gate transistor. This may prevent, or at least reduce, changes in threshold voltage of the select gate transistor. Additional problems may also be solved by a reduction of the crept up voltage on the dummy memory cell control gates.

Abstract: Non-volatile storage systems and method of operating non-volatile storage systems are disclosed. A crept up voltage on a memory cell control gate adjacent to a select gate is prevented, reduced, and/or discharged. In some aspects, the crept up voltage is not allowed to happen on the memory cell next to the select gate after a sensing operation. In some aspects, the voltage may creep up on the memory cell control gate after a sensing operation, but it is discharged. Reducing and/or preventing the crept up voltage may reduce the electric field between the dummy memory cell and select gate transistor. This may prevent, or at least reduce, changes in threshold voltage of the select gate transistor. Additional problems may also be solved by a reduction of the crept up voltage on the dummy memory cell control gates.

Abstract: Techniques are provided for improving the accuracy of read operations of memory cells, where the threshold voltage (Vth) of a memory cell can shift depending on when the read operation occurs. Countermeasures are provided for a first read situation in which a memory is read after a power on event or after a long delay since a last read. Read voltages of lower or higher programmed data states are set according to a positive or negative temperature coefficient (Tco), respectively. Read voltages for error recovery can be set similarly. In another aspect, a wait period between a dummy voltage and a read voltage is a function of temperature. In another aspect, word line voltages of unselected blocks are set according to a negative Tco. In another aspect, pass voltages are set based on a Tco for each programmed data state.

Abstract: Disturbs are reduced during programming and read operations for drain-side memory cells in a string by controlling dummy word line portions separately in selected and unselected sub-blocks. One or more of the dummy word line layers are separated so that they can be driven with different voltages. This allows the channel gradient to be optimized to reduce the likelihood of disturbs. In another aspect, a stack of alternating conductive and dielectric layers is formed in two parts, with lower pillars which comprise select gate transistors, source-side dummy memory cells and data memory cells, below upper pillars which comprise drain-side dummy memory cells and select gate transistors. The upper pillars are relatively narrow to provide a more compact structure. Moreover, the centerline of some upper pillars can be offset from the centerline of corresponding lower pillars to provide room for an isolation region.

Abstract: A memory device and associated techniques for programming a select gate transistor. The programming of the select gate transistors in a NAND string is performed under similar biasing as is seen during the programming of a memory cell, when the select gate transistors are required to be in the conductive or non-conductive state for selected and unselected NAND strings, respectively. Program-verify tests for the select gate transistors use a current which flows from the source end to the drain end of the NAND string, and can be performed separately for odd- and even-numbered NAND strings, to avoid the effects of bit line-to-bit line coupling. The tests account for uneven doping in the channel of the select gate transistor. Program-verify tests for the memory cells use a current which flows from the drain end to the source end and can be performed concurrently.

Abstract: A memory system is configured to program different memory cells to different final targets for a common data state based on distance to one or more edges of a word line layer.