Abstract: An optical interference microscope system for imaging an element to be measured is provided. The optical interference microscope system includes a light source module, a beam splitter, an objective lens array module, an eyepiece array module, an imaging element, and an optical channel array module. The light source module is adapted to emit an illumination beam. The objective lens array module includes a plurality of objective lens sets. The eyepiece array module includes a plurality of eyepiece sets. The optical channel array module is connected between the eyepiece array module and the imaging element. The optical channel array module includes a plurality of optical channel structures. Each optical channel structure includes a continuous wall surface and an optical channel formed by the continuous wall surface. A central axis of each optical channel structure is coaxial with an optical axis of each eyepiece set, respectively.

Abstract: An array lens module calibration equipment includes a carrying platform, a visual positioning module, a laser alignment module, a depth-of-field measurement module, and a coplanarity adjustment module. An array lens module has an optical axis and includes a substrate, a calibration via through the substrate, a plurality of lens frames, and a plurality of lens sets. The visual positioning module is configured to provide a visual positioning beam and capture an image of an appearance to obtain appearance information. The laser alignment module is configured to provide a calibration laser beam so as to obtain alignment information. The depth-of-field measurement module is configured to capture a depth-of-field image to obtain depth-of-field information. The coplanarity adjustment module is configured to adjust relative positions of the plurality of lens frames relative to the substrate in an optical axis direction based on the appearance information, the alignment information, and the depth-of-field information.

Abstract: A microneedle electroporation device is provided, including a housing, a positioning member, an intermediate plate, a first microneedle assembly, a second microneedle assembly, a socket, a first wire, and a second wire. The positioning member is connected to the housing and the intermediate plate. The intermediate plate includes a plurality of first holes and a plurality of second holes. The first microneedle assembly includes a plurality of first microneedles and a first metal connecting portion connected to the first microneedles. The first microneedles pass through the first holes. The second microneedle assembly includes a plurality of second microneedles and a second metal connecting portion connected to the second microneedles. The second microneedles pass through the second holes. The first microneedle assembly and the second microneedle assembly are electrically independent of each other. The first wire connects the socket to the first metal connecting portion.

Abstract: A method for manufacturing high-toughness steel includes the following steps. A steel billet is provided. The steel billet is subjected to a heating step, a hot rolling step, a spheroidizing step and a quenching and tempering heat treatment step to obtain the high-toughness steel. The steel billet includes a specific proportion of composition. After the steel billet undergoes the heating step, the hot rolling step and the spheroidizing step, the obtained spheroidized steel has good processability and formability. The high-toughness steel has good hardness and impact toughness.

Abstract: Approaches for providing a non-disruptive file move are disclosed. A request to move a target file from the first constituent to the second constituent is received. The file has an associated file handle. The target file in the first constituent is converted to a multipart file in the first constituent with a file location for the new file in the first constituent. A new file is created in the second constituent. Contents of the target file are moved to a new file on the second constituent while maintaining access via the associated file handle via access to the multipart file. The target file is deleted from the first constituent.

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

Abstract: Approaches for providing a non-disruptive file move are disclosed. A request to move a target file from the first constituent to the second constituent is received. The file has an associated file handle. The target file in the first constituent is converted to a multipart file in the first constituent with a file location for the new file in the first constituent. A new file is created in the second constituent. Contents of the target file are moved to a new file on the second constituent while maintaining access via the associated file handle via access to the multipart file. The target file is deleted from the first constituent.

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: The present disclosure relates to a steel comprising 0.8 wt % to 0.87 wt % C; 1.5 wt % to 2.3 wt % Si; 0.5 wt % to 1.3 wt % Ni; a grain refining agent, selected from the group consisting of 0.08 wt % to 0.25 wt % V, 0.015 wt % to 0.04 wt % Nb, and a combination thereof; and the balance being Fe and inevitable impurities. The present disclosure further relates to a screwdriver bit made of the steel, and a method for processing the steel.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

Abstract: Approaches for providing a non-disruptive file move are disclosed. A request to move a target file from the first constituent to the second constituent is received. The file has an associated file handle. The target file in the first constituent is converted to a multipart file in the first constituent with a file location for the new file in the first constituent. A new file is created in the second constituent. Contents of the target file are moved to a new file on the second constituent while maintaining access via the associated file handle via access to the multipart file. The target file is deleted from the first constituent.

Abstract: An array objective lens module, having an optical axis and including a substrate, multiple lens frames, and multiple objective lens sets is provided. The substrate includes multiple accommodating vias. Each accommodating via includes an internal thread structure. The lens frames are respectively disposed in the accommodating vias. Each lens frame includes an external thread structure. The external thread structure is adapted to the internal thread structure. The objective lens sets are respectively disposed in the lens frames. Each objective lens set includes at least one lens, and a relative position of each frame and the substrate in an extension direction of the optical axis changes according to a relative rotation angle of the corresponding external read structure and internal thread structure.

Abstract: An array lens module calibration equipment includes a carrying platform, a visual positioning module, a laser alignment module, a depth-of-field measurement module, and a coplanarity adjustment module. An array lens module has an optical axis and includes a substrate, a calibration via through the substrate, a plurality of lens frames, and a plurality of lens sets. The visual positioning module is configured to provide a visual positioning beam and capture an image of an appearance to obtain appearance information. The laser alignment module is configured to provide a calibration laser beam so as to obtain alignment information. The depth-of-field measurement module is configured to capture a depth-of-field image to obtain depth-of-field information. The coplanarity adjustment module is configured to adjust relative positions of the plurality of lens frames relative to the substrate in an optical axis direction based on the appearance information, the alignment information, and the depth-of-field information.

Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: Methods, non-transitory machine readable media, and computing devices that more efficiently and effectively manage storage quota enforcement are disclosed. With this technology, a quota ticket comprising a tally generation number (TGN) and a local allowed usage amount (AUA) are obtained. The local AUA comprises a portion of a global AUA associated with a quota rule. The local AUA is increased following receipt of another portion of the global AUA in a response from a cluster peer, when another TGN in the response matches the TGN and the local AUA is insufficient to execute a received storage operation associated with the quota rule. The local AUA is decreased by an amount corresponding to, and following execution of, the storage operation, when the increased local AUA is sufficient to execute the storage operation.

Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.

Abstract: An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.