Abstract: The present disclosure provides an array substrate, a manufacturing method thereof, a flexible display panel and a display device, for achieving frame-free full-screen flexible display product. The array substrate provided in the present disclosure comprises a flexible base substrate, a thin film transistor on a first surface of the flexible base substrate, and a wiring terminal for transmitting a signal to an electrode of the thin film transistor on a second surface of the flexible base substrate opposite to the first surface, wherein the electrode of the thin film transistor is electrically connected to the wiring terminal through a via hole penetrating the flexible base substrate.

Abstract: The present disclosure provides a detection device for Micro-LED and a method manufacturing thereof, and a detection apparatus for Micro-LED, and the detection device for Micro-LED comprises: a substrate, and a first via and a second via penetrating through the substrate; the substrate comprises a first surface and a second surface which are opposite to each other; the first via and the second via are respectively arranged corresponding to a first pole and a second pole of a Micro-LED to be detected, and the detection device for Micro-LED further comprises: a first detection component and a second detection component on the first surface of the substrate.

Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.

Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.

Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.

Abstract: Provided are a display structure and a preparation method thereof, and a display apparatus. The display structure includes a flexible back plate and a display substrate which are stacked, the flexible back plate including a bonding electrode for bonding to an integrated circuit chip, and the flexible back plate being bent to form a bent portion on which the bonding electrode is located.

Abstract: A display substrate includes a drive substrate and a welding pad provided on the drive substrate and electrically connected with the drive substrate. The display substrate further includes an insulating construction layer provided on the welding pad. The insulating construction layer is provided with a groove for exposing the welding pad. A bonding material is accommodated in the groove, and a micro light emitting diode is electrically connected with the welding pad through the bonding material.

Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.

Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.

Abstract: This disclosure discloses a production method of a thin-film transistor, a thin-film transistor, a display apparatus, and a fingerprint recognition unit. Said method comprises the steps of: sequentially depositing a metal layer and an indium zinc oxide layer as a protective layer on a substrate; etching the metal layer and the indium zinc oxide layer to form a first electrode and a second electrode of a photosensitive device; and forming a photoelectric semiconductor of the photosensitive device on the first electrode.

Abstract: The present disclosure provides an array substrate, a method for manufacturing the array substrate and a display device. The array substrate includes a base substrate and a signal line provided in a display region at a first side of the base substrate, an electrode is provided at a second side of the base substrate, the second side of the base substrate is opposite to the first side of the base substrate, a via-hole penetrating through the base substrate is provided at a position of the base substrate at which the electrode is provided, a connecting electrode is provided in the via-hole, and the signal line is electrically connected to the electrode provided at the second side of the base substrate through the connecting electrode.

Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.

Abstract: A display apparatus is provided, which includes a rigid substrate; a first carrier plate provided on a first surface of the rigid substrate; a first substrate provided on the first carrier plate, the first substrate including a thin film transistor with a drain; a light emitting assembly provided on a second surface of the rigid substrate distal to the first surface, the light emitting assembly including an anode and a light emitting layer provided successively along a direction distal to the rigid substrate; and a via hole provided penetrating the rigid substrate and the first carrier plate, the anode electrically coupled to the drain through the via hole. In the display apparatus of the present disclosure the light emitting assembly is separated from the array substrate such that when the light emitting assembly or the first substrate suffers from failure, it can be replaced easily.

Abstract: The present disclosure provides a display panel, its manufacturing method and a display device. The manufacturing method of the display panel comprises: forming, on a substrate, a thin film transistor comprising a gate electrode, an active layer, a source electrode and a drain electrode; forming a hydrogen diffusion barrier layer that covers the entire substrate, wherein the hydrogen diffusion barrier layer is electrically conductive and is electrically connected to the drain electrode; and forming a photosensitive structure layer on the hydrogen diffusion barrier layer.

Abstract: A photosensitive element includes a first film layer, a second film layer and a third film layer. The first film layer, the second film layer and the third film layer are in a sequentially stacked structure, the first film layer is a p-type copper indium gallium selenide (CIGS) layer, the second film layer is an i-type CIGS layer, and the third film layer is an n-type film layer, and the first film layer, the second film layer and the third film layer form a PIN junction structure.

Abstract: A fingerprint identification sensor, a fingerprint identification method and an electronic device are disclosed. The fingerprint identification sensor includes a substrate; a fingerprint sensing element disposed on the substrate and including a thin film transistor, an off-state leakage current of the thin film transistor varying with the intensity of light irradiating onto an active area thereof; and a fingerprint identification light source arranged to emit light that irradiates onto a finger and is reflected thereby, the reflected light irradiating onto the active area of the thin film transistor. Thus, the fingerprint identification can be realized conveniently, and the fingerprint identification sensor has at least one of the advantages like high sensitivity and simple structure.

Abstract: The present disclosure provides a display screen including a display panel and a backside concave lens array located on a backside of the display panel, wherein the backside is a side of the display panel away from a display side; the display panel comprises a plurality of transparent regions; the backside concave lens array comprises a plurality of backside concave lenses, and each of the plurality of backside concave lenses is corresponding to one of the transparent regions; each of the plurality of backside concave lenses comprises at least one concave surface, and one of the at least one concave surface is disposed away from the display panel.