Abstract: An optical fiber module has a package housing having an internal space defined by a base plate, a side wall, and a cover member, a laser device disposed on the base plate within the internal space, an optical fiber that transmits a laser beam emitted from the laser device to an outside of the package housing, a light scattering member that scatters light having a wavelength of the laser beam and covers an outer circumferential surface of the projecting end of the optical fiber, and a heat dissipation portion disposed on the base plate. The optical fiber has a projecting end projecting from an inner surface of the side wall toward the internal space. The heat dissipation portion covers a portion of an outer circumferential surface of the light scattering member and exposes another portion of the outer circumferential surface of the light scattering member to the internal space.

Abstract: The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).

Abstract: A multiplexer includes: an output section outputting a beam bundle made of a plurality of laser beams whose F-axis directions are aligned; and an F-axis converging lens causing the beam bundle outputted from the output section to be converged in the F-axis direction. Optical axes of the plurality of laser beams constituting the beam bundle outputted from the output section intersect with each other at a single point without relying on the F-axis converging lens.

Abstract: A laser module includes: a bottom plate of a box; the frame member being fixed to the bottom plate; a pipe member including a hollow portion PH communicating with the through hole OP of a box, the pipe member being fixed to the outer wall of the frame member; an optical fiber held on the hollow portion PH of the pipe member; and a laser element accommodated in the internal space of the box, the optical axis of the laser element being aligned with the optical axis of the optical fiber. When the bottom plate is placed on a plane, the bottom face of the pipe member is on the same face as a bottom plate portion contacting the plane.

Abstract: A laser module includes: a bottom plate of a box; the frame member being fixed to the bottom plate; a pipe member including a hollow portion PH communicating with the through hole OP of a box, the pipe member being fixed to the outer wall of the frame member; an optical fiber held on the hollow portion PH of the pipe member; and a laser element accommodated in the internal space of the box, the optical axis of the laser element being aligned with the optical axis of the optical fiber. When the bottom plate is placed on a plane, the bottom face of the pipe member is on the same face as a bottom plate portion contacting the plane.

Abstract: A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).

Abstract: A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S?) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.

Abstract: The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

Abstract: The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

Abstract: A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

Abstract: A laser device includes: a semiconductor laser element having an output surface; an optical fiber having a leading end portion facing the output surface of the semiconductor laser element; and an optical fiber supporting member for supporting the optical fiber, the optical fiber supporting member being made from a non heat insulating material and having a bonding pad to which the optical fiber is fixed by use of solder. The optical fiber supporting member includes a contact portion thermally in contact with a base. The bonding pad is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber is fixed to the bonding pad is sandwiched between the bonding pad and the base and (ii) separated spatially from the base.