Abstract: A substrate processing system includes a laser processing apparatus including a holder and a radiation unit, the holder being configured to hold a substrate including a base substrate, an irregularity pattern formed on a main surface of the base substrate, and an irregularity layer formed along the irregularity pattern, the radiation unit being configured to radiate a laser beam to a protrusion of the irregularity layer to flatten the irregularity layer by removing the protrusion in a state that the substrate is held by the holder; a controller configured to control a position of an irradiation point of the laser beam; and a polishing apparatus configured to polish the irregularity layer in which the protrusion is removed with the laser beam to be flattened.

Abstract: A processing apparatus configured to process a processing target object includes a modifying device configured to radiate laser light to an inside of the processing target object to form multiple modification layers along a plane direction; and a controller configured to control an operation of the modifying device at least. The controller controls the modifying device to form, in the forming of the modification layers, a first modification layer formation region in which cracks that develop from neighboring modification layers along the plane direction are not connected, and also controls the modifying device to form, in the forming of the modification layers, a second modification layer formation region in which cracks that develop from neighboring modification layers along the plane direction are connected.

Abstract: In forming modification layers by radiating laser light to an inside of a processing target object from a modifying device periodically while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and by moving the modifying device relative to the holder in a diametrical direction by a moving mechanism, a boundary position of the laser light in the diametrical direction is calculated, the boundary position being a position where a circumferential distance between the modification layers becomes a required threshold value, and a diametrical distance between the modification layers is reduced in a moving direction of the modifying device from the boundary position and/or a frequency of the laser light is reduced.

Abstract: A bat, which has a hollow barrel and an internal assembly configured to resist deformation of the hollow barrel, is disclosed. The internal assembly includes multiple rods disposed longitudinally within the hollow barrel. The internal assembly can include a deformable ring having a substantially circular outer wall having a diameter less than an inner diameter of the hollow barrel and multiple holes, with each hole configured to at least partially receive a rod of the multiple rods. The bat can have an end cap including end cap holes extending partially through the end cap, with each end cap hole configured to at least partially receive a rod.

Abstract: A bat includes a ball hitting portion. The ball hitting portion includes a plurality of fiber-reinforced resin layers stacked in a radial direction relative to a center axis of the ball hitting portion. The plurality of fiber-reinforced resin layers include a first fiber-reinforced resin layer disposed at an outermost circumference in the radial direction among the plurality of fiber-reinforced resin layers. The first fiber-reinforced resin layer has a plurality of first fiber bundles and a plurality of second fiber bundles. The plurality of first fiber bundles are disposed side by side in a short side direction of each of the plurality of first fiber bundles. The plurality of second fiber bundles are disposed side by side in a short side direction of each of the plurality of second fiber bundles. The plurality of first fiber bundles and the plurality of second fiber bundles are woven across one another.

Abstract: A wafer processing method includes a protective member laying step of placing a protective member on a face side of a wafer, a reverse side grinding step of grinding a reverse side of the wafer to thin the wafer, a cut groove forming step of positioning a cutting blade in alignment with projected dicing lines one at a time on the reverse side of the wafer, cutting the wafer with the cutting blade to form cut grooves in the wafer which terminate short of the face side thereof, and a cutting step of applying a laser beam to the wafer from the reverse side thereof along the cut grooves to completely sever the wafer along the projected dicing lines into individual device chips.

Abstract: A bat, which has a hollow barrel and an internal assembly configured to resist deformation of the hollow barrel, is disclosed. The internal assembly includes multiple rods disposed longitudinally within the hollow barrel. The internal assembly can include a deformable ring having a substantially circular outer wall having a diameter less than an inner diameter of the hollow barrel and multiple holes, with each hole configured to at least partially receive a rod of the multiple rods. The bat can have an end cap including end cap holes extending partially through the end cap, with each end cap hole configured to at least partially receive a rod.

Abstract: Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.

Abstract: A bat, which can have a hollow barrel and an internal assembly configured to resist deformation of the hollow barrel, is disclosed. The internal assembly can include multiple rods disposed longitudinally within the hollow barrel. The internal assembly can include a deformable ring having a substantially circular outer wall having a diameter less than an inner diameter of the hollow barrel and multiple holes, with each hole configured to at least partially receive a rod. The bat can have an end cap including end cap holes extending partially through the end cap, with each end cap hole configured to at least partially receive a rod.

Abstract: A softball or baseball bat with modified restitution characteristic is provided. The bat can comprise a substantially rigid core coupled with a single or multi-piece sleeve. The core can comprise a tip end, a barrel portion, a handle taper, and a handle. A sleeve assembly can be disposed over the barrel portion, and the sleeve assembly can comprise one or more materials capable of impact absorption. The sleeve assembly can include a ring portion positioned about a circumference of the barrel portion, an outer sleeve, and an inner sleeve disposed between the outer sleeve and the barrel portion.

Abstract: A bat according to the present disclosure includes a ball hitting portion, a grip portion, a tapered portion that connects the ball hitting portion and the grip portion together, and a restriction member. The ball hitting portion is internally hollowed. The restriction member is disposed inside the ball hitting portion. The restriction member is in the form of a ring. The restriction member is disposed such that a radial direction thereof is transverse to a longitudinal direction of the ball hitting portion.

Abstract: A softball or baseball bat is provided. The bat can comprise a handle that has a proximate end and a distal end and a barrel that has a hollow portion. The bat can comprise first damping section that comprises a first material, and the first damping section can be at least partially interposed between a portion of the handle and a portion of an inner wall of the barrel. The bat can comprise a second damping section that can comprise a second material, and the second damping section can be at least partially interposed between a portion of the handle and a portion of the inner wall of the barrel. At least a portion of the first damping section or the second damping section can prevent the handle from directly contacting the barrel when the bat is at rest.

Abstract: A softball or baseball bat with modified restitution characteristic is provided. The bat can comprise a substantially rigid core coupled with a single or multi-piece sleeve. The core can comprise a tip end, a barrel taper, a handle taper, and a handle. The sleeve can slide over the handle portion and can be pressed, molded, or adhered to the barrel taper. The resilient sleeve can be sized and shaped such that the sleeve portion is substantially the same diameter as the tip end. The sleeve can comprise a material capable of impact absorption. The sleeve can have a composite structure with inner and outer sleeve components. The sleeve can further comprise a cone to taper the sleeve in the handle taper portion of the bat. The material and thickness of the sleeve and the core can be varied to meet applicable restitution requirements.

Abstract: A bat according to the present disclosure includes a ball hitting portion, a grip portion, a tapered portion that connects the ball hitting portion and the grip portion together, and a restriction member. The ball hitting portion is internally hollowed. The restriction member is disposed inside the ball hitting portion. The restriction member is in the form of a ring. The restriction member is disposed such that a radial direction thereof is transverse to a longitudinal direction of the ball hitting portion.

Abstract: A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.

Abstract: Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.

Abstract: A wafer processing method includes a protective member laying step of placing a protective member on a face side of a wafer, a reverse side grinding step of grinding a reverse side of the wafer to thin the wafer, a cut groove forming step of positioning a cutting blade in alignment with projected dicing lines one at a time on the reverse side of the wafer, cutting the wafer with the cutting blade to form cut grooves in the wafer which terminate short of the face side thereof, and a cutting step of applying a laser beam to the wafer from the reverse side thereof along the cut grooves to completely sever the wafer along the projected dicing lines into individual device chips.

Abstract: A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.

Abstract: A laser beam is applied to the front side of a wafer along division lines, to form grooves having a depth corresponding to a finished thickness of device chips. Molding resin is laid on the front side of the wafer and embedded in the grooves. A protective member is attached to a front side of the molding resin, and a back side of the wafer is ground to expose the grooves and to expose the molding resin embedded in the grooves on the back side of the wafer. The wafer is divided along the grooves by a cutting blade having a thickness smaller than the width of the grooves, a central portion in a width direction of the molding resin being exposed along the grooves, thereby dividing the wafer into individual device chips each having a periphery surrounded with the molding resin.

Abstract: A softball or baseball bat with modified restitution characteristic is provided. The bat can comprise a substantially rigid core coupled with a single or multi-piece sleeve. The core can comprise a tip end, a barrel portion, a handle taper, and a handle. A sleeve assembly can be disposed over the barrel portion, and the sleeve assembly can comprise one or more materials capable of impact absorption. The sleeve assembly can include a ring portion positioned about a circumference of the barrel portion, an outer sleeve, and an inner sleeve disposed between the outer sleeve and the barrel portion.