Abstract: A spectral characteristic obtaining apparatus includes a detection unit detecting light quantities in plural wavelength bands from a measurement target, a storage unit storing pre-obtained spectral characteristics of the measurement target, a calculation unit calculating a primary transformation matrix from the light quantities and the pre-obtained spectral characteristics of at least one reference sample and a secondary transformation matrix from one of the pre-obtained spectral characteristics corresponding to a primary wavelength band and another one of the pre-obtained spectral characteristics corresponding to a secondary wavelength band, an estimation unit estimating the spectral characteristics of the measurement target by performing a primary estimation on the light quantities in the plural wavelength bands by using the primary transformation matrix, performing a secondary estimation on a result of the primary estimation by using the secondary transformation matrix, and compositing a result of the seco

Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract: A spectral characteristic acquisition device includes a member configured to have a plurality of openings arrayed in a predetermined direction, each of the plurality of openings inclined with respect to the predetermined direction, the plurality of openings being configured to pass light beams from a plurality of positions on an object therethrough, a spectrally dispersing part configured to spectrally disperse the light beams having passed through the plurality of openings in a direction orthogonal to the predetermined direction, and a plurality of one-dimensional image capturing parts provided at a predetermined interval in a plurality of lines and configured to be irradiated with the light beams having been spectrally dispersed by the spectrally dispersing part, a plurality of pixels of the plurality of one-dimensional image capturing parts being arrayed in a direction parallel to the predetermined direction.

Abstract: A spectral characteristic acquiring apparatus is provided which includes: an area dividing part; a spectrum separating part; a light receiving part; and a calculating part, wherein the calculating part includes a transformation matrix storing part that stores a transformation matrix used for calculating the spectral characteristic corresponding to electrical signals of a first diffraction pattern group including two or more adjacent diffraction patterns, and a spectral characteristic calculating part that calculates, based on the electrical signals of the first diffraction pattern group and the corresponding transformation matrix, the spectral characteristic at the locations of the image carrying medium corresponding to the apertures of the first diffraction pattern group.

Abstract: A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

Abstract: A spectrometer includes a light source to project a light beam to a target object, a spectral element to disperse the light beam reflected by the target object and including a diffraction element to diffract the light beam, and a light receiving element to receive, at pixels, light beams with different spectral characteristics from each other dispersed by the spectral element, wherein the diffraction element and the light receiving element are integrally formed.

Abstract: A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

Abstract: A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.

Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract: A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

Abstract: Spectral characteristics of an object is estimated using an extended sensor response, which includes a product of at least two light intensity signals whose wavelength ranges are partially overlapped with each other.

Abstract: A spectral characteristic measuring device includes an illuminating unit that illuminates a medium; a light dividing unit that divides reflection light from the medium into reflection light beams; a first imaging unit that includes first lenses and second lenses arranged alternately in a staggered pattern and focuses the respective reflection light beams; a diffraction unit that includes a first diffraction region and a second diffraction region and diffracts the focused reflection light beams to form diffraction images; and a light receiving unit that includes plural pixels for receiving the diffraction images. The reflection light beams focused by the first lenses enter the first diffraction region to form first diffraction images, the reflection light beams focused by the second lenses enter the second diffraction region to form second diffraction images, and the first and second diffraction images are arranged alternately on the light receiving unit in a pixel arrangement direction.

Abstract: A spectrometer includes a light source to project a light beam to a target object, a spectral element to disperse the light beam reflected by the target object and including a diffraction element to diffract the light beam, and a light receiving element to receive, at pixels, light beams with different spectral characteristics from each other dispersed by the spectral element, wherein the diffraction element and the light receiving element are integrally formed.

Abstract: A spectrometer includes a light source to project a light beam to a target object, an optical element including a plurality of apertures through which the light beam reflected by the target object transmits, a diffraction element to form diffracted images from a plurality of light beams having transmitted through the optical element, and a light receiving element to receive the diffracted images formed by the diffraction element and including an optical shield to block a diffracted image other than a certain-order diffracted image.

Abstract: A spectral characteristic obtaining apparatus includes a detection unit detecting light quantities in plural wavelength bands from a measurement target, a storage unit storing pre-obtained spectral characteristics of the measurement target, a calculation unit calculating a primary transformation matrix from the light quantities and the pre-obtained spectral characteristics of at least one reference sample and a secondary transformation matrix from one of the pre-obtained spectral characteristics corresponding to a primary wavelength band and another one of the pre-obtained spectral characteristics corresponding to a secondary wavelength band, an estimation unit estimating the spectral characteristics of the measurement target by performing a primary estimation on the light quantities in the plural wavelength bands by using the primary transformation matrix, performing a secondary estimation on a result of the primary estimation by using the secondary transformation matrix, and compositing a result of the seco

Abstract: A spectral characteristic measuring device includes an illuminating unit that illuminates a medium; a light dividing unit that divides reflection light from the medium into reflection light beams; a first imaging unit that includes first lenses and second lenses arranged alternately in a staggered pattern and focuses the respective reflection light beams; a diffraction unit that includes a first diffraction region and a second diffraction region and diffracts the focused reflection light beams to form diffraction images; and a light receiving unit that includes plural pixels for receiving the diffraction images. The reflection light beams focused by the first lenses enter the first diffraction region to form first diffraction images, the reflection light beams focused by the second lenses enter the second diffraction region to form second diffraction images, and the first and second diffraction images are arranged alternately on the light receiving unit in a pixel arrangement direction.

Abstract: A spectroscopic characteristics acquisition unit includes a light emitting unit to illuminate a measurement target; a lens array including lenses to receive reflected light reflected from the measurement target; a light blocking member having a pinhole array including openings; a focusing unit to focus light coming from the pinhole array; a diffraction unit to diffract the light to different directions depending on wavelength of light received by the focusing unit; and a light receiving unit to receive the reflected light diffracted by the diffraction unit. The light receiving unit includes a spectroscopic sensor array having spectroscopy sensors including pixels. Each of the lenses constituting the lens array corresponds to one of the openings of the pinhole array. The numerical aperture NA of the lens in the arrangement direction in the lens array satisfies the formula NA>sin(?max) with respect to the maximum angle of view ?max of the focusing unit.

Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract: A spectral characteristic acquiring apparatus is provided which includes: an area dividing part; a spectrum separating part; a light receiving part; and a calculating part, wherein the calculating part includes a transformation matrix storing part that stores a transformation matrix used for calculating the spectral characteristic corresponding to electrical signals of a first diffraction pattern group including two or more adjacent diffraction patterns, and a spectral characteristic calculating part that calculates, based on the electrical signals of the first diffraction pattern group and the corresponding transformation matrix, the spectral characteristic at the locations of the image carrying medium corresponding to the apertures of the first diffraction pattern group.

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.