Abstract: A MEMS device which includes an adhesive which adheres a first substrate and a second substrate to each other, in which a first space which includes an electrode, an individual electrode, a common electrode, a bump electrode, and a piezoelectric element and which is configured as a closed space which is isolated from an atmosphere by the first substrate, the second substrate, and the adhesive is disposed in a space between the first substrate and the second substrate, and in which a second space which does not include any of the electrode, the individual electrode, the common electrode, the bump electrode, or the piezoelectric element and which communicates with the atmosphere due to a through-hole which penetrates at least one of the first substrate and the second substrate is disposed in the space between the first substrate and the second substrate.

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed in a first direction; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element; and an adhesive agent that bonds the pressure chamber-forming plate and the circuit board, wherein an element end on at least one side of the piezoelectric element is formed outside of the defining region and covered by the adhesive agent in a second direction orthogonal to

Abstract: A piezoelectric device including a pressure chamber, a piezoelectric element, and a vibration plate, in which the piezoelectric element is provided with a first electrode, a second electrode, and a piezoelectric layer, the vibration plate has a first portion overlapping the piezoelectric element and a second portion having a thickness smaller than that of the first portion and overlapping an inner peripheral surface of a side wall of the pressure chamber, a side surface of the piezoelectric element which intersects the vibration plate has a first surface inclined at a first angle, the vibration plate has a second surface, between the first portion and the second portion, inclined at a second angle smaller than the first angle, and an end portion of the second surface on the side wall side of the pressure chamber overlaps the side wall of the pressure chamber.

Abstract: A liquid ejecting head includes a pressure chamber formation substrate provided with pressure chambers that are disposed side by side and that communicate with nozzles that discharge a liquid, a nozzle plate provided with the nozzles, and a flow path formation substrate provided between the pressure chamber formation substrate and the nozzle plate. The flow path formation substrate has a plurality of individual communication paths that supply the liquid to the pressure chambers disposed side by side, a common liquid chamber that communicates with the pressure chambers, a liquid introduction port that introduces the liquid into the common liquid chamber, and a flow path of the liquid from the liquid introduction port toward the individual communication paths.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; and a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element, wherein the first electrode layer is formed independently for each piezoelectric element, the second electrode layer is formed continuously across the plurality of piezoelectric elements, and at least part of the bump electrodes is electrically connected with the first electrode layer and t

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Abstract: A manufacturing method of a head which includes a channel formation substrate having two piezoelectric actuator rows formed thereon, a driving circuit, and a driving circuit board which is provided with a first bump and a second bump. In the method, a piezo element is formed and the first bump is formed on the outside of the piezoelectric actuator row, on the driving circuit board, an adhesive layer is provided on both sides of the first bump and the second bump, a first through hole and a second through hole are formed on the driving circuit board, a first connection wiring and a second connection wiring which are connected to the driving circuit are formed, and a first electrode of the piezoelectric actuator is electrically connected to the first connection wiring via the first bump and a second electrode is electrically connected to the second connection wiring via the second bump.

Abstract: There is provided a method of manufacturing a liquid ejecting head that includes a communication substrate on which a pressure chamber substrate in which a pressure chamber communicating with a nozzle is formed is stacked. The communication substrate has a concave portion that forms a common liquid chamber that communicates with a plurality of the pressure chambers, a first hole portion constituting a nozzle-side communication flow channel, a second hole portion constituting a supply-side communication flow channel, and a third hole portion constituting an opening portion communicating with the common liquid chamber. The method includes forming a mask layer for forming the concave portion and the first to third hole portions that communicate with the concave portion, forming a preliminary hole in each of the first to the third hole portions, anisotropically etching the concave portion and the first to third hole portions, and removing the mask layer.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: A piezoelectric device includes a supporting body, a supporting layer that is stacked on the supporting body, a first electrode that is formed on a side opposite to the supporting body side of the supporting layer, a piezoelectric body that is formed on a side opposite to the supporting layer side of the first electrode, and a second electrode that is formed on a side opposite to the first electrode side of the piezoelectric body, in which the piezoelectric body is formed throughout an area covering the first electrode, the second electrode is formed throughout an area covering the piezoelectric body, and a recess portion which is recessed toward the supporting body is formed outside an area overlapping with the first electrode in the supporting layer.

Abstract: A flow path forming substrate has a pressure generation chamber communicating with a nozzle opening; and a communication plate having a supply path communicating with a manifold common to and communicating with the pressure generation chamber. A recess of the manifold opens opposite to the flow path forming substrate. The recess has a first recess, and a second recess deeper than the first recess. Supply paths are open on a bottom surface of the first recess, and are arranged in a first direction between the first and second recesses. An inclined surface inclined toward the bottom surface of the second recess from the bottom surface of the first recess is provided along the first direction. The inclined surface is configured as alternately repeated first and second inclined surfaces with different angles. A pitch of adjacent second inclined surfaces is smaller than a pitch of adjacent supply paths.

Abstract: A liquid ejecting apparatus may include a flow path forming substrate in which a pressure generation chamber which communicates with a nozzle opening that discharges liquid is formed and a communication plate which has a supply path that communicates with a manifold. A recess portion which configures at least a part of the manifold is open on a side opposite to the flow path forming substrate, on the communication plate. The supply path includes a discharge supply path which communicates with a discharge pressure generation chamber that discharges liquid from the nozzle opening, and a dummy supply path which communicates with a dummy pressure generation chamber that does not discharge liquid from the nozzle opening.

Abstract: Provided are a vibrating plate, a first electrode provided over the vibrating plate, a piezoelectric layer provided over the first electrode, and a second electrode provided over the piezoelectric layer are provided. The piezoelectric layer is interposed between the first electrode and the second electrode. The piezoelectric layer includes an active portion of which at least one end portion is defined by the first electrode, and a non-active portion provided on an outside of the end portion of the first electrode for defining the active portion. The vibrating plate includes a first vibration portion under the non-active portion and a second vibration portion on an outside of the first vibration portion. The second vibration portion includes a taper part having the thickness which is increased toward the first vibration portion.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: A MEMS device includes a first substrate and a second substrate that is disposed laminated on the first substrate and has a piezoelectric element on the first substrate side, in which the first substrate and the second substrate are substantially the same size, and in planar view, an end of the first substrate and an end of the second substrate are disposed at substantially the same position.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a plurality of individual electrodes disposed for each of the piezoelectric elements, and a common electrodes common to the plurality of piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion that partially covers the core portion, a common wiring portion that partially covers the core portion, and an auxiliary wiring disposed in a groove portion disposed on a first principal surface on the side opposite to the actuator substrate or on a second principal surface on the actuator substrate side. The auxiliary wiring is electrically connected to the common wiring portion.

Abstract: A piezoelectric device includes an actuator substrate that includes two rows of piezoelectric element rows piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include individual electrodes disposed for each of the piezoelectric elements, and a common electrode common to the piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion, and a common wiring portion disposed for each of the piezoelectric element rows that partially covers the core portion. The two rows of piezoelectric element rows are respectively disposed so as to interpose the core portion. The individual wiring portion and the common wiring portion are respectively electrically connected to the individual electrode and the common electrode.

Abstract: A head including a channel formation substrate is provided with a pressure generating chamber which communicates with a nozzle for ejecting a liquid; a piezo element includes a first electrode which is provided on one surface side of a channel formation substrate, a piezoelectric layer is provided on the first electrode, and a second electrode is provided on the piezoelectric layer; and a driving circuit board is bonded to the one surface side of the channel formation substrate via an adhesive layer, and is provided with a driving circuit for driving the piezo element, in which the piezo element and the driving circuit are electrically connected to each other via a bump which is provided on any one of the channel formation substrate and the driving circuit board, and in which the bump and the adhesive layer are provided above the piezoelectric layer of the piezo element.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.