Patents by Inventor Yoichi Ueda

Yoichi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200403015
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Applicant: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Patent number: 10818722
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: October 27, 2020
    Assignee: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20200286937
    Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 10, 2020
    Applicant: SONY CORPORATION
    Inventors: Hideyuki HONDA, Tetsuya UCHIDA, Toshifumi WAKANO, Yusuke TANAKA, Yoshiharu KUDOH, Hirotoshi NOMURA, Tomoyuki HIRANO, Shinichi YOSHIDA, Yoichi UEDA, Kosuke NAKANISHI
  • Patent number: 10700114
    Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: June 30, 2020
    Assignee: Sony Corporation
    Inventors: Hideyuki Honda, Tetsuya Uchida, Toshifumi Wakano, Yusuke Tanaka, Yoshiharu Kudoh, Hirotoshi Nomura, Tomoyuki Hirano, Shinichi Yoshida, Yoichi Ueda, Kosuke Nakanishi
  • Publication number: 20200131656
    Abstract: A production method of aluminum including: a step of synthesizing an aluminum compound from a mixture including a halogenated aluminum hydrate and a perfluoroalkylsulfonimide-type or perfluoroalkylsulfonamide-type ionic liquid represented by general formula (1); a step of dissolving the aluminum compound in a nitrile-based organic solvent to prepare an aluminum electrolyte; a step of adding at least one ligand selected from a phosphorus compound and an organic compound having an amide group to the aluminum electrolyte and dehydrating water molecules from a hydrate included in the aluminum electrolyte; and a step of electrodepositing aluminum on a cathode by allowing electricity to pass between an anode and the cathode in the aluminum electrolyte after the dehydrating step.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 30, 2020
    Applicant: UACJ CORPORATION
    Inventors: Junji NUNOMURA, Yoichi KOJIMA, Mikito UEDA
  • Publication number: 20200083262
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device for reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: HIROSHI TAYANAKA, KENTARO AKIYAMA, YORITO SAKANO, TAKASHI OINOUE, YOSHIYA HAGIMOTO, YUSUKE MATSUMURA, NAOYUKI SATO, YUKI MIYANAMI, YOICHI UEDA, RYOSUKE MATSUMOTO
  • Publication number: 20200020306
    Abstract: Provided are an image processing apparatus, a program and an image processing method capable of avoiding interference with the function of another program. An image processing apparatus includes a position information detection unit configured to detect position information indicating a position on a display, a region position setting unit configured to set the position of the region of interest on the display based on the position information, and an image processing unit configured to perform image process on at least one image among an image inside of the region of interest and an image outside of the region of interest. The region position setting unit, when the position information is changed with the image process, sets the position of the region of interest based on the position information immediately before the change.
    Type: Application
    Filed: January 10, 2018
    Publication date: January 16, 2020
    Applicant: EIZO Corporation
    Inventors: Yuji HARUKI, Ikumi ARAI, Naoaki HIRATA, Yoichi UEDA, Tomoharu YACHIKAMI
  • Patent number: 10515988
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes a photoelectric conversion unit, a charge holding unit for holding charges transferred from the photoelectric conversion unit, a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit, and a light blocking part including a first light blocking part and a second light blocking part. The first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: December 24, 2019
    Assignee: SONY CORPORATION
    Inventors: Hiroshi Tayanaka, Kentaro Akiyama, Yorito Sakano, Takashi Oinoue, Yoshiya Hagimoto, Yusuke Matsumura, Naoyuki Sato, Yuki Miyanami, Yoichi Ueda, Ryosuke Matsumoto
  • Publication number: 20190341418
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Application
    Filed: July 12, 2019
    Publication date: November 7, 2019
    Applicant: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20190330752
    Abstract: A method for producing aluminum includes: a dissolution step of dissolving a hydrate containing Al in water to prepare an aqueous solution that contains Al ions; an extraction step of bringing an organic phase that is composed of an extractant into contact with an aqueous phase that is composed of the aqueous solution to extract the Al ions in the aqueous phase into the organic phase; and an electrodeposition step of electrolyzing the organic phase as an electrolytic solution to electrodeposit metallic Al onto a surface of a cathode from the Al ions in the electrolytic solution.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 31, 2019
    Applicant: UACJ CORPORATION
    Inventors: Junji Nunomura, Yukio Honkawa, Yoichi Kojima, Mikito Ueda
  • Patent number: 10367027
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: July 30, 2019
    Assignee: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20190139702
    Abstract: An irreversible circuit element that can reduce manufacturing costs by preventing faults that lead to product defects includes a magnetic body, a magnetic body securing casing, and a magnet. The magnetic body securing casing is arranged so as to surround the magnetic body. The magnet is arranged on one side of the magnetic body. The magnetic body securing casing includes a first electrode on one casing main surface arranged on the one side, a second electrode on the other casing main surface arranged on the other side opposite to the one side, and a through-conductor that passes through the magnetic body securing casing and electrically connects the first electrode to the second electrode. The first electrode is connected to a first wiring arranged on the one side of the magnetic body.
    Type: Application
    Filed: November 4, 2016
    Publication date: May 9, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yoichi KITAMURA, Tetsuya UEDA, Hironobu SHIBATA, Yukinobu TARUI
  • Publication number: 20190043901
    Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.
    Type: Application
    Filed: April 11, 2017
    Publication date: February 7, 2019
    Inventors: Hideyuki HONDA, Tetsuya UCHIDA, Toshifumi WAKANO, Yusuke TANAKA, Yoshiharu KUDOH, Hirotoshi NOMURA, Tomoyuki HIRANO, Shinichi YOSHIDA, Yoichi UEDA, Kosuke NAKANISHI
  • Patent number: 9960202
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: May 1, 2018
    Assignee: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20180047776
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Application
    Filed: October 5, 2017
    Publication date: February 15, 2018
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20180033809
    Abstract: The present technology relates to a solid-state image sensing device and an electronic device capable of reducing noises. The solid-state image sensing device includes: a photoelectric conversion unit; a charge holding unit for holding charges transferred from the photoelectric conversion unit; a first transfer transistor for transferring charges from the photoelectric conversion unit to the charge holding unit; and a light blocking part including a first light blocking part and a second light blocking part, in which the first light blocking part is arranged between a second surface opposite to a first surface as a light receiving surface of the photoelectric conversion unit and the charge holding unit, and covers the second surface, and is formed with a first opening, and the second light blocking part surrounds the side surface of the photoelectric conversion unit. The present technology is applicable to solid-state image sensing devices of backside irradiation type, for example.
    Type: Application
    Filed: February 12, 2016
    Publication date: February 1, 2018
    Inventors: Hiroshi TAYANAKA, Kentaro AKIYAMA, Yorito SAKANO, Takashi OINOUE, Yoshiya HAGIMOTO, Yusuke MATSUMURA, Naoyuki SATO, Yuki MIYANAMI, Yoichi UEDA, Ryosuke MATSUMOTO
  • Publication number: 20170084659
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Application
    Filed: December 6, 2016
    Publication date: March 23, 2017
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Patent number: 9548326
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: January 17, 2017
    Assignee: Sony Corporation
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Publication number: 20160126273
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Application
    Filed: January 12, 2016
    Publication date: May 5, 2016
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda
  • Patent number: 9276032
    Abstract: Disclosed is a solid-state imaging device including a plurality of pixels and a plurality of on-chip lenses. The plurality of pixels are arranged in a matrix pattern. Each of the pixels has a photoelectric conversion portion configured to photoelectrically convert light incident from a rear surface side of a semiconductor substrate. The plurality of on-chip lenses are arranged for every other pixel. The on-chip lenses are larger in size than the pixels. Each of color filters at the pixels where the on-chip lenses are present has a cross-sectional shape whose upper side close to the on-chip lens is the same in width as the on-chip lens and whose lower side close to the photoelectric conversion portion is shorter than the upper side.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: March 1, 2016
    Assignee: SONY CORPORATION
    Inventors: Rena Suzuki, Hiroki Tojinbara, Ryoto Yoshita, Yoichi Ueda