Abstract: A gas flow monitoring system is provided in process gas lines each arranged to supply gas to a predetermined process chamber via a flow control device, the system being configured to measure lowering or rising of gas pressure before and after the flow control device to monitor a flow rate of the flow control device. The system includes a first flow monitoring unit placed upstream of the flow control device in a selected one of the process gas lines, a second flow monitoring unit placed in a discharge passage upstream of the process chamber, and a controller that constantly monitors the flow rate of the flow control device with the first flow monitoring unit and, when the first flow monitoring unit detects the flow-rate abnormality two or more times, commands the second flow monitoring unit to re-verify whether flow-rate abnormality is present or not in the flow control device.

Abstract: An oil-water separator with a self-priming pump of high oil-water separation ability enables a mixed liquid to be introduced into the oil-water separator without causing emulsification. A separator portion separating a mixed liquid includes a rough cyclone separation portion. A main separation portion downstream of the rough separation portion performs main separation according to specific gravity. A water discharge portion connected to the main separation portion discharges water. An oil storage tank stores the oil separated from the water and overflowing the main separation portion. A self-priming liquid pump connected downstream of the separator portion and connected to the water discharge portion sucks the mixed liquid from an exterior to enable venting and discharging of air.

Abstract: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

Abstract: An object of the present invention is to provide an oil-water separator with self-priming pump of high oil-water separation ability that enables a mixed liquid to be introduced into the oil-water separator without causing emulsification.

Abstract: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

Abstract: The present invention is to provide a solid-liquid separator with self-priming pump with which wear of a self-priming liquid pump connected to a cyclone mechanism can be prevented and a solid-liquid mixture can be purified at a low cost without requiring a special arrangement (special material or special structure) for the pump.

Abstract: To provide a purge gas unit and a purge gas supply integrated unit having a smaller foot space, the purge gas unit comprises an input block for input of purge gas into the purge gas unit, the input block including a purge passage formed through the input block to provide an opening in a side surface of the input block and an input passage formed branching off from the purge passage; an output block for output of the purge gas from the purge gas unit; a communication block connected to the input block and the output block to provide communication between the input block and the output block.

Abstract: The present invention provides a filtration device combined with self-priming pump in which a filter replacement work is easy and safe, and removal of air inside of a pump and priming are not necessary.

Abstract: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Abstract: To provide a purge gas unit and a purge gas supply integrated unit having a smaller foot space, the purge gas unit comprises an input block for input of purge gas into the purge gas unit, the input block including a purge passage formed through the input block to provide an opening in a side surface of the input block and an input passage formed branching off from the purge passage; an output block for output of the purge gas from the purge gas unit; a communication block connected to the input block and the output block to provide communication between the input block and the output block.

Abstract: A liquid raw material supply unit for a vaporizer is adapted to supply a liquid raw material to the vaporizer that vaporizes the liquid raw material.

Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Abstract: A liquid raw material supply unit for a vaporizer is adapted to supply a liquid raw material to the vaporizer that vaporizes the liquid raw material.

Abstract: The present invention provides a filtration device combined with self-priming pump in which a filter replacement work is easy and safe, and removal of air inside of a pump and priming are not necessary.

Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Abstract: A liquid pump has a sealing mechanism utilizing magnets. The sealing mechanism includes an annular rotating seal attached to the lower surface of a rotary base member fixed to the motor rotating shaft. Additionally, a flexible stationary seal is joined and separated with respect to the rotating seal. Movable magnets are disposed on the rotary base and are adapted to be displaced by centrifugal force due to a rotation of the rotary base member. A stationary magnet is disposed on the upper-surface side of a vertical sliding member to which the flexible stationary seal is fixed. The flexible stationary seal utilized has a cylindrical body. At the upper and lower end portions and the side surface portion, connecting portions to the stationary and movable members are formed. The middle portion has an elastic portion is formed on it.

Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 ?m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 ?m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 ?m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 ?m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.

Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes.