Patents by Inventor Yoji Mori
Yoji Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030175136Abstract: The present invention relates to a liquid pump having improved characteristics concerning a sealing mechanism utilizing magnets.Type: ApplicationFiled: March 6, 2003Publication date: September 18, 2003Inventors: Ryosuke Hirata, Yoji Mori
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Publication number: 20020189849Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.Type: ApplicationFiled: March 29, 2002Publication date: December 19, 2002Applicant: IBIDEN Co., Ltd.Inventors: Naohiro Hirose, Takashi Kariya, Yoji Mori
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Patent number: 6490170Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: GrantFiled: July 17, 2001Date of Patent: December 3, 2002Assignee: Ibiden Co., Ltd.Inventors: Motoo Asai, Yoji Mori
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Patent number: 6487088Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: GrantFiled: July 17, 2001Date of Patent: November 26, 2002Assignee: Ibiden Co., Ltd.Inventors: Motoo Asai, Yoji Mori
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Patent number: 6411519Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: GrantFiled: July 17, 2001Date of Patent: June 25, 2002Assignee: Ibiden Co., Ltd.Inventors: Motoo Asai, Yoji Mori
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Patent number: 6407345Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.Type: GrantFiled: November 17, 2000Date of Patent: June 18, 2002Assignee: Ibiden Co., Ltd.Inventors: Naohiro Hirose, Takashi Kariya, Yoji Mori
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Patent number: 6392898Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: GrantFiled: May 31, 2000Date of Patent: May 21, 2002Assignee: Ibiden Co., Ltd.Inventors: Motoo Asai, Yoji Mori
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Patent number: 6384344Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes.Type: GrantFiled: October 5, 1999Date of Patent: May 7, 2002Assignee: Ibiden Co., LtdInventors: Motoo Asai, Yoichiro Kawamura, Yoji Mori
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Patent number: 6342682Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.Type: GrantFiled: August 7, 2000Date of Patent: January 29, 2002Assignee: Ibiden Co., Ltd.Inventors: Yoji Mori, Yoichiro Kawamura
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Publication number: 20010055203Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: ApplicationFiled: July 17, 2001Publication date: December 27, 2001Inventors: Motoo Asai, Yoji Mori
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Publication number: 20010054513Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: ApplicationFiled: July 17, 2001Publication date: December 27, 2001Inventors: Motoo Asai, Yoji Mori
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Patent number: 6316738Abstract: A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.Type: GrantFiled: August 26, 1997Date of Patent: November 13, 2001Assignee: Ibiden Co., Ltd.Inventors: Yoji Mori, Yoichiro Kawamura
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Publication number: 20010037896Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: ApplicationFiled: July 17, 2001Publication date: November 8, 2001Inventors: Motoo Asai, Yoji Mori
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Publication number: 20010038531Abstract: According to the package board of the present invention, each soldering pad formed on the top surface of the package board, on which an IC chip is to be mounted, is small (133 to 170 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also small. On the other hand, each soldering pad formed on the bottom surface of the package board, on which a mother board, etc. are to be mounted, is large (600 &mgr;m in diameter), so the metallic portion occupied by the soldering pads on the surface of the package board is also large. Consequently, a dummy pattern 58M is formed between conductor circuits 58U and 58U for forming signal lines on the IC chip side surface of the package board thereby to increase the metallic portion on the surface and adjust the rate of the metallic portion between the IC chip side and the mother board side of the package board, protecting the package board from warping in the manufacturing processes, as well as during operation.Type: ApplicationFiled: July 17, 2001Publication date: November 8, 2001Inventors: Motoo Asai, Yoji Mori
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Patent number: 6312228Abstract: A recovery pump capable of reliably recovering floating oil and/or floating matter such as scum or the like while being significantly down-sized. A pump casing is provided in a lower section thereof with a suction passage and a discharge passage. The suction passage is horizontally arranged and has a suction opening and the discharge passage is horizontally arranged below the suction passage. The passages are arranged so as to communicate with each other through a through-hole and the discharge passage is provided therewithin right below the through-hole with an impeller, which is driven by a drive motor located on an upper section of the pump casing. The suction opening is provided with a recovery section for recovering the floating oil and/or floating matter.Type: GrantFiled: January 6, 2000Date of Patent: November 6, 2001Assignee: World Chemical Co., Ltd.Inventors: Yoji Mori, Masami Hashimoto
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Patent number: 5954955Abstract: An oil-water recovering and separating apparatus for separating a raw fluid consisting of a mixture of oil and water into an oil part and a water part on the basis of difference in specific gravity, comprising: intake means for taking in the recovered raw fluid; a separation tank for separating the taken-in raw fluid; a water-part reservoir tank continued to the separation tank; a drain tank continued to the water-part reservoir tank; an oil part recovery portion disposed in the separation tank, the oil part recovery portion having a recovery port disposed slightly above the fluid level of the raw fluid in the separation tank; and scrape-up means provided in a position facing the recovery port so as to move along the fluid level.Type: GrantFiled: March 24, 1997Date of Patent: September 21, 1999Assignee: World Chemical Co., LTD.Inventors: Yoji Mori, Isao Mori, Masami Hashimoto
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Patent number: 5677382Abstract: An ethylene-.alpha.-olefin-non-conjugated diene copolymer rubber composition comprising a low molecular weight component copolymer composed of an ethylene-.alpha.-olefin-non-conjugated diene copolymer having a Mooney viscosity (ML.sub.1+4, 100.degree. C.) of 10 to 150, an .alpha.-olefin content of 30 to 60% by weight and an iodine value of 37 to 65, and a high molecular weight component copolymer composed of an ethylene-.alpha.-olefin-non-conjugated diene copolymer having a Mooney viscosity (ML.sub.1+4, 100.degree. C.) of 100 to 500, an .alpha.-olefin content of 15 to 50% by weight and an iodine value of 3 to 15, the ratio of the iodine value of the low molecular weight component copolymer to the iodine value of the high molecular weight component copolymer being at least 4/1. The above composition can inhibit a gel from being produced during processing and achieve a high degree of cross-linking and is excellent in compression set, shape-retention and sponge surface skin.Type: GrantFiled: December 5, 1995Date of Patent: October 14, 1997Assignee: Japan Synthetic Rubber Co., Ltd.Inventors: Shoei Tsuji, Hidekatsu Gotoh, Akihiko Morikawa, Fumio Tsutsumi, Yoji Mori
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Patent number: D445886Type: GrantFiled: January 24, 2000Date of Patent: July 31, 2001Assignee: CKD CorporationInventors: Yoji Mori, Hiroshi Kino, Yuji Matsuoka, Akira Murakumo, Hiroshi Kagohashi
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Patent number: D450327Type: GrantFiled: April 28, 2000Date of Patent: November 13, 2001Assignee: World Chemical Co., Ltd.Inventors: Yoji Mori, Toru Ebihara, Takanobu Uchiyama
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Patent number: D383992Type: GrantFiled: November 13, 1995Date of Patent: September 23, 1997Assignee: World Chemical Co., Ltd.Inventor: Yoji Mori