Abstract: This invention is to provide a technique enabling efficient routing in the entire network by totally viewing a state of the entire network from a specific server. An information processing method for managing paths between arbitrary nodes in a specific network according to the invention, includes: obtaining data concerning a utilization state of each link constituting a path, from associated nodes in the specific network; and calculating a value of dynamic transmission bandwidth in an entire path by using the data concerning the utilization state of each link constituting the path, and storing the calculated value into a management data storage. By the dynamic transmission bandwidth, that is, bandwidth, which can actually be used for communication to be carried out from now, it becomes possible to carry out efficient routing.

Abstract: A substrate transport container is used, for example, in the process of manufacturing integrated circuits of less than 0.13 ?m line width, can hold the level of contaminants in the interior of the container for at least particles, acidic gases, basic gases, organic substances and humidity at controlled low levels, and has the size and structure to be compatible with automated semiconductor manufacturing plants. The container is provided with a door for loading and unloading substrates on a surface of a container main body and is constructed so as to hold the substrates inside the container main body at a given distance of separation. Air conditioning apparatuses for reducing the levels of particulate and gaseous contaminants are disposed roughly symmetrically on the container main body.

Abstract: A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract: A substrate procesing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract: A method of using a substrate transport pod is suitable for manufacturing semiconductor devices with copper wiring and low dielectric insulating film having dielectric constants of less than 3. The method is based on loading the substrates into a pod from an atmosphere of a first process, and circulating a gaseous atmosphere through interior of the pod in such a way to selectively remove at least one contaminant including moisture, particulate substances or chemical substances, and to expose the substrates to a controlled atmosphere intermittently or continually while the substrates are held in the pod before they are unloaded from the pod and introduced into a second process. For a pod that is used to house the substrates for the purpose of retaining or transporting, the pod has a pod main body and a door that provides a hermetic seal, the pod is made primarily of a materiel that has moisture absorption factor of less than 0.

Abstract: A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract: A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract: A substrate transport container having a carrier box including a container body and a door hermetically sealably covering an opening provided in the front of the container body. Partitions form a circulating flow path in the carrier box. The circulating flow path has a flow path in which air flows toward substrates and a flow path in which air flows toward a fan. A substrate carrying section is disposed in the flow path in which air flows toward the substrates to carry the substrates in such a way that the principal surfaces of the substrates are approximately parallel to the flow path in which air flows toward the substrates. A particle removing filter and a gaseous impurity trapping filter are placed on the upstream side of the substrate carrying section in the flow path in which air flows toward the substrates. A fan motor for driving the fan is incorporated in the carrier box to form an air current for circulating through the circulating flow path.

Abstract: A method of using a substrate transport pod is provided, which is suitable for manufacturing semiconductor devices with copper wiring and low dielectric insulating film having dielectric constants of less than 3. The method is based on loading the substrates into a pod from an atmosphere of a first process, and circulating a gaseous atmosphere through interior of the pod in such a way to selectively remove at least one contaminant including moisture, particulate substances or chemical substances, and to expose the substrates to a controlled atmosphere intermittently or continually while the substrates are held in the pod before they are unloaded from the pod and introduced into a second process. For a pod that is used to house the substrates for the purpose of retaining or transporting, the pod has a pod main body and a door that provides a hermetic sealing seal, and the pod is made primarily of a materiel that has moisture absorption factor of less than 0.

Abstract: In a connector provided with a slider for detecting a half-engagement with respect to a mating connector in accordance with a state of the slider, a resin housing includes a slider receiving section for accommodating the slider and a terminal receiving section for accommodating a terminal connected with an electric wire, which are vertically arranged so as to oppose to each other while defining a gap therebetween. A reinforcing wall member is integrally molded with the housing so as to bridge the slider receiving section and the terminal receiving section in at least one side portion of the housing.

Abstract: A gas removal filter has an ion exchanger for adsorbing a gas and at least a pair of electric resistance measuring electrodes disposed on the ion exchanger. By measuring a change in the electric resistance between at least the pair of electric resistance measuring electrodes disposed on the ion exchanger, it is possible to estimate an ion exchange group consumption ratio of the ion exchanger. The ion exchange group consumption ratio of the ion exchanger can be detected in a short period of time, and a remaining adsorption capability of the ion exchanger can be known with ease.

Abstract: A substrate container includes a container housing having an opening for storing a substrate therethrough and a cover sealingly covering the opening, a fan motor mounted in the container housing for producing a circulating path of air in contact with the substrate in the container housing, and a particle removing filter and a gaseous impurity trapping filter which are disposed in the a portion of the circulating path which extends toward the substrate. A dehumidifying unit for dehumidifying a space in the container housing comprises a solid polymer electrolyte film disposed in the circulating path and voltage applying means for applying a voltage to the solid polymer electrolyte film to decompose water in air flowing in the circulating path thereby to dehumidify a space in the container housing.

Abstract: A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.

Abstract: A substrate container includes a container housing having an opening for storing a substrate therethrough and a cover sealingly covering the opening, a fan motor mounted in the container housing for producing a circulating path of air in contact with the substrate in the container housing, and a particle removing filter and a gaseous impurity trapping filter which are disposed in the a portion of the circulating path which extends toward the substrate. A dehumidifying unit for dehumidifying a space in the container housing comprises a solid polymer electrolyte film disposed in the circulating path and voltage applying means for applying a voltage to the solid polymer electrolyte film to decompose water in air flowing in the circulating path thereby to dehumidify a space in the container housing.

Abstract: A gas removal filter has an ion exchanger for adsorbing a gas and at least a pair of electric resistance measuring electrodes disposed on the ion exchanger. By measuring a change in the electric resistance between at least the pair of electric resistance measuring electrodes disposed on the ion exchanger, it is possible to estimate an ion exchange group consumption ratio of the ion exchanger. The ion exchange group consumption ratio of the ion exchanger can be detected in a short period of time, and a remaining adsorption capability of the ion exchanger can be known with ease.

Abstract: A cleanbox that can prevent contamination from not only external sources but also from within the cleanbox from such sources as substrates and internal components of the cleanbox, includes a casing container (18) formed by a container main body (12) and a lid member (14) for hermetically sealing a top opening section of the container main body; a dividing wall (20) for forming circulation paths having an upstreaming path and a downstreaming paths within the casing container; a substrate holding section (24) disposed in the upstreaming path for holding broad surfaces of substrates (W) approximately parallel to the upstreaming path; an air filter (26) and a gas removal filter (28) disposed upstream in relation to the substrate holding section in the upstreaming path; and a motor-driven fan (30) housed in the casing container for producing air streams circulating in the circulating paths.

Abstract: This invention provides a substrate transport container for use, for example, in the process of manufacturing integrated circuits of less than 0.13 &mgr;m line width, to enable to hold the level of contaminants in the interior of the container for at least particles, acidic gases, basic gases, organic substances and humidity at controlled low levels, and having the size and structure to be compatible with automated semiconductor manufacturing plants. The container is provided with a door for loading and unloading substrates on a surface of a container main body and is constructed so as to hold the substrates inside the container main body at a given distance of separation, wherein air conditioning apparatuses for reducing the levels of particulate and gaseous contaminants, are disposed roughly symmetrically on the container main body.

Abstract: A substrate transport container having a carrier box including a container body and a door hermetically sealably covering an opening provided in the front of the container body. Partitions form a circulating flow path in the carrier box. The circulating flow path has a flow path in which air flows toward substrates and a flow path in which air flows toward a fan. A substrate carrying section is disposed in the flow path in which air flows toward the substrates to carry the substrates in such a way that the principal surfaces of the substrates are approximately parallel to the flow path in which air flows toward the substrates. A particle removing filter and a gaseous impurity trapping filter are placed on the upstream side of the substrate carrying section in the flow path in which air flows toward the substrates. A fan motor for driving the fan is incorporated in the carrier box to form an air current for circulating through the circulating flow path.