Patents by Inventor Yong A. Yu

Yong A. Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11721122
    Abstract: Provided are a display panel, a manufacturing method thereof and a display apparatus. The display panel includes a fingerprint identification sensor, a first light shield layer disposed on the fingerprint identification sensor and a color film layer disposed on the first light shield layer, wherein the color film layer includes color filters with different colors and light transmission parts disposed between the color filters with different colors; the first light shield layer includes first openings and light shield parts, the light transmission parts and the first openings are used for allowing fingerprint reflected light to transmit and reach the fingerprint identification sensor, and the light shield parts are used for blocking out stray light.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: August 8, 2023
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.
    Inventors: Chuanxiang Xu, Shi Shu, Haitao Huang, Yang Yue, Yong Yu, Xiang Li, Qi Yao
  • Patent number: 11701352
    Abstract: The present invention is directed to an aripiprazole oral soluble film and a preparation method thereof. The aripiprazole oral soluble film comprises 10-60% w/w of aripiprazole in a crystalline state and 30-95% w/w of one or more film-forming materials, wherein 90% of the aripiprazole particles have a size of ?14.3 ?m and are uniformly blended in the film without visible undispersed particles. The aripiprazole oral soluble film has excellent bioavailability, uniformity, stability, and palatability. The oral soluble film preparation is prepared by first grinding aripiprazole particles to have desired small particle sizes, then blending the aripiprazole particles with film forming materials in an aqueous solution to a uniform suspension, defoaming the suspension, and coating the suspension on a substrate and drying it to form a film.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: July 18, 2023
    Assignee: XIAMEN LP PHARMACEUTICAL CO., LTD.
    Inventors: Rongbin Ling, Lingyu Cai, Fuxiang Lin, Yong Yu, Xiaojin Xiao
  • Patent number: 11698695
    Abstract: The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: July 11, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuerui Gong, Jiangsheng Wang, Yong Yu, Chang Zhang
  • Publication number: 20230216561
    Abstract: A beam training method, a network device, a terminal device, a system and a storage medium are disclosed. The method may include: dividing K1 query beams into Q1 groups; transmitting, at a time-frequency resource position within an operating beam issuing time corresponding to each beam training period, pilot information by utilizing an operating beam in an operating beam set; and, transmitting, at a time-frequency resource position within a query beam issuing time corresponding to each beam training period, pilot information by utilizing a query beam in any query beam group.
    Type: Application
    Filed: June 3, 2021
    Publication date: July 6, 2023
    Inventors: Ping LI, Jianli WANG, Zhenzhe SUN, Yong YU, Tao LU, Jingyue HUANG, Rongrong CAI
  • Publication number: 20230202937
    Abstract: A concrete curing agent, a curing coating layer and a preparation method thereof, the concrete curing agent comprises a hardening agent and a hydrophobic agent, the raw materials of the hardening agent comprises the following raw materials in parts by weight: 0.1-10 parts of fluorosilicate salt and 100 parts of water, and the hydrophobic agent comprises the following raw materials in parts by weight: 0.1-10 parts of a base catalyst, 1-10 parts of a silane coupling agent, 0.1-10 parts of hydrogen-containing silicone oil, 5-10 parts of a cross-linking agent, 10-100 parts of silica sol and 100-1000 parts of water. The present invention can significantly improve the strength, hardness and hydrophobicity, impermeability and freeze-thaw resistance of surface of concrete before and after hardening, and effectively improves the service life of concrete structures.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 29, 2023
    Inventors: Bo PANG, Zuquan JIN, Yunsheng ZHANG, Yong YU, Xiaoying ZHANG, Chuansheng XIONG, Ning LI, Xiaoyun SONG, Mengyuan LI
  • Publication number: 20230194214
    Abstract: A frustum embedded fabricated composite protective structure is provided, including a restraint frame, a back plate, an infill block and a buffer block. The restraint frame is provided with a plurality of mounting holes matching with the shape of the infill block, the restraint frame is arranged on the back plate, the infill block is in a frustum shape. The buffer block and the infill block are installed in the mounting hole of the restraint frame, the buffer block is arranged on the smaller end of the infill block, and the infill block is wedged into the mounting hole of the restraint frame through a wedge surface mating, . Because this protective structure is assembled by multiple restraint frames and infill blocks, under the prestress restraint of partition blocks, the damage range after penetration or explosion will be significantly reduced, and it can withstand multiple blows.
    Type: Application
    Filed: January 14, 2023
    Publication date: June 22, 2023
    Inventors: Yuyan SUN, Ziguo WANG, Zuquan JIN, Yong YU, Xiaomei WAN
  • Publication number: 20230194215
    Abstract: A frustum embedded fabricated composite protective structure is provided, including a restraint frame, a back plate, an infill block and a buffer block. The restraint frame is provided with a plurality of mounting holes matching with the shape of the infill block, the restraint frame is arranged on the back plate, the infill block is in a frustum shape. The buffer block and the infill block are installed in the mounting hole of the restraint frame, the buffer block is arranged on the smaller end of the infill block, and the infill block is wedged into the mounting hole of the restraint frame through a wedge surface mating. Because this protective structure is assembled by multiple restraint frames and infill blocks, under the prestress restraint of partition blocks, the damage range after penetration or explosion will be significantly reduced, and it can withstand multiple blows.
    Type: Application
    Filed: February 3, 2023
    Publication date: June 22, 2023
    Inventors: Yuyan SUN, Ziguo WANG, Zuquan JIN, Yong YU, Xiaomei WAN
  • Publication number: 20230196968
    Abstract: A display module (10), including a drive IC (11) and a power management IC (12). The power management IC (12) comprises a first identification pin (121); the first identification pin (121) is connected to the drive IC (11); under the condition that the power management IC (12) is turned on, the power management IC (12) transmits identification information to the drive IC (11) by means of the first identification pin (121), so that the drive IC (11) identifies the power management IC (12) and is paired with the power management IC (12). A control method, a control apparatus (200), an electronic device (100) and a computer readable storage medium (40).
    Type: Application
    Filed: June 8, 2021
    Publication date: June 22, 2023
    Inventors: Chang ZHANG, Yong YU, Yuanyuan CHAI
  • Patent number: 11667545
    Abstract: The present disclosure discloses an NOI water bath apparatus, which includes an NOI generator, a GLM and a GLS, where the NOI generator includes an ionization module, and the ionization module is configured to ionize oxygen into NOIs; an air inlet end of the GLM is connected to an air outlet end of the NOI generator, the GLM includes a gas-liquid mixing module, and the gas-liquid mixing module is configured to dissolve the NOIs generated by the ionization module; a liquid inlet end of the GLS is connected to a liquid outlet end of the GLM, the GLS includes a first filtering module, and the first filtering module is configured to filter out exhaust gas in the gas-liquid mixing module.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: June 6, 2023
    Assignee: GUANGZHOU SHENGJI TECHNOLOGY CO., LTD.
    Inventors: Yong Yu, Mengchun Yu
  • Publication number: 20230170416
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming an silicon pillar on the substrate; preprocessing the silicon pillar, to form an active pillar including a first segment, a second segment, and a third segment, where the second segment includes a first sub-segment and a second sub-segment, and a cross-sectional area of the second sub-segment is smaller than that of the first sub-segment; forming a gate oxide layer; and forming a word line structure surrounding the second segment, where the word line structure includes a first word line structure and a second word line structure that are made of different materials.
    Type: Application
    Filed: August 4, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong YU, Guangsu SHAO
  • Publication number: 20230171942
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming a plurality of active pillars on the substrate, where each of the active pillars includes a first segment, a second segment, and a third segment; forming a first gate oxide layer on a sidewall of the second segment, a top surface of the first segment, and a bottom surface of the third segment; and forming a second gate oxide layer on the first gate oxide layer, where a length of the second gate oxide layer is less than that of the first gate oxide layer, and a thickness of the second gate oxide layer is greater than that of the first gate oxide layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong YU, Guangsu SHAO
  • Publication number: 20230171941
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure, and relates to the technical field of semiconductors. The manufacturing method of a semiconductor structure includes: providing a substrate; forming active pillars arranged at intervals on the substrate, the active pillar includes a first segment, a second segment, and a third segment that are connected sequentially along a first direction; forming a gate oxide layer on sidewalls of each of the second segment and the third segment; and forming a word line structure on a sidewall of the gate oxide layer, the word line structure includes a first word line structure and a second word line structure that are made of different materials, and the first word line structure is connected to the sidewall of the gate oxide layer, and partially covers the second word line structure.
    Type: Application
    Filed: August 5, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong Yu, Guangsu Shao
  • Publication number: 20230171940
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming a plurality of silicon pillars arranged in an array on the substrate; pre-processing the silicon pillar, to form an active pillar, where along a first direction, the active pillar includes a first segment, a second segment, and a third segment that are connected sequentially; forming a gate oxide layer on sidewalls of each of the second segment and the third segment; and forming a gate dielectric layer on the gate oxide layer, where along the first direction, the gate dielectric layer is shorter than the gate oxide layer, and a top surface of the gate dielectric layer is flush with that of the third segment.
    Type: Application
    Filed: August 5, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong Yu, Guangsu Shao
  • Publication number: 20230171938
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming a plurality of active pillars arranged in an array on the substrate, where the active pillar includes a first segment, a second segment, and a third segment that are connected sequentially, and along a second direction, a cross-sectional area of the second segment is smaller than those of the first segment and the third segment; forming a gate oxide layer on a sidewall of the second segment, a top surface of the first segment, and a bottom surface of the third segment; and forming a gate dielectric layer on the gate oxide layer, where the gate dielectric layer is shorter than the gate oxide layer, and is close to the third segment.
    Type: Application
    Filed: August 4, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong Yu, Guangsu Shao
  • Publication number: 20230171939
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming a plurality of silicon pillars on the substrate, where the silicon pillars are arranged as an array; preprocessing the silicon pillar to form an active pillar, where the active pillar includes a first segment, a second segment, and a third segment; forming a first gate oxide layer on sidewalls of the second segment and the third segment; and forming a second gate oxide layer on the first gate oxide layer, where a length of the second gate oxide layer is less than that of the first gate oxide layer, and a thickness of the second gate oxide layer is greater than that of the first gate oxide layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong YU, Guangsu SHAO
  • Publication number: 20230141145
    Abstract: A neural network building method and apparatus are disclosed, and relate to the field of artificial intelligence. The method includes: initializing a search space and a plurality of building blocks, where the search space includes a plurality of operators, and the building block is a network structure obtained by connecting a plurality of nodes by using the operator; during training, in at least one training round, randomly discarding some operators, and updating the plurality of building blocks by using operators that are not discarded; and building a target neural network based on the plurality of updated building blocks. In the method, some operators are randomly discarded. This breaks association between operators, and overcomes a co-adaptation problem during training, to obtain a target neural network with better performance.
    Type: Application
    Filed: January 5, 2023
    Publication date: May 11, 2023
    Inventors: Weijun HONG, Guilin LI, Weinan ZHANG, Yong YU, Xing ZHANG, Zhenguo LI
  • Publication number: 20230125717
    Abstract: The present application relates to the technical field of display, and discloses an OLED display panel and a display device. The OLED display panel includes a drive backplane; and an OLED device, an encapsulation structure and a color resistor structure which are arranged on the drive backplane; the encapsulation structure and the color resistor structure are located on a side, facing away from the drive backplane, of the OLED device, and the color resistor structure includes a chromatic color resistor layer, a first BM and a second BM; and the first BM is located on a side, facing away from the drive backplane, of the chromatic color resistor layer, and the second BM is located on a side, facing the drive backplane, of the chromatic color resistor layer.
    Type: Application
    Filed: November 20, 2019
    Publication date: April 27, 2023
    Inventors: Chuanxiang XU, Shi SHU, Qi YAO, Guangcai YUAN, Yang YUE, Haitao HUANG, Yong YU
  • Patent number: 11636811
    Abstract: The preset disclosure provides a data burning method and a data burning device. The data burning method comprises receiving a differential signal data packet, which is transmitted by a signal generator, by a driver IC through a differential signal interface, the differential signal data packet including grayscale data; parsing the differential signal data packet by the driver IC to obtain the grayscale data; and burning the grayscale data to a memory by the driver IC.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: April 25, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Guoqiang Wu, Chuanyan Lan, Yong Yu, Taehyun Kim, Lianbin Liu
  • Publication number: 20230112348
    Abstract: A tunneling device includes a first semiconductor portion disposed on a first oxide substrate, a second semiconductor portion disposed on the first semiconductor portion, and an intermediate layer disposed between the first semiconductor portion and second semiconductor portion. The intermediate layer is a natural oxide film obtained by naturally oxidizing one surface of the second semiconductor portion for a predetermined time.
    Type: Application
    Filed: June 7, 2021
    Publication date: April 13, 2023
    Applicant: Korea University Research and Business Foundation
    Inventors: Hyun Yong YU, Kyu Hyun HAN
  • Publication number: 20230090085
    Abstract: A system to provide physical therapy in the form of heating, cooling and/or percussion, comprising: a device that contains a battery, a motor, and a switch to turn the device on or off or put the device in heating mode or put the device in cooling mode or put the device in percussion mode; wherein the device contains a motor and a pushing rod that supply the movement that results in percussion of a removable heating/cooling attachment and a removable percussion attachment; wherein the front of the device connects to the removable heating/cooling attachment that contains an electronic component to control heating or cooling and a cooling fan; wherein the removable heating/cooling attachment can be used for heating or cooling; wherein a housing shell for the heating/cooling attachment is made of plastic, foam, or metal, or any combination of plastic, foam and metal; wherein the front part of the heating/cooling attachment is made of metal that has the capability to be in contact with human skin in order to prov
    Type: Application
    Filed: November 7, 2022
    Publication date: March 23, 2023
    Inventors: Quanqin Dai, Yong Yu, Guorong Xu