Patents by Inventor Yong-An Lin

Yong-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10225570
    Abstract: A virtual desktop can be remoted to a client device by transmitting a video stream using a video coding format, such as H.264, where higher resolution video can be streamed than natively supported by the encoder or decoder. The encoder framebuffer is divided into a plurality of equal size child buffers, each child buffer is assigned an identifier for identifying the child buffer. Padding pixels can be added to the child buffers to make the child buffer size acceptable for the video coding format. The child buffers are encoded using the video coding format and the encoded frames are transmitted to a client. On the decoder side, the encoded child frames are decoded, padding pixels are removed, and the data is used to update corresponding child buffers in a framebuffer on the client display system.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: March 5, 2019
    Assignee: VMware, Inc.
    Inventors: Yuping Wei, Yong Lin Ma, Lizhu Zhang
  • Patent number: 10186478
    Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: January 22, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Vikas Gupta, Daniel Yong Lin
  • Patent number: 10175238
    Abstract: The present invention relates to methods of determining the presence or absence of abnormal lymphoid cells or abnormal myeloid cells in a cell sample, with the methods comprising subjecting the cell sample to conditions that will activate any inactive matriptase present in the cell sample and measuring the levels of activated matriptase in the cell sample. Once measured, these levels can then be compared to control levels of active matriptase to determine if the cell sample has elevated levels of activated matriptase over control levels of active matriptase. An elevation in the levels of activated matriptase in the cell sample is indicative that the cell sample contains abnormal lymphoid cells or abnormal myeloid cells.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: January 8, 2019
    Assignee: Georgetown University
    Inventors: Chen-Yong Lin, Michael D. Johnson, Feng-Pai Chou
  • Publication number: 20180375513
    Abstract: A proximity sensor for a non-aperture mechanism includes a control circuit for generating a control signal; a first light-emitting element for emitting a first light source according to the control signal of the control circuit; a second light-emitting element for emitting a second light source according to the control signal of the control circuit; and a light sensing element coupled to the control circuit, for sensing the first light source and the second light source reflected by an object, and determining a distance between the proximity sensor and the object according to light intensities of the reflected first light source and the reflected sensed second light source; wherein the light sensing element and the first light-emitting element have a first distance therebetween, the light sensing element and the second light-emitting element have a second distance therebetween, and the second distance is greater than the first distance.
    Type: Application
    Filed: May 3, 2018
    Publication date: December 27, 2018
    Inventors: Kun-Yang Li, Meng-Yong Lin, Sheng-Chun Chen
  • Publication number: 20180351022
    Abstract: The disclosure describes multi-junction solar cell structures that include two or more graded interlayers.
    Type: Application
    Filed: February 15, 2017
    Publication date: December 6, 2018
    Inventors: Yong Lin, Paul R. Sharps, Arthur Cornfeld, Pravin Patel, Mark A. Stan, Benjamin Cho
  • Patent number: 10147672
    Abstract: An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled to the set of leads. Encapsulating material encloses the semiconductor die, such that the set of pins extend beyond the encapsulating material. An additive coating covers one or more of the plurality of pins.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: December 4, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yong Lin, Sadia Arefin Khan, Benjamin Stassen Cook
  • Publication number: 20180324575
    Abstract: A data transmission method is performed by at least one processor of a terminal, and includes displaying one or more messages, each of the one or more messages including a data file, based on a touch and hold input on one of the one or more messages, displaying an option for displaying one or more icons respectively indicating one or more hardware devices capable of executing the data file of the one of the one or more messages, based on a touch input on the option, displaying the one or more icons respectively indicating the one or more hardware devices, and based on a touch input on one of the one or more icons indicating one of the one or more hardware devices, sending, to the one of the one or more hardware devices, the data file of the one of the one or more messages.
    Type: Application
    Filed: July 11, 2018
    Publication date: November 8, 2018
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Sui Peng QI, Shi Hai CHENG, Ming Yong LIN, Liang Liang FAN, Yi Fu WANG, Zhi Yong YANG, Jin Gui WANG, Lu Lu JIE, Feng LU, Xiao Hui YAO, Dun Wei WU, Qing Zhu ZHONG
  • Publication number: 20180240741
    Abstract: Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.
    Type: Application
    Filed: March 6, 2018
    Publication date: August 23, 2018
    Inventors: Benjamin Stassen Cook, Daniel Yong Lin
  • Publication number: 20180192740
    Abstract: A shoe vamp includes a main body, a filler member and an adhesive layer. The main body is formed by enveloping a vamp fabric and has a vamp portion, a lining portion, a beg opening, and an accommodation space between the vamp portion and the lining portion in communication with the beg opening. The filler member is filled into the accommodation space of the main body via the beg opening. The adhesive layer is applied on an outer surface of the filler member and adhesively bonded with an inner wall of the main body.
    Type: Application
    Filed: January 10, 2018
    Publication date: July 12, 2018
    Inventors: Chung-Hu HSIAO, Den-Yong LIN
  • Publication number: 20180190608
    Abstract: A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the semiconductor device. A reflow wall is on a portion of the lead frame and is in contact with the solder joint. A molding compound covers portions of the semiconductor device, the lead frame, the solder joint, and the reflow wall.
    Type: Application
    Filed: December 13, 2017
    Publication date: July 5, 2018
    Inventors: Vikas Gupta, Daniel Yong Lin
  • Publication number: 20180190577
    Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
    Type: Application
    Filed: December 14, 2017
    Publication date: July 5, 2018
    Inventors: Vikas Gupta, Daniel Yong Lin
  • Publication number: 20180182693
    Abstract: A device comprises a substrate and an adhesive nanoparticle layer patterned into zones of electrical conductance and insulation on top of the substrate surface. A diffusion region adjoining the surface comprises an admixture of the nanoparticles in the substrate material. When the nanoparticle layer is patterned from originally all-conductive nanoparticles, the insulating zones are created by selective oxidation; when the nanoparticle layer is patterned from originally all-non-conductive nanoparticles, the conductive zones are created by depositing selectively a volatile reducing agent. A package of insulating material is in touch with the nanoparticle layer and fills any voids in the nanoparticle layer.
    Type: Application
    Filed: January 8, 2018
    Publication date: June 28, 2018
    Inventors: Benjamin Stassen Cook, Yong Lin
  • Publication number: 20180177889
    Abstract: The present invention relates to matriptase antibodies and immunoconjugates of matriptase antibodies with cytotoxic agents and the use thereof for killing or inhibiting the growth of matriptase-expressing cancer cells, such as those of multiple myeloma and breast cancers. In particular, immunoconjugates comprising a matriptase monoclonal antibody and anticancer agents such as auristatin, including monomethyl auristatin E (MMAE) and monomethyl auristatin F (MMAF) are introduced, which have potent antitumor activity in vivo. Moreover, importantly; there was no weight loss or other evidence of toxicity in the animals, indicating that no significant free drug was released into the circulation from the conjugate. The present invention also provides compositions comprising these new immunoconjugates and use of them for treatment of malignancies comprising cells that express matriptase.
    Type: Application
    Filed: December 1, 2017
    Publication date: June 28, 2018
    Inventors: Siang-Yo Lin, Joseph R. Bertino, Chen-Yong Lin
  • Publication number: 20180175357
    Abstract: A battery connection module and a battery device are provided. The battery device comprises a battery box and a battery connection module. The battery connection module comprises a circuit board, a plurality of busbars and a covering mechanism. The plurality of busbars are provided to a bottom surface of the circuit board in two rows spaced apart from each other. Each busbar has a main body portion connecting with the circuit board and at least two electrode connecting portions. The covering mechanism is provided to the bottom surface of the circuit board and comprises a plurality of sealing units. Each sealing unit comprises a cover, two first sealing members and a second sealing member.
    Type: Application
    Filed: November 17, 2017
    Publication date: June 21, 2018
    Applicant: Molex, LLC
    Inventors: Yong Lin, Shang Xiu Zeng, Kian Heng Lim
  • Publication number: 20180175358
    Abstract: A battery connection module and a battery device are provided, the battery device comprises a battery box and a battery connection module The battery connection module comprises a covering unit and a circuit unit The covering unit comprises a cover plate and a plurality of sealing members The cover plate has a plate body and a plurality of plugging bodies The sealing members are respectively provided to peripheries of the plugging bodies The circuit unit comprises a circuit board provided to an upper surface of the plate body, a plurality of busbars embedded in the cover plate and a plurality of conductive connecting tabs respectively connecting the busbars to the circuit board.
    Type: Application
    Filed: November 17, 2017
    Publication date: June 21, 2018
    Applicant: Molex, LLC
    Inventors: Yong Lin, Shang Xiu Zeng, Kian Heng Lim
  • Publication number: 20180166369
    Abstract: A device comprises a substrate) of a first material with a surface, which is modified by depositing a bi-layer nanoparticle film. The film includes a nanoparticle layer of a second material on top of and in contact with surface, and a nanoparticle layer of a third material on top of and in contact with the nanoparticle layer of the second material. The nanoparticles of the third material adhere to the nanoparticles of the second material. The substrate region adjoining surface comprises an admixture of the second material in the first material. A fourth material contacts and chemically/mechanically bonds to the nanoparticle layer of the third material.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 14, 2018
    Inventors: Benjamin Stassen Cook, Yong Lin
  • Publication number: 20180159037
    Abstract: Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.
    Type: Application
    Filed: February 5, 2018
    Publication date: June 7, 2018
    Applicant: The Trustees of Princeton University
    Inventors: Michael C. McAlpine, Yong Lin Kong
  • Patent number: 9978344
    Abstract: A method for caching images in a virtual environment uses hash tables to store information about an application or window and to store updated images. Suitable areas of applications or windows are fixed relative to the window for many cases, and also include a relatively small number of possible display statuses. Hash tables are used on an agent side and a client side to track previous image updates. When an updated image is determined to be already stored in a cache, the agent side can transmit a hash identifying the image to the client side, and the client side can update the display with the cached image.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: May 22, 2018
    Assignee: VMware, Inc.
    Inventors: Yuping Wei, Yong Lin Ma, Jinxing Hu, Li-Zhu Zhang
  • Publication number: 20180102454
    Abstract: The disclosure describes multi-junction solar cell structures that include two or more graded interlayers.
    Type: Application
    Filed: February 15, 2017
    Publication date: April 12, 2018
    Inventors: Yong Lin, Paul R. Sharps, Arthur Cornfeld, Pravin Patel, Mark A. Stan, Benjamin Cho
  • Patent number: 9941194
    Abstract: In an embodiment, a substrate made of a first material and having a surface is provided. A first and second nozzle dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles respectively while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer comprising sequential and contiguous zones alternating between the first solvent paste and the second solvent paste. Energy is applied to the nanoparticles to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 10, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Yong Lin