Patents by Inventor Yong An

Yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200134289
    Abstract: Provided are a method and apparatus for identifying a fingerprint logo and an electronic device. The method for identifying the fingerprint logo includes: acquiring, before an optical sensor captures a fingerprint image, first optical signals captured by the optical sensor in at least one first region respectively, where the first optical signals captured in the at least one first region form a first image, and the at least one first region corresponds to a partial region of a photosensitive surface of the optical sensor; and identifying whether there is a fingerprint logo for guiding a user to perform pressing in the first image according to the first optical signals captured in the at least one first region.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 30, 2020
    Inventor: Yong LI
  • Publication number: 20200137696
    Abstract: Example communication methods and communications apparatus are described. One example method includes determining power of a demodulation reference signal (DMRS) by a terminal device. The terminal device sends the MARS based on the determined power. In embodiments of this application, the power of the DMRS can be flexibly determined for different communication statuses.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Yong LIU, Xiang REN, Xiaoyan BI
  • Publication number: 20200129414
    Abstract: The present invention may provide an oil in water (O/W) cosmetic composition having water resistance and ease of facial cleansing, using an A-B-A type triblock copolymer which is included in the cosmetic, and thus may adjust the surfactant power. Further, it is possible to provide a method for imparting water resistance and ease of facial cleansing, using the A-B-A type triblock copolymer.
    Type: Application
    Filed: October 30, 2019
    Publication date: April 30, 2020
    Inventors: Ji Hyun LEE, Jun Bae LEE, Sun Young KIM, Sung Yong KIM, So Youn AN, Chun Ho PARK, Myeong Sam PARK
  • Publication number: 20200132908
    Abstract: A backlight unit includes a light guide plate, a low refractive layer disposed on the light guide plate, an optical conversion layer disposed on the low refractive layer, a light source adjacent to a side surface of the light guide plate, and a plurality of optical patterns disposed under the light guide plate, extending in a first direction intersecting the side surface, and disposed in a second direction intersecting the first direction. When viewed a plan view in the first direction, each of the optical patterns have a quadrilateral shape.
    Type: Application
    Filed: July 29, 2019
    Publication date: April 30, 2020
    Inventors: Byung-seo YOON, Seong-yong HWANG, Jonghwan KIM, Sung-kyu SHIM
  • Publication number: 20200130103
    Abstract: A laser patterning apparatus of a three-dimensional object to be processed, which includes a laser generation unit, a first beam adjustment unit for adjusting the magnitude of a laser beam generated in the laser generation unit, a second beam adjustment unit for adjusting the focal location of z-axis, x-axis, and y-axis of the laser beam via the first beam adjustment unit, and a control unit for controlling the second beam adjustment unit so that laser patterning is performed on a three-dimensional object to be processed.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 30, 2020
    Applicant: Advanced Technology Inc.
    Inventors: Byoung-Chan CHOI, Yong Cheol CHOI, Ho Kyeng CHOI, Young Hun SONG, Ki Won JUNG, Doo Baeck AN
  • Publication number: 20200133400
    Abstract: A method of performing a function of a device based on motion information of the device in a standby mode of the device, a device for performing the method are provided. The device includes a sensor configured to detect movement of the device in a standby mode of the device; a storage configured to store motion information based on information related to the movement and at least one piece of function information corresponding to the motion information; and a processor configured to control the device to perform a function corresponding to the motion information in the standby mode based on the information related to the movement, the motion information, and the at least one piece of function information.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-hyun Ryu, Yong-gook Park, Han-joo Chae, Won-young Choi, Jeong-gwan Kang, Nam-hoon Kim, Hyun-su Hong, Jin La
  • Publication number: 20200129975
    Abstract: Provided is a portable urea sensor which can be used under a flow condition by using a porous polytetrafluoroethylene (PTFE) membrane coated with parylene-A, which is parylene functionalized with an amine by vacuum deposition. To produce a specific electrochemical sensor signal from urea, urease, which is an enzyme hydrolyzing urea, is immobilized to a parylene-A-coated PTFE membrane by chemical crosslinking using glutaraldehyde. The urea-immobilized membranes are assembled in a polydimethylsiloxane (PDMS) fluid chamber, and a screen-printed carbon 3-electrode system is used. The success of the urease immobilization process is confirmed using scanning electronmicroscopy (SEM) and Fourier-transform infrared (FTIR) spectroscopy. The optimal concentration of urease to be immobilized to the parylene-A-coated PTFE membrane is determined to be 48 mg/mL, and the optimal number of the membranes in the PDMS chamber is determined to be 8.
    Type: Application
    Filed: October 29, 2019
    Publication date: April 30, 2020
    Applicant: INDUSTRY ACADEMIC COOPERATION FOUNDATION, HALLYM UNIVERSITY
    Inventors: Min PARK, Gun Yong SUNG, Jee Young KIM, Kyunghee KIM
  • Publication number: 20200134591
    Abstract: First POS transaction summary data associated with a first POS machine is generated. A first authorization code associated with the first POS transaction summary data is transmitted to a first transaction data management module (TDCMM). The first POS transaction summary data is transmitted to a POS transaction data management server. Final POS transaction receipt data is generated, where the final POS transaction receipt data comprises the first POS transaction summary data augmented with adjunctive POS transaction data distinguishable from the first POS transaction summary data. The final POS transaction receipt data is transmitted to at least one receipt generation device within a set of receipt generation devices coupled to the first POS machine.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Applicant: APTUS Business Logic PTE Ltd.
    Inventors: Tze Wei Koh, Tze Yong Koh, Beng Yee Wong
  • Publication number: 20200135456
    Abstract: Embodiments described herein generally relate to methods of depositing thin films and, more particularly, to depositing metal thin films. The methods herein provide a nucleation free conversion (NFC) approach which involves forming an amorphous silicon layer over the dielectric layer, and performing an NFC process which acts to convert the amorphous silicon layer into a thin metal film. In some embodiments, the NFC process is performed multiple times until the resulting thin metal film is continuous. A bulk metal is formed over the thin metal film.
    Type: Application
    Filed: October 8, 2019
    Publication date: April 30, 2020
    Inventors: Susmit Singha ROY, Yong WU, Srinivas GANDIKOTA
  • Publication number: 20200132765
    Abstract: A test apparatus may include transceivers and a global de-skew circuit. In a training mode, the transceivers provide first timing information obtained by delaying a first data signal in the range of up to a preset unit interval based on a clock signal and receive second timing information corresponding to timing differences between a slowest transceiver and the remaining transceivers. In an operation mode, the transceivers provide compensation data to a plurality of DUTs (Devices Under Test) substantially simultaneously. The compensation data may be obtained by delaying a second data signal by multiples of the preset unit interval in response to the second timing information. In the training mode, the global de-skew circuit receives the first timing information, calculates, using the first timing information, the timing differences between the slowest transceiver and the remaining transceivers , and provides the second timing information corresponding to the timing differences to the transceivers.
    Type: Application
    Filed: January 2, 2020
    Publication date: April 30, 2020
    Inventors: Chul Woo KIM, Dong Yoon KIM, In Hwa JUNG, Yong Ju KIM
  • Publication number: 20200135397
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.
    Type: Application
    Filed: December 26, 2019
    Publication date: April 30, 2020
    Inventors: Yong PARK, Hwi Dae KIM, Ki Pyo HONG
  • Publication number: 20200130529
    Abstract: A method for measuring a position, is performed by a vehicle assembly (VA) for alignment between a ground assembly (GA) and the VA. The method includes transmitting low frequency (LF) signals to initiate alignment with the GA and estimating a position of a vehicle using at least one sensor mounted on the vehicle. Information regarding the estimated position of the vehicle is provided to the GA and information regarding a position of the vehicle measured by LF receive antennas of the GA and an acceleration flag calculated by the GA is received. Accordingly, a transmission strength of the LF signals transmitted by the VA is adjusted based on the information regarding the position of the vehicle measured by the LF receive antennas and the acceleration flag.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 30, 2020
    Inventors: Jae Yong Seong, Chang Woo Ha, Ki Won Ko, Bong Ju Kim
  • Publication number: 20200135654
    Abstract: A semiconductor package includes a core structure having a first through-hole and including a frame having an opening, a passive component disposed in the opening, a first encapsulant covering the frame and the passive component, a first metal layer disposed on an inner surface of the first through-hole, and a second metal layer disposed on an inner surface of the opening; a first semiconductor chip disposed in the first through-hole and having a first connection pad; a second encapsulant covering the core structure and the first semiconductor chip; a connection structure disposed on the core structure and the first semiconductor chip and including a redistribution layer; and a metal pattern layer disposed on the second encapsulant. The first and second metal layers are connected to the metal pattern layer through first and second metal vias having heights different from each other.
    Type: Application
    Filed: September 13, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon LEE, Myung Sam Kang, Young Gwan Ko, Young Chan Ko, Chang Bae Lee
  • Publication number: 20200135765
    Abstract: A transistor display panel including a substrate, a gate line disposed on the substrate and extending in a first direction, a gate electrode protruding from the gate line, a gate insulating layer disposed on the gate line and the gate electrode, a semiconductor layer and an auxiliary layer disposed on the gate insulating layer and spaced apart from each other, a data line disposed on the gate insulating layer and extending in a second direction which is a direction crossing the gate line, a drain electrode disposed on the gate insulating layer and the semiconductor layer and spaced apart from the data line, and a pixel electrode connected to the drain electrode, in which the auxiliary layer overlaps an edge of the gate electrode in a plan view.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Byung Hwan CHU, Sho Yeon KIM, Wan-Soon IM, Yong Tae CHO
  • Publication number: 20200136060
    Abstract: The present disclosure relates to compounds of Formula (I) as useful materials for OLED's. X is O or S; Y1 to Y4 are N or R—C; at least one of R and R5 to R8 is CN or heteroaryl; and at least other one of R and R5 to R8 is diarylamino.
    Type: Application
    Filed: October 30, 2019
    Publication date: April 30, 2020
    Inventors: Yong Joo CHO, Hiroaki OZAWA, YuSeok YANG, Yoshitake SUZUKI, Shuo-Hsien CHENG, Kaori FUJISAWA, Cheok-Lam WONG, Jorge AGUILERA-IPARRAGUIRRE, Makoto YOSHIZAKI, Hayato KAKIZOE, Ayataka ENDO
  • Publication number: 20200137755
    Abstract: A multi-subscriber identification module (SIM) device includes: a first SIM configured to use a service of a first network; a second SIM configured to use a service of a second network; a first RF resource configured to support use of non-limited channel configuration according to a radio resource control (RRC) protocol; a second RF resource configured to support use of limited channel configuration according to the RRC protocol; and a baseband processor configured to selectively assign any one of the first RF resource and the second RF resource to the first SIM and the second SIM, based on information regarding the first network and the second network.
    Type: Application
    Filed: July 17, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-kyoung LEE, Chul-kyung KIM, Jong-wook NAM, Young-yong LEE
  • Publication number: 20200136438
    Abstract: A position alignment method, performed by a vehicle assembly (VA) including a reception pad receiving power transmitted from a transmission pad of a ground assembly (GA) is provided. The method includes transmitting a magnetic field using a transmitting device disposed on a reception pad, the transmitting device operating with low frequency (LF); receiving a magnetic field related value from the GA, the magnetic field being detected by an LF receiving device disposed on the transmission pad of the GA; and calculating, by a controller, a distance between the transmission pad and the reception pad using the magnetic field related value. A part of the transmitting device is disposed to arrange a magnetic field formed by the part of the transmitting device in a 0°, 90°, 180°, or 270° direction with respect to a magnetic field formed by a part of the LF receiving device.
    Type: Application
    Filed: October 30, 2019
    Publication date: April 30, 2020
    Inventor: Jae Yong Seong
  • Publication number: 20200130594
    Abstract: A glove box apparatus may include: a fixed part fixed to a vehicle body, and having a guide rail installed at a side surface thereof; a housing having a protrusion part moved along the guide rail, and configured to open/close the fixed part; a sensor part configured to sense a contact with the protrusion part; and a driving part configured to move the housing to open/close the fixed part, and move the housing toward the fixed part when the contact between the sensor part and the protrusion part is released.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Jae Whoan PARK, DONG IL SON, Chang Woo KANG, Tae Yong EOM
  • Publication number: 20200135626
    Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.
    Type: Application
    Filed: October 25, 2018
    Publication date: April 30, 2020
    Inventors: Woon Yik Yong, Andreas Kucher, Chia-Yen Lee, Shao Ping Wan
  • Publication number: 20200135790
    Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 30, 2020
    Inventors: Yong-hoon KIM, Ji-chul KIM, Seung-yong CHA, Jae-choon KIM