Patents by Inventor Yong Bin Fan

Yong Bin Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
    Publication number: 20180342394
    Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first polysilicon layer is formed on a substrate. A planarization process to the first polysilicon layer is performed. A first etching back process to the first polysilicon layer is performed after the planarization process. A second etching back process to the first polysilicon layer is performed after the first etching back process. A first wet clean process to the first polysilicon layer is performed after the first etching back process and before the second etching back process.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 29, 2018
    Inventors: Zhi Qiang Mu, Chow Yee Lim, Hui Yang, YONG BIN FAN, JIANJUN YANG, Chih-Chien Chang
  • Manufacturing method of semiconductor structure
    Patent number: 10141194
    Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first polysilicon layer is formed on a substrate. A planarization process to the first polysilicon layer is performed. A first etching back process to the first polysilicon layer is performed after the planarization process. A second etching back process to the first polysilicon layer is performed after the first etching back process. A first wet clean process to the first polysilicon layer is performed after the first etching back process and before the second etching back process.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 27, 2018
    Assignee: UNITED MICROELETRONICS CORP.
    Inventors: Zhi Qiang Mu, Chow Yee Lim, Hui Yang, Yong Bin Fan, Jianjun Yang, Chih-Chien Chang