Abstract: An apparatus relates generally to a reduced load memory module. In such an apparatus, there is a circuit platform with a plurality of memory chips coupled to the circuit platform. Each memory chip of the plurality of memory chips each has a plurality of memory dies. At least one controller is coupled to the circuit platform and further coupled to the plurality of memory chips for communication with the plurality of memory dies thereof. The at least one controller is for receiving chip select signals to provide a plurality of rank select signals in excess of the chip select signals. The plurality of memory dies are coupled with wire bonds within the plurality of memory chips for a reduced load for coupling the circuit platform for communicating via a memory channel. The load is sufficiently reduced for having at least two instances of the memory module share the memory channel.

Abstract: The invention discloses a system for squeezing, smashing and winnowing municipal solid waste (MSW). The system comprises a primary squeezing and smashing, device and a secondary smashing and winnowing device. The system of the invention has good effect m squeezing, smashing and winnowing, can greatly reduce the water content of MSW and efficiently separate the MSW into combustible matters and non-combustible matters, so as to facilitate further subsequent utilization of the municipal waste; moreover, an upper jaw of a jaw crusher is connected with a spring device, so that the squeezing pressure, smashing effect and processing capacity of the jaw crusher can be adjusted according to the amount of the MSW. In addition, the system of the invention is further provided with emergency brake switches, spring protection devices and a sieve, so as to ensure the stability and the reliability of the system.

Abstract: The present invention related to an resin compound, especially to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition of the present invention employs ester compound and flexible amine hardener to cure the epoxy resin, and the resin composition possesses excellent dielectric properties as well as high glass transition temperature and good toughness. The epoxy resin composition of the present invention, which applied in a prepreg and a copper-clad laminate, possesses excellent dielectric properties, high glass transition temperature and good impact toughness.

Abstract: An orthodontic appliance may include an archwire and multiple orthodontic brackets. The archwire may fit within a human mouth and contain multiple male connectors. Each orthodontic bracket may have a configuration that facilitates attaching the orthodontic bracket to a single tooth. Each orthodontic bracket may allow one of the male connectors to be locked into the orthodontic bracket with a snapping action. The male connector may be unable to slide with respect to the orthodontic bracket after being locked in the orthodontic bracket. A manual unlocking action may allow the male connector to disengage from the orthodontic bracket.

Abstract: A method of fabricating a hollow-core photonic-bandgap fiber, comprising the steps of: providing a stack of capillaries, wherein the stack has a hollow core and the capillaries at a boundary of the core comprise a plurality of first, corner core capillaries and a plurality of second, intermediate core capillaries; applying a pressure differential between the corner core capillaries and the intermediate core capillaries, whereby a size of the corner core capillaries can be controlled in relation to the intermediate core capillaries; and reducing the stack to a fiber, wherein the fiber has a hollow core and a cladding which surrounds the core at a core boundary and comprises a lattice or network of struts and interstitial nodes which together define an array of cavities.

Abstract: A device management method for use in a primary router, includes: establishing a management connection with a relay router; acquiring a management interface identifier from the relay router via the management connection, the management interface identifier being an identifier of an Application Programming Interface (API) in the relay router for providing a management function; and transmitting a management instruction to the relay router via the management connection, the management instruction carrying the management interface identifier and being configured to manage an electronic device connected to the relay router.

Abstract: The invention relates to a method for the production of adenosine 3?,5?-monophosphate (cAMP) by a permeable microbial strain which uses polyols for protecting activities of enzymes and a cAMP precursor and phosphate as substrates. Glucose is used as an energy provider and metal ions and an organic solvent such as acetone are used in the medium.

Abstract: A solid imaging apparatus and method employing levels of exposure varied with gray scale or time or both of digitally light projected image of a cross-section of a three-dimensional object on a solidifiable photopolymer build material. The gray scale levels of exposure of projected pixels permits the polymerization boundaries in projected boundary pixels to be controlled to achieve preserved image features in a three-dimensional object and smooth out rough or uneven edges that would otherwise occur using digital light projectors that are limited by the number of pixels in an image projected over the size of the image. Software is used to control intensity parameters applied to pixels to be illuminated in the image projected in the cross-section being exposed in the image plane.

Abstract: A method includes: (1) applying stimulations to a system, wherein applying the stimulations includes modulating, over time, characteristics of the stimulations; (2) measuring a time-varying response of the system to the stimulations; (3) fitting the time-varying response of the system into a model of the system; and (4) using the model of the system, identifying an optimized combination of characteristics of the stimulations to yield a desired response of the system.

Abstract: The present invention provides materials and methods useful to treat various sGC?1-expressing cancers. Materials include peptides which interfere with sGC?1's pro-survival functions, thereby resulting in apoptosis of sGC?1-expressing cells. In addition, the present invention provides screening assays, diagnostic assays, methods to prognose, methods to treat, and kits.

Abstract: A method for preparing methacrolein from t-butanol, specifically a method for preparing methacrolein by using t-butanol as a starting material, is disclosed, comprising passing the starting material through a fixed bed reactor filled with catalyst, wherein the fixed bed reactor is divided to n reaction zones from the inlet of the starting material to the outlet of the starting material and each zone is filled with catalysts of different catalytic activities; wherein the catalytic activity of the catalyst in the first reaction zone is higher than the catalytic activity of the catalyst in the second reaction zone, and the catalytic activity of the catalyst is gradually increased from the second reaction zone to the last reaction zone; and n is an integer between 3 to 10.

Abstract: Described herein are compositions and methods useful to treat cancers. In addition, the present invention provides screening assays, diagnostic assays, methods to prognose, methods to treat, and kits.

Abstract: An apparatus relates generally to a microelectronic assembly. In this apparatus, a first substrate and a second substrate each have opposing surfaces. Contact arrangements are disposed on a surface of the first substrate, including: first contacts disposed as a ring to provide a first array of the contact arrangements on such surface; and second contacts disposed interior to the ring of the first contacts to provide a second array of the contact arrangements on the first surface. The first contacts and the second contacts are for interconnection with first microelectronic dies and second microelectronic dies. The second microelectronic dies are disposed below the first microelectronic dies in same a package as the first microelectronic dies. The first microelectronic dies and the second microelectronic dies include at least two ranks thereof for commonly sharing the first contacts and the second contacts among the first microelectronic dies and the second microelectronic dies.

Abstract: A microelectronic package can include a substrate and a microelectronic element. The substrate can include terminals comprising at least first power terminals and other terminals in an area array at a surface of the substrate. The substrate can also include a power plane element electrically coupled to the first power terminals. The area array can have a peripheral edge and a continuous gap between the terminals extending inwardly from the peripheral edge in a direction parallel to the surface. The terminals on opposite sides of the gap can be spaced from one another by at least 1.5 times a minimum pitch of the terminals. The power plane element can extend within the gap from at least the peripheral edge at least to the first power terminals. Each first power terminal can be separated from the peripheral edge by two or more of the other terminals.

Abstract: An apparatus relates generally to a microelectronic assembly. In such an apparatus, a contact arrangements are disposed on a first surface of a first substrate, including first contacts disposed as a first ring array; second contacts disposed interior to the first contacts as a second ring array; third contacts disposed interior to the second contacts as a third ring array; and fourth contacts disposed interior to the third contacts on the first surface as an innermost array. The first ring array, the second ring array, and the third ring array are concentric rings with the innermost array in a central region of the concentric rings. The first contacts and the fourth contacts are for interconnection with first microelectronic dies. The second contacts and the third contacts are for interconnection with second microelectronic dies.

Abstract: A method for a wireless router to perform connection management, includes: when a device tries to establish a wireless connection with the wireless router, counting a number of times of authentication failure of the device in a preset time period; and when the number of times of authentication failure is larger than or equal to a preset number threshold, performing a preset operation of risk treatment.

Abstract: The present disclosure provides a method and an apparatus for intercepting a multicast protocol packet and a switch. The method for intercepting a multicast protocol packet includes: acquiring multicast work information of a router; acquiring a multicast protocol parameter of the switch according to the multicast work information of the router, where the multicast protocol parameter includes an interval of sending general query packets, a robustness variable, and a query response interval; acquiring port aging time of the switch according to the multicast protocol parameter of the switch; and aging a port if no multicast protocol packet is received on the port within the port aging time. The present disclosure further provides a corresponding apparatus and a switch including the apparatus.

Abstract: A gas separation cartridge including a housing comprising an inlet port for an air sample to enter; a top cover attached to the housing; an upper cavity comprising individual chambers comprised of a chemical or an absorbent or a mixture thereof attached to the top cover wherein each end of each chamber has an opening; a bottom cover attached to the upper cavity, wherein the bottom cover comprises a lower cavity, a separate opening for an air sample traveling from an individual chamber to pass through, and a separate opening for an air sample that does not pass through an individual chamber; and a base upon which the bottom cover of the cartridge is seated, wherein the base has an exit port.

Abstract: The present invention provides materials and methods useful to treat various sGC?1-expressing cancers. Materials include peptides which interfere with sGC?1's pro-survival functions, thereby resulting in apoptosis of sGC?1-expressing cells. In addition, the present invention provides screening assays, diagnostic assays, methods to prognose, methods to treat, and kits.

Abstract: A microelectronic package can include a substrate and a microelectronic element. The substrate can include terminals comprising at least first power terminals and other terminals in an area array at a surface of the substrate. The substrate can also include a power plane element electrically coupled to the first power terminals. The area array can have a peripheral edge and a continuous gap between the terminals extending inwardly from the peripheral edge in a direction parallel to the surface. The terminals on opposite sides of the gap can be spaced from one another by at least 1.5 times a minimum pitch of the terminals. The power plane element can extend within the gap from at least the peripheral edge at least to the first power terminals. Each first power terminal can be separated from the peripheral edge by two or more of the other terminals.