Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.

Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.

Abstract: Provided is a photo printer including: a paper supply unit for accommodating stacked sheets of paper and having a pickup roller protruding from a bottom surface thereof; a platen roller provided at a front end of the paper supply unit; a head provided above the platen roller so as to form an image on the paper fed; a motor for providing a driving force to the platen roller; deceleration gears for decreasing revolutions per minute of the motor; a gear plate provided at one side of the paper supply unit and having the deceleration gears shaft-coupled thereto; and a motor plate having an aligning hole adapted to pass the shaft of the deceleration gear therethrough and a motor hole adapted to pass a rotary shaft of the motor therethrough.

Abstract: Provided is a photo printer including: a base for accommodating paper therein; a pick-up roller protruding from a bottom surface of the base to feed the paper accommodated in the base in a forward direction; a platen roller for discharging in the forward direction the paper; a head provided above the platen roller to apply heat to the paper; a swing bracket having a front side to which the head is coupled and a rear side rotatably coupled to the base; pressurizing means for pressurizing the swing bracket down to allow the swing bracket to come into close contact with the paper; and head supporting members provided on side walls of the base to support the front side of the swing bracket under the swing bracket and each having an eccentric portion adapted to lift the head up through rotation.

Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.

Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.

Abstract: An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.

Abstract: A substrate with an electronic component embedded therein includes a core substrate including an insulating body having a first surface and a second surface, opposite to the first surface, a first wiring layer embedded in the insulating body such that one surface thereof is exposed from the first surface, and a second wiring layer disposed on the insulating body to protrude on the second surface, the core substrate having a cavity penetrating a portion of the insulating body from the first surface toward the second surface and having a stopper layer as a bottom surface thereof; an electronic component disposed on the stopper layer in the cavity; a first insulating material covering at least a portion of each of the core substrate and the electronic component; and a third wiring layer disposed on the first insulating material.

Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.

Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.

Abstract: A substrate having an electronic component embedded therein includes a core substrate including first and second wiring layers disposed on different levels and one or more insulating layers disposed between the first and second wiring layers, having a cavity in which a stopper layer is disposed on a bottom surface of the cavity, and including a groove disposed around the stopper layer on the bottom surface; an electronic component disposed on the stopper layer in the cavity; an insulating material covering at least a portion of each of the core substrate and the electronic component and disposed in at least a portion of each of the cavity and the groove; and a third wiring layer disposed on the insulating material. The stopper layer protrudes on the bottom surface.

Abstract: A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

Abstract: Provided is a photo printer including: a base for accommodating paper therein; a pick-up roller protruding from a bottom surface of the base to feed the paper accommodated in the base in a forward direction; a platen roller for discharging in the forward direction the paper; a head provided above the platen roller to apply heat to the paper; a swing bracket having a front side to which the head is coupled and a rear side rotatably coupled to the base; pressurizing means for pressurizing the swing bracket down to allow the swing bracket to come into close contact with the paper; and head supporting members provided on side walls of the base to support the front side of the swing bracket under the swing bracket and each having an eccentric portion adapted to lift the head up through rotation.