Abstract: According to an example aspect of the present invention, there is provided isolated bioactive mitochondria coated with a layer of Metal Organic Framework (MOF) and a method for intracellular delivery and release of said coated bioactive mitochondria in cells. The invention also provides a method for maintaining bioactivity and for increasing storage time of bioactive mitochondria by using MOF encapsulation.

Abstract: Provided in the embodiments of the present disclosure are a routing method and apparatus, a cloud resource registering method and apparatus, and a storage medium and an electronic apparatus.

Abstract: Embodiments of the present disclosure provide a method and device for sending a bandwidth request, and a storage medium and an electronic device. The method includes: in a bandwidth allocation acquired by a transmission container, sending a payload and a bandwidth request in sequence to an optical line terminal (OLT), wherein the payload carries first data, the bandwidth request carries a data volume of a second data, and the data volume of the second data is a data volume cached in the transmission container when the bandwidth request is generated.

Abstract: This application discloses a box, a battery, and an electrical apparatus. The box includes a box body and a heat dissipation assembly. A cavity is provided inside the box body. The heat dissipation assembly includes a heat dissipation plate arranged inside the cavity, and a heat dissipation fin arranged on a side of the heat dissipation plate away from the cavity, the heat dissipation fin intersecting with the heat dissipation plate. The box can greatly increase a heat exchange area between the box and the air through the heat dissipation plate and the heat dissipation fin, thereby enhancing the heat dissipation performance of the box.

Abstract: Embodiments of the present disclosure provide an activation method, an activation device, a control device, a network device and an optical network system. A new-system ONU is activated on a first OLT in an existing system, and then activation information of the new-system ONU is sent to a second OLT in a new system by the first OLT or by an activation agent ONU which has been activated on the second OLT, thereby enabling activation of the new-system ONU on the second OLT.

Abstract: A unidirectional conductive joint assembly includes a unidirectional conductive device, wherein a conductive sheet is electrically connected to a conductive end of the unidirectional conductive device, another conductive sheet is electrically connected to another conductive end of the unidirectional conductive device, insulating films are laminated on two sides of each conductive sheet, and each conductive sheet is sandwiched between two insulating films; and the two conductive ends of the unidirectional conductive device are insulated and sealed in an insulating package, portions of the conductive sheets on the sides of the insulating films close to the unidirectional conductive device are first conductive portions, the first conductive portions and film sides of the insulating films close to the first conductive portions are all insulated and sealed in the insulating package, and the conductive sheets and the insulating films are all partially located outside the insulating package.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a cooling component, and a frame structure that is coupled to the cooling component by way of at least one fastener. The SoW assembly can include an interposer assembly that is disposed on a SoW. At least a portion of the interposer assembly can be disposed between the cooling component and the frame structure. The SoW assembly can include a gasket disposed between the portion of the interposer assembly and the frame structure.

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: Embodiments of the present disclosure provide an activation method, an activation device, a control device, a network device and an optical network system. A new-system ONU is activated on a first OLT in an existing system, and then activation information of the new-system ONU is sent to a second OLT in a new system by the first OLT or by an activation agent ONU which has been activated on the second OLT, thereby enabling activation of the new-system ONU on the second OLT.

Abstract: Provided are a data processing method and apparatus for a Passive Optical Network (PON) system and a PON system. The method includes: a first partial bandwidth is allocated to a first Optical Network Unit (ONU) within a first time window, the first ONU having completed registration and being in a working state; and a first data frame from the first ONU is received within a time corresponding to the first partial bandwidth, and a second data frame from a second ONU is detected within the first time window, the second ONU having not completed registration.

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

Abstract: A compressor liquid accumulator and a compressor are provided. The compressor liquid accumulator has a first suction cup and a second suction cup. The surface of the first suction cup, which faces the second suction cup, is provided with a first welding surface. The facing of the second suction cup, which faces the first suction cup, is provided with a second welding surface. The first welding surface and the second welding surface are connected in a welded manner. The first suction cup and the second suction cup define a cavity. The first suction cup is provided with a first extending portion is adjacent to the first welding surface. The first extending portion is located in a part of the cavity defined by the second suction cup.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: Provided are a data processing method and apparatus for a Passive Optical Network (PON) system and a PON system. The method includes: a first partial bandwidth is allocated to a first Optical Network Unit (ONU) within a first time window, the first ONU having completed registration and being in a working state; and a first data frame from the first ONU is received within a time corresponding to the first partial bandwidth, and a second data frame from a second ONU is detected within the first time window, the second ONU having not completed registration.

Abstract: Disclosed is a method for preparing cellulose and lignin oil by depolymerizing lignocellulose without exogenous hydrogen, including: performing reaction on the lignocellulose dispersed into an aqueous medium at 120° C. to 180° C. under the action of a catalyst; and separating a reaction product to obtain the cellulose and the lignin oil. The catalyst includes a carrier and an active ingredient loaded on the carrier, where the active ingredient is selected from one of platinum, palladium, ruthenium and nickel; the carrier is selected from one of a metal oxide, a metal composite material, silicon dioxide, nitrogen-doped carbon, molybdenum carbide and molybdenum nitride; and the metal oxide is selected from one of niobium oxide, tantalum oxide, tungsten oxide, zirconium oxide, aluminum oxide, titanium dioxide and molybdenum oxide.

Abstract: A vehicle window assembly and a vehicle are provided. The vehicle window assembly includes a vehicle window glass, at least two sensors, and a heating component. The vehicle window glass has a functional region. At least two signal transmission windows are defined at intervals in the functional region. The at least two sensors are mounted at an inner side of the vehicle window glass. Positions of the at least two sensors are in a one-to-one correspondence with positions of the at least two signal transmission windows. The heating component includes at least one linear heating element. At least one signal transmission window of the at least two signal transmission windows is extended through by the at least one linear heating element multiple times. At least another signal transmission window of the at least two signal transmission windows is not extended through by the at least one linear heating element.

Abstract: Provided are a passive optical network (PON) multi-channel binding transmission method, a PON node and a storage medium. The PON multi-channel binding transmission method includes: determining a multi-channel transmission mode of to-be-sent data according to a data transmission efficiency and a preset data transmission efficiency threshold, where the data transmission efficiency for determining the multi-channel transmission mode is higher than or equal to the preset data transmission efficiency threshold; and transmitting the to-be-sent data on a data transmission channel binding combination of one or more data transmission channels according to the multi-channel transmission mode.

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.