Abstract: The present disclosure relates to an assembly type pallet, that includes a plurality of plates having a secure hole on a plate surface, and disposed side by side to each another; a plurality of support frames that are disposed in a direction intersecting the plate to support a lower portion of the plate, an inside of the support frame being provided with an inner space along a longitudinal direction, an upper surface of the support frame being provided with a seating surface against which a lower surface of the plate is supported, and the seating surface being provided with an insertion hole communicating with the inner space; a first secure member that is disposed on the lower surface of the plate and that is provided with an insertion unit which is inserted into the insertion hole of the support frame to secure the plate to the support frame; and a second secure member that is inserted into the inner space of the support frame to secure the insertion unit of the first secure member to the support frame.

Abstract: The present disclosure relates to a foldable container which includes a pair of side walls disposed side-by-side; a guide rail disposed in a direction transverse-crossing between lower ends of the one pair of side walls to guide movement of at least one of the side walls; an upper plate and a lower plate, wherein each of the upper plate and the lower plate is divided into at least two unit plates that are rotatably connected to each other so as to be folded by the movement of the side wall, and wherein each of the upper plate and the lower plate connects upper ends of the pair of side walls to each other and connects lower ends of the one pair of side walls to each other; and a door rotatably connected to each of a front end and a rear end of the side wall.

Abstract: A flexible display device includes a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.

Abstract: A display device includes a display panel includes a display area in which an image is displayed and a first non-display area in which a pad portion is located. The display panel includes a first bending portion in the display area, the first bending portion being bent at a first curvature radius, and a second bending portion in the first non-display area, the second bending portion being bent at a second curvature radius that is smaller than the first curvature radius.

Abstract: A flexible display device includes a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.

Abstract: A display device includes a display panel and a touch sensor which is disposed on the display panel. The display panel includes a display unit including a pixel, a driving circuit unit disposed outside the display unit, and a first static electricity blocking layer disposed on the driving circuit unit. The touch sensor includes sensing electrodes disposed on the display unit and a second static electricity blocking layer disposed overlapping the first static electricity blocking layer outside of the sensing electrodes.

Abstract: A display device includes a display panel includes a display area in which an image is displayed and a first non-display area in which a pad portion is located. The display panel includes a first bending portion in the display area, the first bending portion being bent at a first curvature radius, and a second bending portion in the first non-display area, the second bending portion being bent at a second curvature radius that is smaller than the first curvature radius.

Abstract: A display device includes a display panel and a touch sensor which is disposed on the display panel. The display panel includes a display unit including a pixel, a driving circuit unit disposed outside the display unit, and a first static electricity blocking layer disposed on the driving circuit unit. The touch sensor includes sensing electrodes disposed on the display unit and a second static electricity blocking layer disposed overlapping the first static electricity blocking layer outside of the sensing electrodes.

Abstract: A flexible display device includes a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.

Abstract: A flexible display device includes a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.

Abstract: A semiconductor chip may include a semiconductor substrate having a front surface and a rear surface which faces away from the front surface. The semiconductor chip may include a fixed metal layer formed over the front surface of the semiconductor substrate, and having first metal lines formed in the fixed metal layer. The semiconductor chip may include a configurable metal layer formed over the fixed metal layer to have one surface which faces the fixed metal layer and the other surface which faces away from the one surface, and having second metal lines formed in the configurable metal layer such that at least one end of the second metal lines disposed on the one surface are respectively connected with the first metal lines and other ends of the second metal lines facing away from the at least one end are disposed at predetermined positions on the other surface.

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip flip-chip bonded to a first surface of the substrate. The semiconductor package may include second semiconductor chips respectively flip-chip bonded to portions of the first surface of the substrate adjacent to both ends of the first semiconductor chip. The semiconductor package may include a third semiconductor chip solder-jointed to the first surface of the substrate covering the first semiconductor chip and portions of the second semiconductor chips.

Abstract: A flexible display device includes a substrate, a light emitting layer, a first insulating layer, and a conductive layer. The substrate includes a bent region and a non-bent region. The light emitting layer overlaps the non-bent region. The first insulating layer is disposed on the substrate. The conductive layer is disposed on the first insulating layer. A sidewall of the first insulating layer includes a first tapered surface. The first tapered surface includes at least three curved surface portions continuously arranged with one another.

Abstract: The present disclosure relates to a foldable container which includes a pair of side walls disposed side-by-side; a guide rail disposed in a direction transverse-crossing between lower ends of the one pair of side walls to guide movement of at least one of the side walls; an upper plate and a lower plate, wherein each of the upper plate and the lower plate is divided into at least two unit plates that are rotatably connected to each other so as to be folded by the movement of the side wall, and wherein each of the upper plate and the lower plate connects upper ends of the pair of side walls to each other and connects lower ends of the one pair of side walls to each other; and a door rotatably connected to each of a front end and a rear end of the side wall.

Abstract: A display device includes a display panel includes a display area in which an image is displayed and a first non-display area in which a pad portion is located. The display panel includes a first bending portion in the display area, the first bending portion being bent at a first curvature radius, and a second bending portion in the first non-display area, the second bending portion being bent at a second curvature radius that is smaller than the first curvature radius.

Abstract: The present disclosure provides a semiconductor chip including a semiconductor substrate having a front surface and a rear surface which faces away from the front surface. The semiconductor chip includes a fixed metal layer formed over the front surface of the semiconductor substrate, and having first metal lines formed in the fixed metal layer. The semiconductor chip includes a configurable metal layer formed over the fixed metal layer to have one surface which faces the fixed metal layer and the other surface which faces away from the one surface, and having second metal lines formed in the configurable metal layer such that at least one end of the second metal lines disposed on the one surface are respectively connected with the first metal lines and other ends of the second metal lines facing away from the at least one end are disposed at predetermined positions on the other surface.

Abstract: A semiconductor package may include a first semiconductor chip having a plurality of first bonding pads arranged at a first pitch on a first active surface. The semiconductor package may include one or more reconfigurable package units each including a second semiconductor chip having a plurality of second bonding pads arranged at a second pitch on a second active surface; a semiconductor chip connector arranged spaced apart from the second semiconductor chip and having a plurality of through vias arranged at the first pitch; a molding layer surrounding side surfaces of the second semiconductor chip and the semiconductor chip connector; and redistribution lines formed over the second semiconductor chip, the semiconductor chip connector, and the molding layer.

Abstract: A semiconductor package may include first semiconductor chips disposed in a rotationally symmetrical structure. First bonding pads are arranged over the bottom surfaces of the first semiconductor chips. The semiconductor package may also include a first encapsulation member formed to surround at least side surfaces of the first semiconductor chips. The semiconductor package may also include via patterns formed in the first encapsulation member. The semiconductor package may also include second semiconductor chips stacked over top surfaces of the first semiconductor chips and the first encapsulation member including the via patterns in such a way as to form step shapes with the first semiconductor chips. Second bonding pads electrically connected to the via patterns are arranged over bottom surfaces of the second semiconductor chips.

Abstract: A semiconductor package may be provided. The semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip flip-chip bonded to a first surface of the substrate. The semiconductor package may include second semiconductor chips respectively flip-chip bonded to portions of the first surface of the substrate adjacent to both ends of the first semiconductor chip. The semiconductor package may include a third semiconductor chip solder-jointed to the first surface of the substrate covering the first semiconductor chip and portions of the second semiconductor chips.

Abstract: A semiconductor package may include first semiconductor chips disposed in a rotationally symmetrical structure. First bonding pads are arranged over the bottom surfaces of the first semiconductor chips. The semiconductor package may also include a first encapsulation member formed to surround at least side surfaces of the first semiconductor chips. The semiconductor package may also include via patterns formed in the first encapsulation member. The semiconductor package may also include second semiconductor chips stacked over top surfaces of the first semiconductor chips and the first encapsulation member including the via patterns in such a way as to form step shapes with the first semiconductor chips. Second bonding pads electrically connected to the via patterns are arranged over bottom surfaces of the second semiconductor chips.