Patents by Inventor Yong-Jin Jung

Yong-Jin Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package manufacturing method including screen printing process
    Publication number: 20050287708
    Abstract: A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
    Type: Application
    Filed: December 6, 2004
    Publication date: December 29, 2005
    Inventors: Sang-Young Kim, Gil-Beag Kim, Yong-Jin Jung, Jun-Soo Han