Patents by Inventor Yong Liang

Yong Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8589567
    Abstract: A method and an apparatus are disclosed for improving SIP parse performance. The method comprises the steps of: receiving a text-based SIP message to be sent to a SIP server; according to a SIP message filter table, determining whether the text-based SIP message needs to be transformed to a token-based message; and in the case that the text-based SIP message needs to be transformed to a token-based message, performing the transformation and sending the transformed token-based message to said SIP server, otherwise directly sending the text-based SIP message to said SIP server. According to the present principles, larger SIP message throughput in a SIP server and better utilization of resources of a front end device can be achieved.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 19, 2013
    Assignee: International Business Machines Corporation
    Inventors: Zhi Yong Liang, Wei Lu, Ravinder Kumar Sabhikhi, Ling Shao, Bo Yang, Yi Xin Zhao
  • Publication number: 20130303534
    Abstract: Compounds active on protein kinases are described, as well as methods of using such compounds to treat diseases and conditions associated with aberrant activity of protein kinases.
    Type: Application
    Filed: March 5, 2013
    Publication date: November 14, 2013
    Inventors: PRABHA N. IBRAHIM, DEAN R. ARTIS, RYAN BREMER, GASTON HABETS, SHUMEYE MAMO, MARIKA NESPI, CHAO ZHANG, JIAZHONG ZHANG, YONG-LIANG ZHU, REBECCA ZUCKERMAN, BRIAN WEST, YOSHISA SUZUKI, JIANMING TSAI, KLAUS-PETER HIRTH, GIDEON BOLLAG, WAYNE SPEVAK, HANNA CHO, SAMUEL J. GILLETTE, GUOXIAN WU, HONGYAO ZHU, SHENGHUA SHI
  • Patent number: 8541418
    Abstract: The present invention provides compounds having a structure according to Formula (I): or a salt or solvate thereof, wherein ring A, E1, E2, R1, R2, R3 and R4 are defined herein. The invention further provides pharmaceutical compositions including the compounds of the invention and methods of making and using the compounds and compositions of the invention, e.g., in the treatment and prevention of various disorders, such as Parkinson's disease.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: September 24, 2013
    Assignee: Elan Pharmaceutical, Inc.
    Inventors: Robert A. Galemmo, Dean R. Artis, Xiaocong Michael Ye, Danielle Aubele, Anh Truong, Simeon Bowers, Roy K. Hom, Yong-Liang Zhu, R. Jeffrey Neitz, Jennifer Sealy, Marc Adler, Paul Beroza, John P. Anderson
  • Publication number: 20130231335
    Abstract: The present invention provides compounds having a structure according to Formula (I): or a salt or solvate thereof, wherein ring A, X, R1, R2, R3, R4, R5 and R6, are defined herein. The invention further provides pharmaceutical compositions including the compounds of the invention and methods of making and using the compounds and compositions of the invention, e.g., in the treatment and prevention of various disorders, such as Parkinson's disease.
    Type: Application
    Filed: April 17, 2013
    Publication date: September 5, 2013
    Applicant: Elan Pharmaceuticals, Inc.
    Inventors: Robert A. Galemmo, Dean R. Artis, Xiaocong Michael Ye, Danielle Aubele, Anh Truong, Simeon Bowers, Roy K. Hom, Yong-Liang Zhu, R. Jeffrey Neitz, Jennifer Sealy, Marc Adler, Paul Beroza, John P. Anderson
  • Patent number: 8525336
    Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: September 3, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Pang-Chun Lin, Yueh-Ying Tsai, Yong-Liang Chen
  • Publication number: 20130227649
    Abstract: The invention proposes methods and devices for managing domains. The domains comprise a plurality of member devices, and the method comprises the steps of: storing (S500, S501), by a first domain manager (M1), domain management information (P1, P2, P3, P4 and P5) in said plurality of member devices; and obtaining (S510, S511), by a second domain manager (M2), said domain management information from at least one of said plurality of member devices. In comparison with the prior art, where the domain management information is maintained in the domain authority, the embodiment decreases the work load of the domain authority and provides conveniences.
    Type: Application
    Filed: November 15, 2011
    Publication date: August 29, 2013
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Yong Liang Liu, Fulong Ma, Hui Li, Changjie Wang
  • Publication number: 20130212657
    Abstract: A computerized method resets an unlocking password of an electronic device. Verification information used for resetting a first unlocking password currently used for unlocking the electronic device, and a destination for receiving a second unlocking password in place of the first unlocking password are preset in the electronic device. A request message from a terminal device is monitored in real-time, and checked for the inclusion of the verification information. The second unlocking password is generated, the first unlocking password of the electronic device is replaced by the second unlocking password, and the second unlocking password is sent to the destination if the verification information is included in the request message.
    Type: Application
    Filed: June 15, 2012
    Publication date: August 15, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventor: YONG-LIANG LU
  • Publication number: 20130168288
    Abstract: A foldable support for supporting a portable computing device includes a main frame, a back plate, and a hinge assembly connecting the back plate to the main frame, the hinge assembly being able to position and lock the back plate in a desired position with respect to the main frame. A base member is rotatably connected to a bottom of the main frame. When the portable computing device is supported by the foldable support, a back of the portable computing device rests against the main frame, and a bottom of the portable computing device rests on the base member.
    Type: Application
    Filed: June 28, 2012
    Publication date: July 4, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: YONG LIANG, LIN-LIN PAN, CHIA-TE YU, LIANG-YI LU
  • Publication number: 20130166958
    Abstract: A burning control method for burning software to at least one chip is provided, the method includes: controlling the at least one chip to enter a download mode when the at least one chip is startup; initializing the at least one chip when the chip enters the download mode; executing a burning process to burn software into the at least one chip when the chip is initialized; controlling the at least one chip to enter the test mode when the burning process is completed; testing whether the software has been burned into the at least one chip successfully when the at least one chip is in the test mode.
    Type: Application
    Filed: August 2, 2012
    Publication date: June 27, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventor: YONG-LIANG LU
  • Publication number: 20130149980
    Abstract: A method for switching radio receivers includes: directing a FM radio receiver or an Internet radio receiver of an electronic device to receive radio signals; monitoring the intensity of radio signals received by the FM radio receiver and the network data stream received by the Internet radio receiver periodically; determining whether a switch condition for switching radio receivers between the FM radio receiver and the Internet radio receiver is satisfied according to the radio receiver currently employed, the intensity of radio signals received by the FM radio receiver, and the network data stream received by the Internet radio receiver; and switching between the FM radio receiver and the Internet radio receiver if the switch condition is satisfied. A related electronic device is also provided.
    Type: Application
    Filed: August 16, 2012
    Publication date: June 13, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: YONG-LIANG LU, YING-HE ZHAO, XUE-SHUN LIU, HUAN-HUAN ZHANG, BI-QING LUO, XIN LU, FEI WANG, BIAO-GENG ZHONG
  • Patent number: 8445503
    Abstract: The present invention provides compounds having a structure according to Formula (I): or a salt or solvate thereof, wherein ring A, X, R1, R2, R3, R4, R5 and R6 are defined herein. The invention further provides pharmaceutical compositions including the compounds of the invention and methods of making and using the compounds and compositions of the invention, e.g., in the treatment and prevention of various disorders, such as Parkinson's disease.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 21, 2013
    Assignee: Elan Pharmaceuticals, Inc.
    Inventors: Robert A. Galemmo, Dean R. Artis, Xiaocong Michael Ye, Danielle Aubele, Anh Truong, Simeon Bowers, Roy K. Hom, Yong-Liang Zhu, R. Jeffrey Neitz, Jennifer Sealy, Marc Adler, Paul Beroza, John P. Anderson
  • Publication number: 20130093086
    Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.
    Type: Application
    Filed: January 12, 2012
    Publication date: April 18, 2013
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Pang-Chun Lin, Yueh-Ying Tsai, Yong-Liang Chen
  • Publication number: 20130088831
    Abstract: An expansion module for an interface card includes a transfer circuit-board, an expansion slot, a bottom-plate, a lateral-frame, and a latch. The transfer circuit-board has an electrical connector to be inserted into a card slot of a main circuit-board. The expansion slot is disposed on the transfer circuit-board and used for the interface card to be inserted into it, so as to connect the interface card to the main circuit-board. The transfer circuit-board is mounted onto the bottom-plate. The lateral-frame extends from the bottom-plate to define an accommodating space between the bottom-plate and the lateral-frame, and the transfer circuit-board is located in the accommodating space. The latch is pivoted to the lateral-frame and moves between a releasing position and a latching position. The latch has a first clamping element, and at the latching position the latch clamps and fixes the interface card with the first clamping element.
    Type: Application
    Filed: December 23, 2011
    Publication date: April 11, 2013
    Applicant: Wistron Corporation
    Inventors: Yong-Liang Zheng, Hung-Chun Liu
  • Patent number: 8415469
    Abstract: Compounds active on protein kinases are described, as well as methods of using such compounds to treat diseases and conditions associated with aberrant activity of protein kinases.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: April 9, 2013
    Assignee: Plexxikon Inc.
    Inventors: Prabha N. Ibrahim, Dean R. Artis, Ryan Bremer, Gaston Habets, Shumeye Mamo, Marika Nespi, Chao Zhang, Jiazhong Zhang, Yong-Liang Zhu, Rebecca Zuckerman, Brian West, Yoshisa Suzuki, Jianming Tsai, Klaus-Peter Hirth, Gideon Bollag, Wayne Spevak, Hanna Cho, Samuel J. Gillette, Guoxian Wu, Hongyao Zhu, Shenghua Shi
  • Patent number: 8412830
    Abstract: The present invention discloses a method and an apparatus for improving SIP parse performance. The method comprising the steps of: receiving a text-based SIP message to be sent to a SIP server; according to a SIP message filter table, determining whether the text-based SIP message needs to be transformed to a token-based message; and in the case that the text-based SIP message needs to be transformed to a token-based message, performing the transformation and sending the transformed token-based message to said SIP server, otherwise directly sending the text-based SIP message to said SIP server. According to the present invention, larger SIP message throughput in a SIP server and better utilization of resources of a front end device can be achieved.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: April 2, 2013
    Assignee: International Business Machines Corporation
    Inventors: Zhi Yong Liang, Wei Lu, Ravinder Kumar Sabhikhi, Ling Shao, Bo Yang, Yi Xin Zhao
  • Publication number: 20130053384
    Abstract: Chemical entities that are kinase inhibitors, pharmaceutical compositions and methods of using these chemical entities, e.g., for treatment of cancer are described.
    Type: Application
    Filed: August 24, 2012
    Publication date: February 28, 2013
    Applicant: NeuPharma, Inc.
    Inventors: Yong-Liang Zhu, Xiangping Qian
  • Publication number: 20130041709
    Abstract: An asymmetric approach is used for evaluating process control data, whereby one approach is used for determining entry into the emerging life cycle phase (i.e., presence of a new defect) and a different approach is used for detecting entry into the other life cycle phases such as cresting and recovering. An evidence curve is created from observed instance data for a particular defect, and the slope of this evidence curve is analyzed programmatically by applying one or more tests, in combination with sequential time-reversed estimation, to determine return-to-normal conditions with a desired level of confidence.
    Type: Application
    Filed: August 11, 2011
    Publication date: February 14, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron D. Civil, Jeffrey G. Komatsu, Andrew Soon Ng Yong Liang, John M. Wargo, Emmanuel Yashchin, Paul A. Zulpa
  • Publication number: 20130041626
    Abstract: An asymmetric approach is used for evaluating process control data, whereby one approach is used for determining entry into the emerging life cycle phase (i.e., presence of a new defect) and a different approach is used for detecting entry into the other life cycle phases such as cresting and recovering. An evidence curve is created from observed instance data for a particular defect, and the slope of this evidence curve is analyzed programmatically by applying one or more tests, in combination with sequential time-reversed estimation, to determine return-to-normal conditions with a desired level of confidence.
    Type: Application
    Filed: March 1, 2012
    Publication date: February 14, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Aaron D. Civil, Jeffrey G. Komatsu, Andrew Soon Ng Yong Liang, John M. Wargo, Emmanuel Yashchin, Paul A. Zulpa
  • Publication number: 20130040945
    Abstract: Chemical entities that are arctigenin derivatives, pharmaceutical compositions and methods of treatment of cancer are described.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 14, 2013
    Inventors: Xiangping Qian, Yong-Liang Zhu
  • Publication number: 20130027875
    Abstract: A riser card module includes a frame body, a carrier plate connected to the frame body for abutment against first surfaces of positioning plates of fixing brackets of expansion cards, a riser card disposed on the frame body and having a plurality of expansion slots for insertion therein of the expansion cards, respectively, and a limiting unit rotatable relative to the carrier plate about an axial direction which is perpendicular to a longitudinal direction of the carrier plate for abutment against second surfaces of the positioning plates of the fixing brackets of the expansion cards so as to restrict movement of the expansion cards relative to the riser card.
    Type: Application
    Filed: July 24, 2012
    Publication date: January 31, 2013
    Inventors: Chong-Xing Zhu, Te-Hsiung Hsieh, Yong-Liang Zheng