Patents by Inventor Yong-Min Kwon

Yong-Min Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062514
    Abstract: Provided is an electrode protection member comprising a lower structure including a carbon-based tubular body whose surface is functionalized with a hydroxy group; and a composite resin part including a thermoset resin and an ultraviolet curing resin disposed on the lower structure, a manufacturing method of the electrode protection membrane, and an all-solid-state battery including the electrode protection member.
    Type: Application
    Filed: March 21, 2024
    Publication date: February 20, 2025
    Inventors: Yong Hun Lee, Ju Min Kim, Yong Jun Lee, Tae Young Kwon, Jong Hwan Choi
  • Patent number: 12230187
    Abstract: A display panel includes a plurality of pixels. Each of the pixels includes a first transistor having a gate electrode connected to a first node and a first electrode to which a high level driving voltage is applied, a light emitting device having an anode electrode connected to a second electrode of the first transistor and a cathode electrode to which a low level driving voltage is applied, a second transistor applying a fixing voltage to the first node based on a first gate signal, a third transistor applying a data voltage to a second node based on the first gate signal, a fourth transistor connecting the second node to an input terminal for the low level driving voltage based on a second gate signal having a phase opposite to a phase of the first gate signal, and a capacitor between the first node and the second node.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: February 18, 2025
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Joon Hee Lee, Jong Min Park, Nam Kon Ko, Dong Won Park, Yong Chul Kwon
  • Publication number: 20240344019
    Abstract: The present invention relates to a method for stably maintaining a poly(A) tail.
    Type: Application
    Filed: August 17, 2022
    Publication date: October 17, 2024
    Inventors: Jin Hwan SHIN, Young Joon CHOI, Hun KIM, Yong-min KWON, Hye-won JEONG
  • Patent number: 12046627
    Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: July 23, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-Min Kwon, Geun-Woo Ko, Jung-Wook Lee, Jong-Hyun Lee, Pun-Jae Choi
  • Publication number: 20240202585
    Abstract: A machine learning failure recovery apparatus and control method thereof are provided. The control method of a machine learning failure recovery apparatus according to the present invention t may include performing machine learning with learning data as an input, wherein the machine learning includes matching a learning data location where a learning has been completed with an intermediate storage model whenever a preset backup time arrives and storing a result of the matching; determining whether a failure occurs during the machine learning; extracting the intermediate storage model closest to a point in time when the failure occurred and a position of the learning data matched with the corresponding intermediate storage model when it is determined that the failure occurred; and resuming machine learning based on the extracted intermediate storage model and location of the learning data.
    Type: Application
    Filed: June 20, 2023
    Publication date: June 20, 2024
    Applicant: STRATO CO., LTD.
    Inventors: Hyeong-Doo KIM, Ho-Chul LEE, Sun-Kyu PARK, Nam-Kyu PARK, Yong-Min KWON
  • Publication number: 20240202194
    Abstract: Provided is a search processing system performing high-volume search processing. The search processing system includes: a synchronization database server; a search server configured to match search result data and primary key field values and temporarily store them and to continuously transmit the matched primary key field values and the search result data to the synchronization database server to perform mutual real-time synchronization; and a search node configured to receive and store the primary key field values among the search result data from the search server.
    Type: Application
    Filed: November 2, 2023
    Publication date: June 20, 2024
    Applicant: STRATO CO., LTD.
    Inventors: Hyeong-Doo KIM, Ho-Chul LEE, Sun-Kyu PARK, Nam-Kyu PARK, Yong-Min KWON
  • Patent number: 11922225
    Abstract: Provided is a cluster node recommendation system. A method of controlling the cluster node recommendation system includes: inputting user selection information from a user, the user selection information including at least one of a cloud vendor, an Information Technology (IT) resource size, and a free resource size; checking resource requirements of a designated application; outputting a node configuration by inputting the input user selection information and the checked resource requirements of the application to an artificial intelligence module; verifying validity by arranging a container in which the application is executed, in the output node configuration; and providing a final node configuration in which validity verification is made, to the user.
    Type: Grant
    Filed: November 1, 2023
    Date of Patent: March 5, 2024
    Assignee: STRATO CO., LTD.
    Inventors: Hyeong-Doo Kim, Ho-Chul Lee, Sun-Kyu Park, Nam-Kyu Park, Yong-Min Kwon
  • Patent number: 11592155
    Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-min Kwon, Pun-jae Choi, Geun-woo Ko, Jong-hyun Lee
  • Patent number: 11483303
    Abstract: Provided are a blockchain-based one ID service system and method, in an authentication method according to the embodiment of present invention, an authentication support server maps and registers a first ID issued by a first SP server to a first user and a first site of the first SP server, which is an issuing server, and, upon receiving the first ID from a second SP server, the authentication support server returns information on the first site mapped to the first ID to the second SP server. To this end, there is no need for a separate server configuration to perform an authentication procedure, and it is possible to lessen the burden of performing authentication for SPs.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: October 25, 2022
    Assignee: SK HOLDINGS CO., LTD.
    Inventors: Yong Min Kwon, Kyong Gu Kang, Da Woon Lee
  • Publication number: 20220238597
    Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Inventors: YONG-MIN KWON, Geun-Woo Ko, Jung-Wook Lee, Jong-Hyun Lee, Pun-Jae Choi
  • Patent number: 11302743
    Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: April 12, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-Min Kwon, Geun-Woo Ko, Jung-Wook Lee, Jong-Hyun Lee, Pun-Jae Choi
  • Publication number: 20210341125
    Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
    Type: Application
    Filed: July 12, 2021
    Publication date: November 4, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-min KWON, Pun-jae CHOI, Geun-woo KO, Jong-hyun LEE
  • Patent number: 11060689
    Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-min Kwon, Pun-jae Choi, Geun-woo Ko, Jong-hyun Lee
  • Publication number: 20200195629
    Abstract: Provided are a blockchain-based one ID service system and method, in an authentication method according to the embodiment of present invention, an authentication support server maps and registers a first ID issued by a first SP server to a first user and a first site of the first SP server, which is an issuing server, and, upon receiving the first ID from a second SP server, the authentication support server returns information on the first site mapped to the first ID to the second SP server. To this end, there is no need for a separate server configuration to perform an authentication procedure, and it is possible to lessen the burden of performing authentication for SPs.
    Type: Application
    Filed: August 20, 2018
    Publication date: June 18, 2020
    Applicant: SK HOLDINGS CO., LTD.
    Inventors: Yong Min KWON, Kyong Gu KANG, Da Woon LEE
  • Publication number: 20200025351
    Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 23, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-min KWON, Pun-jae CHOI, Geun-woo KO, Jong-hyun LEE
  • Publication number: 20190326349
    Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.
    Type: Application
    Filed: March 1, 2019
    Publication date: October 24, 2019
    Inventors: YONG-MIN KWON, GEUN-WOO KO, JUNG-WOOK LEE, JONG-HYUN LEE, PUN-JAE CHOI
  • Patent number: 10276629
    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: April 30, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Kuk Lee, Yong Min Kwon, Hyung Kun Kim
  • Patent number: 10256218
    Abstract: A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung Jun Kim, Yong Min Kwon, Geun Woo Ko, Pun Jae Choi, Dong Ho Kim
  • Patent number: 10236280
    Abstract: A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Min Kwon, Kyoung Jun Kim
  • Publication number: 20190019780
    Abstract: A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
    Type: Application
    Filed: March 30, 2018
    Publication date: January 17, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung Jun KIM, Yong Min KWON, Geun Woo KO, Pun Jae CHOI, Dong Ho KIM