Abstract: An image acquisition device and image processing method for an agricultural harvesting operation machine. The agricultural harvesting operation machine comprises a body and an image acquisition device; the image acquisition device comprises an image capturing component and a communication machine; the image acquisition device is mounted on the body; the communication machine is communicatably connected to the image capturing component so as to obtain acquired image information from the image capturing component, thereby assisting in adjusting the working position and operation speed of the body. Also provided is an image processing method. Information required by harvesting operation is taken into full consideration, images of the position of an agricultural harvesting operation machine are acquired, and multiple acquired images are efficiently processed.

Abstract: A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

Abstract: An intelligent system and a method for coordinating harvester and logistics vehicle are illustrated. The intelligent system comprises a harvester terminal and a logistics vehicle terminal. The harvester terminal comprises a repository monitoring module and a control module, wherein the repository monitoring module monitors storage information of a storage bin of the harvester. The control module receives the storage information from the repository monitoring module, and determines whether the storage location of the storage bin of the harvester reaches a preset location. The harvester terminal and the logistics vehicle terminal are communicatively connected. When the storage location of the storage bin of the harvester reaches the preset location, the control module sends a transport instruction to the logistics vehicle terminal to control the logistics vehicle to transport grain, thereby achieving intelligent coordination between the harvester and the logistics vehicle.

Abstract: A traveling path planning method of an automatic harvester includes steps of (a) detecting and forming, by a detection device, a basic farmland information; and (b) receiving and analyzing, by a path planning device, the basic farmland information, and planning a path for the automatic harvester to travel.

Abstract: An automatic driving system for grain processing, and an automatic driving method and a path planning method is illustrated. The automatic driving system for grain processing comprises a grain processing host, an image processing system, a path planning system, and an image acquisition device. The image processing system is arranged on the grain processing host and acquires at least one image of farmland surrounding the grain processing host. The image processing system identifies, based on an image segmentation and identification method, an area in the image; and the path planning system plans, based on the area identified by the image processing system, at least one driving planning path. The grain processing host automatically controls driving according to the driving planning path planned by the path planning system.

Abstract: An automatic driving system for grain processing, an automatic driving method, and an automatic identification method is illustrated. The automatic driving system includes a grain processing host, an image acquiring device, and an image processing system. The image acquiring device is provided in the grain processing host. The image acquiring device acquires at least one image around the grain processing host. The image processing system identifies areas in the image by utilizing an image segmentation and identification technique on the basis of the image acquired by the image acquiring device. The grain processing host automatedly controls driving based on the areas identified by the image processing system.

Abstract: A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

Abstract: A method for manufacturing a circuit board with a small size a communication unit comprising a radio frequency (RF) component, an antenna, and an encapsulation layer. The RF component is embedded in the encapsulation layer, the antenna is positioned on the encapsulation layer and electrically connected to the RF component. A rigid substrate is formed on a flexible substrate, and a receiving groove is defined in the rigid substrate to expose the flexible substrate. The communication unit is in the receiving groove, thus causing connection between the RF component and the flexible substrate, thereby the circuit board is formed.

Abstract: The present disclosure provides pharmaceutical compositions comprising antibodies and antigen-binding fragments thereof that specifically bind to human B7-H4 (and optionally cynomolgus monkey, mouse, and/or rat B7-H4). The present disclosure also prides methods for treating disorders, such as cancer, by administering such pharmaceutical compositions.

Abstract: An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.

Abstract: A mobile air contains: a movable refrigerator, an antifreeze tank, a water pump, and an air cooler. The air cooler at least one includes an evaporator, the antifreeze tank is disposed in the movable refrigerator so as to cool antifreeze, and the antifreeze recycles back to the antifreeze tank from the antifreeze tank via at least one pipe, the water pump, and the evaporator so that environmental hot air is drawn and is cooled by the evaporator, thus recycling cold airs.

Abstract: A method for manufacturing a circuit board with a small size a communication unit comprising a radio frequency (RF) component, an antenna, and an encapsulation layer. The RF component is embedded in the encapsulation layer, the antenna is positioned on the encapsulation layer and electrically connected to the RF component. A rigid substrate is formed on a flexible substrate, and a receiving groove is defined in the rigid substrate to expose the flexible substrate. The communication unit is in the receiving groove, thus causing connection between the RF component and the flexible substrate, thereby the circuit board is formed.

Abstract: A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

Abstract: This provides pharmaceutical compositions that comprise a combination of an anti-cancer agent which is an first antibody and a second antibody. In some embodiments, the first antibody is an anti-Programmed Death-1 (PD-1) antibody. In certain embodiments, the composition is a fixed dose formulation. In certain embodiments, the composition is administered as a flat-dose. The disclosure also provides a kit for treating a subject afflicted with a disease, the kit comprising a dosage of any composition disclosed herein and instructions for using the composition in any of the disclosed methods for treating a disease.

Abstract: A high-frequency circuit board includes a first circuit structure, a second circuit structure, and a dielectric layer formed on the second circuit structure. The first circuit structure includes a first substrate layer and at least one first circuit layer. The at least one first circuit layer is formed on at least one surface of the first substrate layer. At least one receiving cavity is defined in the first substrate layer. A second circuit structure is embedded in the receiving cavity. The second circuit structure includes a second substrate layer, at least one second circuit layer embedded in the second substrate layer, and a plurality of support columns formed on the second substrate layer. A portion of the dielectric layer is filled into gaps between an inner wall of the receiving cavity and the second circuit structure. The support columns are embedded in the dielectric layer.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having a plurality of accommodating slots penetrating the body, where a slot wall of at least one of the accommodating slots protrudes inward to form a boss, and the boss has a stopping corner; and a plurality of conductive terminals, correspondingly accommodated in the accommodating slots. At least one of the conductive terminals has an inclined portion, formed by tapering one side of the conductive terminal, wherein the inclined portion is adjacent to the stopping corner, the inclined portion is not parallel to a top surface of the boss, and the inclined portion is at least partially located above the stopping corner and configured to limit the conductive terminal from moving downward.

Abstract: An anti-theft cable box includes a reel module, a conductive ring module, a coil spring module, an external connection module and an outer casing. The reel module includes an upper plate and a lower plate. A bottom surface of the upper plate is spaced from a top surface of the lower plate to form a cable groove between the upper plate and the lower plate. A cable is installed in the cable groove. The conductive ring module is disposed under the reel module, and the reel module is pivotally connected with the conductive ring module. The coil spring module is disposed under the conductive ring module. The external connection module includes an outer shell. The outer shell surrounds the coil spring module. The outer casing covers the reel module, the conductive ring module, the coil spring module and the external connection module.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board includes a body, having multiple accommodating slots, and multiple conductive terminals, correspondingly accommodated in the accommodating slots. Each conductive terminal includes: a base portion; an elastic arm, formed by extending upward from the base portion and used for abutting the chip module; a strip connecting portion, formed by extending upward from the base portion and used for being connected to a strip; an extending portion, formed by bending and extending from one side of the base portion, where the extending portion is located below the strip connecting portion and does not interfere with the accommodating slot; and a conducting portion, used for being electrically connected to the circuit board.

Abstract: An anti-theft cable box includes a reel module, a conductive ring module, a coil spring module, an external connection module and an outer casing. The reel module includes an upper plate and a lower plate. A bottom surface of the upper plate is spaced from a top surface of the lower plate to form a cable groove between the upper plate and the lower plate. A cable is installed in the cable groove. The conductive ring module is disposed under the reel module, and the reel module is pivotally connected with the conductive ring module. The coil spring module is disposed under the conductive ring module. The external connection module includes an outer shell. The outer shell surrounds the coil spring module. The outer casing covers the reel module, the conductive ring module, the coil spring module and the external connection module.

Abstract: A method of manufacturing a circuit board includes: a single-sided copper-clad base is provided; a plurality of grooves are defined in the base facing away from the copper-clad side for receiving electronic elements, a depth of each of the grooves is equal to a thickness of the corresponding electronic element; the electronic elements are fixed into their respective grooves; a plurality of holes are defined in the laminating member to expose the electrodes of the electronic elements; an electroplated layer is formed on the surface of the embedded body, the electroplated layer is electrically connected with the electrodes of the electronic elements. A circuit board made by the method is also provided.