Abstract: A photosensitive composition and a quantum dot-polymer composite pattern formed from the photosensitive composition are disclosed, and the photosensitive composition includes: a plurality of quantum dots; a color filter material including an absorption dye, an absorption pigment, or a combination thereof; a polymer binder; a photopolymerizable monomer having a carbon-carbon double bond; a photoinitiator; and a solvent, wherein in a normalized photoluminescence spectrum of the quantum dot and a normalized ultraviolet-visible absorption spectrum of the color filter material, a photoluminescence peak wavelength (PL peak wavelength) of the quantum dot and a wavelength of maximum absorbance of the color filter material do not overlap with each other, and the color filter material is included in an amount of less than or equal to 1 part by weight per 10 parts by weight of the plurality of quantum dots.

Abstract: A color filter including a first region configured to emit a first light, a second region configured to emit a second light having a longer wavelength than a wavelength of the first light, a third region configured to emit a third light having a longer wavelength than the wavelength of the second light, a first layer including two or more quantum dots, and a second layer formed on at least one surface of the first layer, wherein the first layer and the second layer are disposed in at least the second region and the third region.

Abstract: A quantum dot-polymer composite including a polymer matrix; and a plurality of quantum dots dispersed in the polymer matrix, wherein the quantum dot includes a core including a first semiconductor material; and a shell including a second semiconductor material disposed on the core, wherein the quantum dot is cadmium-free, wherein the shell has at least two branches and at least one valley portion connecting the at least two branches, and wherein the first semiconductor material is different from the second semiconductor material.

Abstract: A color filter including a first region configured to emit a first light, a second region configured to emit a second light having a longer wavelength than a wavelength of the first light, a third region configured to emit a third light having a longer wavelength than the wavelength of the second light, a first layer including two or more quantum dots, and a second layer formed on at least one surface of the first layer, wherein the first layer and the second layer are disposed in at least the second region and the third region.

Abstract: A photosensitive composition and a quantum dot-polymer composite pattern formed from the photosensitive composition are disclosed, and the photosensitive composition includes: a plurality of quantum dots; a color filter material including an absorption dye, an absorption pigment, or a combination thereof; a polymer binder; a photopolymerizable monomer having a carbon-carbon double bond; a photoinitiator; and a solvent, wherein in a normalized photoluminescence spectrum of the quantum dot and a normalized ultraviolet-visible absorption spectrum of the color filter material, a photoluminescence peak wavelength (PL peak wavelength) of the quantum dot and a wavelength of maximum absorbance of the color filter material do not overlap with each other, and the color filter material is included in an amount of less than or equal to 1 part by weight per 10 parts by weight of the plurality of quantum dots.

Abstract: A photosensitive composition including a quantum dot dispersion, a photopolymerizable monomer having a carbon-carbon double bond, and a photoinitiator, wherein the quantum dot dispersion includes an acid group-containing polymer and a plurality of quantum dots dispersed in the acid group-containing polymer, and wherein the acid group-containing polymer includes a copolymer of a monomer combination including a first monomer having a carboxylic acid group or a phosphonic acid group and a carbon-carbon double bond and a second monomer having a carbon-carbon double bond and a hydrophobic group and not having a carboxylic acid group and a phosphonic acid group.

Abstract: A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.

Abstract: A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package.

Abstract: A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.

Abstract: Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin.

Abstract: A composition for a patternable adhesive film, a patternable adhesive film having the same, and a method of manufacturing a semiconductor package using the patternable adhesive film are provided. The composition contains a binder resin, a radical-polymerizable acrylate monomer, a photo-radical initiator, and a thermal-radical initiator without an epoxy resin. The composition may have good patternability, adhesiveness, and low-temperature stability, and be rapidly cured at a low temperature.

Abstract: A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.

Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.

Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.

Abstract: A patternable adhesive film is formed in a double-layered structure of an adhesive layer having patternability and an adhesive layer having both adhesion and developability. Thus, the double-layered patternable adhesive film can effectively have both patternability and adhesion.

Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.

Abstract: The present invention discloses an anisotropic conductive adhesive comprising an insulating adhesive component and a number of conductive particles dispersed in the insulating adhesive component, wherein the insulating adhesive component contains a crosslinked rubber resin. The anisotropic conductive adhesive of the present invention prevents exfoliation of an adhesive or reduction in adhesive strength of circuit by minimizing its the heat-contraction occurring in the process of a polymerization or a hardening reaction when connecting micro-circuits, whereby a short circuit between adjacent electrodes can be prevented when connecting the circuits, and excellent connection reliability according to a long-term use is achieved.

Abstract: The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC (Positive Temperature Coefficient) characteristics at the same time. The anisotropic conductive adhesive having PTC characteristics according to the present invention comprises an insulating adhesive component and a plurality of conductive particles dispersed in adhesive component, in which the insulating adhesive component comprises a crystalline polymer. Since the anisotropic conductive adhesive according to the present invention includes a crystalline polymer, when temperature rises and the volume expands, electrical resistance is rapidly increased, whereby current flow is intercepted resulting in blocking current, providing PTC characteristics acting as a switch. Thus, it shows circuit protection function as well.