Patents by Inventor Yong-seop Yoon

Yong-seop Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8216482
    Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: July 10, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Seok Kim, Yong-Seop Yoon, Moon-Chul Lee, Yong-Won Jeong, Dong-Sik Shim, Hyung Choi
  • Patent number: 8114578
    Abstract: Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: February 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Yong-seop Yoon, Min-soo Kim, Yong-won Jeong, Dong-sik Shim
  • Patent number: 8109609
    Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: February 7, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Sik Shim, Yong-Seop Yoon, Bang-Weon Lee, Moon-Chul Lee, Yong-Won Jeong, Jong-Seok Kim
  • Patent number: 8066356
    Abstract: A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: November 29, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Yong-seop Yoon, Yong-won Jeong, Dong-sik Shim, Sung-joon Park, Jong-seok Kim
  • Patent number: 7959265
    Abstract: Provided is a thermal inkjet printhead. The inkjet printhead includes a substrate; an insulating layer formed on the substrate; a heater formed on the insulating layer and an electrode to apply current to the heater; a chamber layer that is stacked on the insulating layer and includes an ink chamber; a nozzle layer that is stacked on the chamber layer and includes a nozzle; and at least a heat transfer layer that is formed inside the insulating layer and dissipates heat generated in by the heater toward the substrate.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: June 14, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-sik Shim, Hyung Choi, Yong-seop Yoon, Chang-seung Lee
  • Patent number: 7862150
    Abstract: The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: January 4, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Myong-jong Kwon, Yong-seop Yoon, Jin-wook Lee, Yong-won Jeong, Donk-sik Shim
  • Patent number: 7810911
    Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: October 12, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-sik Shim, Yong-seop Yoon, Moon-chul Lee, Yong-won Jeong, Hyung Choi
  • Patent number: 7758168
    Abstract: An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: July 20, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-chul Lee, Dong-sik Shim, Hyung Choi, Yong-seop Yoon
  • Publication number: 20100171793
    Abstract: An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate.
    Type: Application
    Filed: August 20, 2009
    Publication date: July 8, 2010
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Yong-won JEONG, Yong-seop Yoon, Moon-chul Lee, Dong-sik Shim, Jong-seok Kim
  • Publication number: 20100051580
    Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.
    Type: Application
    Filed: April 23, 2009
    Publication date: March 4, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Seok Kim, Yong-Seop Yoon, Moon-Chul Lee, Yong-Won Jeong, Dong-Sik Shim, Hyung Choi
  • Publication number: 20100053272
    Abstract: Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes.
    Type: Application
    Filed: April 2, 2009
    Publication date: March 4, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: DONG-SIK SHIM, Yong-Seop Yoon, Bang-Weon Lee, Moon-Chul Lee, Yong-Won Jeong, Jong-Seok Kim
  • Publication number: 20100020136
    Abstract: Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate having an ink feed hole extending therethrough; a chamber layer including a plurality of ink chambers above the substrate; a nozzle layer including a plurality of nozzles above the chamber layer; and at least one support beam formed in the substrate to connect inner walls of the ink feed hole.
    Type: Application
    Filed: February 19, 2009
    Publication date: January 28, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moon-chul LEE, Yong-Seop YOON, Yong-Won JEONG, Dong-Sik SHIN, Jong-Seok KIM
  • Publication number: 20090267990
    Abstract: Provided is a thermal inkjet printhead that includes a substrate, which may comprise an ink feed hole for supplying ink, a chamber layer, which is stacked on the substrate, and which comprises an ink chamber that is filled with the ink supplied from the ink feed hole, a heater, which is prepared inside the ink chamber and heats the ink, an island, which is formed on the substrate, and which is prepared at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, and which comprises a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.
    Type: Application
    Filed: September 12, 2008
    Publication date: October 29, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Moon-chul LEE, Yong-seop Yoon, Yong-won Jeong, Dong-sik Shim, Sung-joon Park, Jong-seok Kim
  • Publication number: 20090194025
    Abstract: An apparatus to sense the temperature of an ink-jet head includes at least one or more CMOS (complementary metal oxide semiconductor) lateral BJTs (bipolar junction transistors) to sense the temperature of the ink-jet head, and a current supply unit to supply a current to the CMOS lateral BJTs. Minimum sized CMOS lateral BJTs are applied to an ink-jet printer head so that precise temperature control can be performed in a shuttle or array type ink-jet printer.
    Type: Application
    Filed: June 16, 2008
    Publication date: August 6, 2009
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Yong-won JEONG, Hyung Choi, Eun-bong Han, Yong-seop Yoon, Moon-chul Lee, Dong-sik Shim
  • Publication number: 20090179000
    Abstract: A method of manufacturing an inkjet printhead, in which a solvent included in a positive photoresist composition or in a non-photosensitive soluble polymer composition which is used to form a sacrificial layer has a different polarity from that of a solvent included in a negative photoresist composition that is used to form at least one of a channel forming layer and a nozzle layer.
    Type: Application
    Filed: June 24, 2008
    Publication date: July 16, 2009
    Applicants: Samsung Electronics Co., Ltd, Korea Advanced Institute of Science and Technology
    Inventors: Jong-jin Park, Su-min Kim, Jin-baek Kim, Yong-ung Ha, Yong-seop Yoon, Byung-ha Park
  • Publication number: 20090141083
    Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a silicon on insulator (SOI) substrate including a lower silicon substrate, a middle insulating layer, an upper silicon substrate, and an ink feed hole, the ink feed hole penetrates the SOI substrate to supply ink, an insulating layer stacked on the upper silicon substrate of the SOI substrate, a chamber layer stacked on the insulating layer in which a plurality of ink chambers filled with ink supplied from the ink feed hole is formed, a nozzle layer stacked on the chamber layer in which a plurality of nozzles is formed to correspond to the ink chambers, a plurality of heaters formed on the insulating layer which heats ink in the ink chambers to generate bubbles and eject ink through the nozzles, and a driving circuit region on which a driving circuit is formed to drive the heaters.
    Type: Application
    Filed: May 5, 2008
    Publication date: June 4, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-sik SHIM, Yong-seop Yoon, Moon-chul Lee, Yong-won Jeong, Hyung Choi
  • Publication number: 20090047605
    Abstract: Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
    Type: Application
    Filed: January 3, 2008
    Publication date: February 19, 2009
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Moon-chul Lee, Yong-seop Yoon, Min-soo Kim, Yong-won Jeong, Dong-sik Shim
  • Publication number: 20090001048
    Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island.
    Type: Application
    Filed: November 5, 2007
    Publication date: January 1, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-seop YOON, Hyung Choi, Moon-chul Lee, Yong-won Jeong, Dong-sik Shim
  • Publication number: 20080297564
    Abstract: An inkjet printhead includes a substrate in which an ink feed hole is formed, a plurality of ejection devices formed on the substrate at sides of the ink feed hole, a chamber layer stacked on the substrate and in which a plurality of ink chambers, which correspond to the ejection devices and in which ink supplied from the ink feed hole is filled, are formed, and a nozzle layer in which a plurality of nozzles corresponding to the ink chambers are formed, wherein the ink feed hole includes a plurality of through holes formed through the substrate in the thickness direction thereof.
    Type: Application
    Filed: November 6, 2007
    Publication date: December 4, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-won Jeong, Hyung Choi, Yong-seop Yoon, Moon-chul Lee, Dong-sik Shim
  • Patent number: 7432785
    Abstract: A thin film resonator having a membrane layer formed on top of a substrate, a lower electrode formed on part of the top surface of the membrane layer, a piezoelectric layer formed on top of the lower electrode, an upper electrode formed on top of the piezoelectric layer, and a mass loading layer interposed between the lower electrode and the membrane layer and having a predetermined mass. This structure enables precise adjustment of the resonant frequency of the thin film resonator, thereby providing a more precise filter.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: October 7, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-seop Yoon, Yun-kwon Park, Hyung Choi