Abstract: The present invention to a method for forming an exposed portion of a circuit pattern in a printed circuit board, wherein a solder resist is coated on a substrate having a circuit pattern, is hardened, and thereafter is processed by a laser in order to form a portion exposing the circuit pattern such as the solder land. When the solder resist is processed by the laser, the number of errors can be greatly reduced as compared to a processing error occurred in exposure or developing process, whereby a circuit pattern that is integrated higher than the solder land is formed for thereby miniaturizing the printed circuit board.

Abstract: A printed circuit board (PCB) and method of forming same is performed without incoming lines for plating. The plating is preferably performed on ball pad areas and/or bonding pad areas being the top layer of a multi-layer PCB. A metal layer that later forms circuit patterns serves to supply a power for plating ball pads for solder-ball bonding and bonding pads for wire-bonding with gold (Au). Thus, the gold (Au)-plating is performed prior to forming the circuit patterns. A positive-type first photoresist is coated on the metal layer to form the ball pads and the bonding pads. The coated first photoresist is also used to form circuit patterns. The gold (Au)-plated metal layer of ball pad areas and the bonding pad areas are protected by a second photoresist, which is reactive with a larger quantity of light than the first photoresist. Both first and second photoresists can be concurrently developed.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.