Abstract: A column control circuit may include a column control signal generation circuit and a column access block signal generation circuit. The column control signal generation circuit is configured to activate an input/output strobe signal when a column access block signal is deactivated. The column control signal generation circuit is configured to deactivate the input/output strobe signal when the column access block signal is activated. The column access block signal generation circuit is configured to activate the column access block signal when gap-less read commands may be inputted. The column access block signal generation circuit may deactivate the column access block signal during a period corresponding to an N-th read command among the gap-less read commands. N is an integer that is no less than 2.

Abstract: A column control circuit may include a column control signal generation circuit and a column access block signal generation circuit. The column control signal generation circuit is configured to activate an input/output strobe signal when a column access block signal is deactivated. The column control signal generation circuit is configured to deactivate the input/output strobe signal when the column access block signal is activated. The column access block signal generation circuit is configured to activate the column access block signal when gap-less read commands may be inputted. The column access block signal generation circuit may deactivate the column access block signal during a period corresponding to an N-th read command among the gap-less read commands. N is an integer that is no less than 2.

Abstract: A column control circuit may include a column control signal generation circuit and a column access block signal generation circuit. The column control signal generation circuit is configured to activate an input/output strobe signal when a column access block signal is deactivated. The column control signal generation circuit is configured to deactivate the input/output strobe signal when the column access block signal is activated. The column access block signal generation circuit is configured to activate the column access block signal when gap-less read commands may be inputted. The column access block signal generation circuit may deactivate the column access block signal during a period corresponding to an N-th read command among the gap-less read commands. N is an integer that is no less than 2.

Abstract: A column control circuit may include a column control signal generation circuit and a column access block signal generation circuit. The column control signal generation circuit is configured to activate an input/output strobe signal when a column access block signal is deactivated. The column control signal generation circuit is configured to deactivate the input/output strobe signal when the column access block signal is activated. The column access block signal generation circuit is configured to activate the column access block signal when gap-less read commands may be inputted. The column access block signal generation circuit may deactivate the column access block signal during a period corresponding to an N-th read command among the gap-less read commands. N is an integer that is no less than 2.

Abstract: A semiconductor apparatus includes: a pad unit comprising a plurality of data input/output (I/O) pads and a plurality of error detection code pads; an error detection code (EDC) read path configured to generate a plurality of EDCs by performing an error detection operation on a plurality of data, and output the plurality of EDCs through the plurality of error detection code pads; a comparison circuit configured to generate a comparison result signal by comparing the plurality of EDCs; and a data read path configured to output the comparison result signal through any one of the plurality of data I/O pads.

Abstract: A semiconductor apparatus includes: a pad unit comprising a plurality of data input/output (I/O) pads and a plurality of error detection code pads; an error detection code (EDC) read path configured to generate a plurality of EDCs by performing an error detection operation on a plurality of data, and output the plurality of EDCs through the plurality of error detection code pads; a comparison circuit configured to generate a comparison result signal by comparing the plurality of EDCs; and a data read path configured to output the comparison result signal through any one of the plurality of data I/O pads.

Abstract: A semiconductor system may include a controller and a semiconductor device. The controller may output command/address signals. The semiconductor device may generate a plurality of control codes from the command/address signals in a test mode according to a combination of the command/address signals. The semiconductor device may output a first output datum generated by serializing the plurality of control codes, and the first output datum, through a single pad.

Abstract: A semiconductor system may include a controller and a semiconductor device. The controller may output command/address signals. The semiconductor device may generate a plurality of control codes from the command/address signals in a test mode according to a combination of the command/address signals. The semiconductor device may output a first output datum generated by serializing the plurality of control codes, and the first output datum, through a single pad.

Abstract: A semiconductor system may include a controller and a semiconductor device. The controller may output command/address signals. The semiconductor device may generate a plurality of control codes from the command/address signals in a test mode according to a combination of the command/address signals. The semiconductor device may output a first output datum generated by serializing the plurality of control codes, and the first output datum, through a single pad.

Abstract: The semiconductor device includes an input clock generator and a data input unit. The input clock generator generates an input clock signal including a first pulse and a second pulse, wherein the first pulse is generated in response to a write signal and a write latency signal and the second pulse is generated in response to an external command signal and a burst length signal. The data input unit receives data and generates first input data in response to the first pulse of the input clock signal and receives the data and generates second input data in response of the second pulse of the input clock signal.

Abstract: The semiconductor device includes an input clock generator and a data input unit. The input clock generator generates an input clock signal including a first pulse and a second pulse, wherein the first pulse is generated in response to a write signal and a write latency signal and the second pulse is generated in response to an external command signal and a burst length signal. The data input unit receives data and generates first input data in response to the first pulse of the input clock signal and receives the data and generates second input data in response of the second pulse of the input clock signal.

Abstract: A semiconductor device includes a plurality of oscillation signal generation units configured to output a plurality of oscillation signals whose cycles are adjusted according to a PN ratio, which is a size ratio of a PMOS transistor to an NMOS transistor, and a selection unit configured to selectively output the oscillation signals outputted from the plurality of oscillation signal generation units in response to a test mode signal.

Abstract: A semiconductor memory device includes a clock input unit configured to receive a first clock and a second clock from the external. The memory device further includes a frequency conversion unit configured to convert a frequency of the second clock so that the frequency of the second clock becomes identical to a frequency of the first clock, a phase comparison unit configured to compare a phase of the first clock with that of a clock outputted from the frequency conversion unit, and output a comparison signal corresponding to the comparison result, a logic level change unit configured to change a logic level of a training information signal when a logic level of the comparison signal is fixed for a given time after being changed, and a signal transfer unit configured to transfer the training information signal to the external.

Abstract: A semiconductor memory device includes: a pre-amplifying unit configured to amplify a difference between an input signal and a reference signal to output a pre-output signal; a delaying unit configured to delay the input signal to output a delayed input signal; and a main amplifying unit configured to receive the pre-output signal and the delayed input signal as differential inputs to output an output signal.

Abstract: A semiconductor memory device includes a clock input unit configured to receive a first clock and a second clock from the external. The memory device further includes a frequency conversion unit configured to convert a frequency of the second clock so that the frequency of the second clock becomes identical to a frequency of the first clock, a phase comparison unit configured to compare a phase of the first clock with that of a clock outputted from the frequency conversion unit, and output a comparison signal corresponding to the comparison result, a logic level change unit configured to change a logic level of a training information signal when a logic level of the comparison signal is fixed for a given time after being changed, and a signal transfer unit configured to transfer the training information signal to the external.

Abstract: A data strobe signal generator includes a control unit, a pulse delay unit, a clock generator, and a data strobe output unit. The control unit generates a CAS latency signal and a preamble signal. The pulse delay unit delays a pulse signal for predetermined time and outputs a delayed pulse signal. The clock generator outputs a control clock signal. The data strobe output unit outputs a data strobe signal. The data strobe signal generator and the semiconductor memory device having the same generate a data strobe signal based on an adjustable preamble value, thereby ensuring the stabilized data output operation of a high-speed memory device.

Abstract: A semiconductor memory device includes at least one data transmission block including data I/O pads arranged in a major-axis side of the semiconductor memory device; a command and address transmission block including address and command input pads arranged in at least one minor-axis side of the semiconductor memory device; a global line block, arranged in a center of the semiconductor memory device, for transmitting inputted command and address; and at least one bank area, arranged between the global line block and the data transmission block, each bank area containing plural data I/O blocks located in a side of the data transmission block and plural control blocks located in a side of the global line block.

Abstract: A semiconductor memory device includes: a pre-amplifying unit configured to amplify a difference between an input signal and a reference signal to output a pre-output signal; a delaying unit configured to delay the input signal to output a delayed input signal; and a main amplifying unit configured to receive the pre-output signal and the delayed input signal as differential inputs to output an output signal.

Abstract: An internal address generation circuit in a semiconductor memory receives an external address signal and generates an internal address. The internal address generation circuit includes a control unit outputting at least more than two address strobe signals which are different from an internal command signal in terms of a strobe timing by decoding an external command signal; and an internal address generation unit outputting an internal address signal by aligning a first and a second address in a row by using the address strobe signal which are inputted sequentially, and there is an effect that an internal address is generated by using a plurality of address signals which are applied to one pad sequentially.

Abstract: A semiconductor memory device includes at least one data transmission block including data I/O pads arranged in a major-axis side of the semiconductor memory device; a command and address transmission block including address and command input pads arranged in at least one minor-axis side of the semiconductor memory device; a global line block, arranged in a center of the semiconductor memory device, for transmitting inputted command and address; and at least one bank area, arranged between the global line block and the data transmission block, each bank area containing plural data I/O blocks located in a side of the data transmission block and plural control blocks located in a side of the global line block.