Abstract: Provided is a decorative member including a substrate and a decorative layer provided on the substrate, wherein the decorative member has a depth parameter value ?1m represented by Formula 1 of 0.15 or more.

Abstract: A bearing device for a vehicle includes a main body unit mounted on a mounting region in a rail structure configured so that the mounting region is formed on a first rail that is any one of two rails rail-coupled to slide and the first rail slides along a second rail, a first shape unit provided to protrude from an upper surface of the main body unit and be in contact with the second rail and formed to damp a vibration in a first direction transmitted to the main body unit, and a second shape unit provided to protrude from a side surface of the main body unit and be in contact with the second rail and formed to damp a vibration in a second direction transmitted to the main body unit.

Abstract: In an embodiment, a ventilation duct device for a vehicle seat, includes a cushion duct, a blower coupled to the cushion duct, configured for air exiting the blower to enter the cushion duct, a back duct, a corrugated pipe, configured for air exiting the blower to enter the back duct via the corrugated pipe, an elastic support unit coupled to and at least partially located within the corrugated pipe, a first end of the elastic support unit coupled to the cushion duct, a second end of the elastic support unit coupled to the back duct, and a spring member coupled between the first end of the elastic support unit and the second end of the elastic support unit, and the spring member being at least partially located within the corrugated pipe.

Abstract: The present disclosure relates to a hydrogen purification/storage apparatus and method using a liquid organic hydrogen carrier (LOHC).

Abstract: A display device and a method of fabricating the same are provided. The display device includes a substrate, a first electrode on the substrate, a second electrode on the substrate and spaced apart from the first electrode, a plurality of light emitting elements, at least a portion of each of which is between the first electrode and the second electrode, and contact electrodes on the first electrode, the second electrode and the light emitting elements, the contact electrodes including a conductive polymer, wherein the contact electrodes include a first contact electrode which contacts an end portion of a first portion of the light emitting elements and the first electrode and a second contact electrode which contacts an end portion of a second portion of the light emitting elements, and the second electrode and is spaced apart from the first contact electrode.

Abstract: The present disclosure relates to a large-scale production method of plant exosomes. The method of the present disclosure can isolate high purity plant exosomes from a large amount of raw plants, using centrifugation and TFF, which can process a large amount of plant raw materials at once. This improves a conventional isolation process of plant exosomes stayed at the laboratory level, and thereby, suggests an easy process for large-scale production.

Abstract: A semiconductor device including first fin-shaped patterns in a first region of a substrate and spaced apart from each other in a first direction, second fin-shaped patterns in a second region of the substrate and spaced apart from each other in a second direction, a first field insulating film on the substrate and covering sidewalls of the first fin-shaped patterns, a second field insulating film on the substrate and covering sidewalls of the second fin-shaped patterns, a first source/drain pattern on the first field insulating film, connected to the first fin-shaped patterns, and including a first silicon-germanium pattern, and a second source/drain pattern on the second field insulating film, connected to the second fin-shaped patterns, and including a second silicon-germanium pattern, the second source/drain pattern and the second field insulating film defining one or more first air gaps therebetween may be provided.

Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10?6 m/m·k).

Abstract: The present invention relates to a compound for an organic electric element, an organic electric element using same, and an electronic device thereof. According to the present invention, high light-emitting efficiency, low driving voltage, and high heat resistance can be achieved in the element, and the color purity and lifespan of the element can be improved.

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

Abstract: Provided herein is a surgical instrument comprising a cap having a first and second aperture extending therethrough, a first extendable and retractable member having a distal end coupled to a first coupling, a first arm extending from the first coupling and pivotable with respect to the distal end of the first member, and a second arm connected to the first arm through a second coupling and pivotable, with respect to the first arm, a second extendable and retractable member having a distal end coupled to a third coupling, a third arm extending from the second coupling, the third arm pivotable, with respect to the distal end of the second member, and a fourth arm connected to the third arm through a fourth coupling and pivotable, with respect to the third arm, a first end effector connected to the second arm and a second end effector connected to the fourth arm.

Abstract: Provided is a nuclear reactor cooling module including: a fluid line for providing a movement path for inert gas into a reactor; an inert salt liquid layer surrounding the reactor; and an inert salt solid layer surrounding the inert salt liquid layer and surrounded by the fluid line.

Abstract: The present application relates to a decoration member including a pattern layer provided on one surface of the substrate and including a convex structure or a concave structure arranged two-dimensionally, and a method for preparing the decoration member.

Abstract: The disclosure provides a surgical apparatus comprising: a steerable member that is bendable and comprises a plurality of bending segments with channels therein; and a plurality of bending actuation wires that are arranged to pass through the steerable member and cause the steerable member to bend, the steerable member comprising at least one outwardly opening lumen through which the bending actuation wires pass.

Abstract: A haptic effect transmission method for providing real-time immersive content according to the present invention includes executing participatory content in which one or more users participate, collecting motion information of the users participating in the participatory content through a haptic device, multiplexing the motion information with video and audio files of the participatory content to obtain a multiplexed file, and demultiplexing the multiplexed file and providing the demultiplexed file to a display device and a haptic device of a client terminal.

Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Abstract: There is provided a semiconductor memory device having improved integration and electrical characteristics.

Abstract: A semiconductor device including first fin-shaped patterns in a first region of a substrate and spaced apart from each other in a first direction, second fin-shaped patterns in a second region of the substrate and spaced apart from each other in a second direction, a first field insulating film on the substrate and covering sidewalls of the first fin-shaped patterns, a second field insulating film on the substrate and covering sidewalls of the second fin-shaped patterns, a first source/drain pattern on the first field insulating film, connected to the first fin-shaped patterns, and including a first silicon-germanium pattern, and a second source/drain pattern on the second field insulating film, connected to the second fin-shaped patterns, and including a second silicon-germanium pattern, the second source/drain pattern and the second field insulating film defining one or more first air gaps therebetween may be provided.

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.