Abstract: A display device includes: a substrate including a display area and a non-display area; a transistor and a light emitting element, which are disposed on the display area; a pad portion disposed in the non-display area, where the pad portion includes a first metal pattern; and a printed circuit board or a data driver, which is connected with the pad portion. The transistor includes a semiconductor layer disposed on the substrate and a source electrode or a drain electrode which is electrically connected with the semiconductor layer. The source electrode or the drain electrode includes a first layer including a first metal, a second layer including a second metal, and a third layer including the first metal, where the first metal pattern includes the first metal, and is connected with the printed circuit board or the data driver.

Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

Abstract: An imaging lens system includes a first lens group, an optical path conversion element, and a second lens group arranged in order from an object side. An optical axis of the second lens group is disposed eccentrically in a direction with respect to a geometric optical axis of the optical path conversion element.

Abstract: An instant rice container separation apparatus and an instant rice manufacturing system comprising same are disclosed. The instant rice container separation apparatus according to one embodiment of the present invention comprises: a container-supplying master which is provided at one side of an apparatus body and which allows a plurality of instant rice containers to be stacked in the height direction while overlapping and to be arranged in the lateral direction; an integrated container separation plate which is disposed in a region below the container-supplying master, and which separates the lowermost containers, arranged in the lateral direction, all at once from the containers stacked thereon; and a separation plate forward-backward driving part which is connected to the integrated container separation plate and which drives the integrated container separation plate forward and backward.

Abstract: A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder

Abstract: A method of manufacturing an all-solid-state battery electrode, an all-solid-state battery electrode manufactured by the method, and an all-solid-state battery including the electrode are disclosed. In the method, a specific type of binder included in the electrode is prepared in a fiber form by applying pressure to the binder under specific conditions, so that the fiber-form binder thus prepared has an average fineness that satisfies a specific range. Therefore, the all-solid-state battery including the electrode has an advantage of having high capacity even in the case of electrode thickening for high loading.

Abstract: A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

Abstract: A display device includes a display panel which includes a display area and a non-display area, a plurality of signal wirings arranged in the display area, a plurality of fanout wirings arranged in the non-display area and electrically connected to the signal wirings, and a plurality of connecting wirings connecting the signal wirings to the fanout wirings, where some of the plurality of fanout wirings intersect and are overlapped with each other in a plan view.

Abstract: The disclosure provides a surgical apparatus comprising: a steerable member that is bendable and comprises a plurality of bending segments with channels therein; and a plurality of bending actuation wires that are arranged to pass through the steerable member and cause the steerable member to bend, the steerable member comprising at least one outwardly opening lumen through which the bending actuation wires pass.

Abstract: A circuit board may include an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms. The ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is within a range of 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is within a range of 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is within a range of 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is within a range of 0.5-1.5.

Abstract: A lens includes a lens portion; a multilayer anti-reflective (AR) coating layer, including either one or both of a low refractive index layer and a high refractive index layer, disposed on one surface of the lens portion; and a water-repellent layer, including a water repellent, disposed on one surface of the multilayer AR coating layer. Either one or both of the low refractive index layer and the high refractive index layer are formed of a nitride-based material with a band gap greater than 3.1 eV.

Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.

Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.

Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10?6 m/m·k).

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 ? to 500 ?. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.

Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.

Abstract: The present invention relates to an all-solid-state battery that can reduce the interfacial resistance between the electrolyte and electrode and can minimize the precipitation of lithium metal on the electrode and, more specifically, to an all-solid-state battery comprising: a cathode (100) including a cathode active material having a Li(NixCoyMnz)O2 (wherein 0<x<1, 0<y<1, 0<z<1, and x+y+z=1) layer; an anode (300); and a hybrid solid electrolyte (200) located between the cathode (100) and the anode (300), wherein the hybrid solid electrolyte (200) includes at least two solid electrolyte layers having different densities.