Patents by Inventor Yong-suk Kim

Yong-suk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12256489
    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 18, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Suk Kim, Jeong Han Kim, Moo Seong Kim
  • Patent number: 12232255
    Abstract: A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: February 18, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Suk Kim, Jeong Han Kim
  • Patent number: 12219700
    Abstract: A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: February 4, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Suk Kim, Dong Hwa Lee
  • Patent number: 12207404
    Abstract: A circuit board may include an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms. The ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is within a range of 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is within a range of 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is within a range of 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is within a range of 0.5-1.5.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: January 21, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Suk Kim, Dong Hwa Lee
  • Publication number: 20250004177
    Abstract: A lens includes a lens portion; a multilayer anti-reflective (AR) coating layer, including either one or both of a low refractive index layer and a high refractive index layer, disposed on one surface of the lens portion; and a water-repellent layer, including a water repellent, disposed on one surface of the multilayer AR coating layer. Either one or both of the low refractive index layer and the high refractive index layer are formed of a nitride-based material with a band gap greater than 3.1 eV.
    Type: Application
    Filed: February 13, 2024
    Publication date: January 2, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Kyung LEE, Je Hong KYOUNG, Yong Suk KIM, Joung Hun KIM, Byung Ju KIM, Jung Ho LEE, Na Yi KANG
  • Publication number: 20240414844
    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, the coating layer includes a first functional group, and the first insulating layer includes a reactive group bonded to the first functional group.
    Type: Application
    Filed: September 30, 2022
    Publication date: December 12, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Yong Suk KIM, Bo Ra KANG, Jeong Han KIM
  • Publication number: 20240407095
    Abstract: A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, wherein the coating layer includes a first functional group bonded to the first insulating layer, and a second functional group bonded to the first metal layer.
    Type: Application
    Filed: September 30, 2022
    Publication date: December 5, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Han Sang KIM, Bo Ra KANG, Yong Suk KIM
  • Patent number: 12101878
    Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10?6 m/m·k).
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: September 24, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hwa Lee, Yong Suk Kim
  • Publication number: 20240292534
    Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.
    Type: Application
    Filed: May 7, 2024
    Publication date: August 29, 2024
    Inventors: Il Sik Nam, Yong Suk Kim, Dong Keun Lee, Tae Ki Kim, Hye Jin Jo
  • Patent number: 12010795
    Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: June 11, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Il Sik Nam, Yong Suk Kim, Dong Keun Lee, Tae Ki Kim, Hye Jin Jo
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Publication number: 20240080011
    Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 ? to 500 ?. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.
    Type: Application
    Filed: February 22, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Moon Chul LEE, Jae Hyoung GIL, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK, Tae Kyung LEE
  • Publication number: 20240059863
    Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler has a content in a range of 68 wt % to 76 wt % in the resin composition, wherein the filler includes a first filler group composed of fillers having a first diameter; a second filler group composed of fillers having a second diameter smaller than the first diameter; and a third filler group composed of fillers having a third diameter smaller than the second diameter, and contents of each of the first filler group, the second filler group, and the third filler group in the filler are different from each other.
    Type: Application
    Filed: December 3, 2021
    Publication date: February 22, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Yong Suk KIM, Jeong Han KIM
  • Publication number: 20230411603
    Abstract: The present invention relates to an all-solid-state battery that can reduce the interfacial resistance between the electrolyte and electrode and can minimize the precipitation of lithium metal on the electrode and, more specifically, to an all-solid-state battery comprising: a cathode (100) including a cathode active material having a Li(NixCoyMnz)O2 (wherein 0<x<1, 0<y<1, 0<z<1, and x+y+z=1) layer; an anode (300); and a hybrid solid electrolyte (200) located between the cathode (100) and the anode (300), wherein the hybrid solid electrolyte (200) includes at least two solid electrolyte layers having different densities.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Inventors: Yu Shin KIM, Yong Suk KIM, Da Hye KIM
  • Publication number: 20230370048
    Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode, disposed on the substrate, comprising a first inclined surface and a second inclined surface; and an insertion layer disposed on an edge of the lower electrode. The first inclined surface extends from an inclined surface of the insertion layer in a region disposed inside the insertion layer. The second inclined surface extends from the first inclined surface in a region inside a region of the first inclined surface.
    Type: Application
    Filed: January 25, 2023
    Publication date: November 16, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Su KIM, Jae Hyoung GIL, Moon Chul LEE, Yong Suk KIM, Dong Hyun PARK, Tae Kyung LEE
  • Publication number: 20230269872
    Abstract: A circuit board according to an embodiment includes: an insulating portion including a plurality of insulating layers; a circuit pattern disposed on surfaces of the plurality of insulating layers; and a via passing through at least one insulating layer among the plurality of insulating layers; wherein the insulating portion includes: a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including a plurality of insulating layers; and a third insulating portion disposed under the first insulating portion and including a plurality of insulating layers; wherein the first insulating portion is formed of prepreg containing glass fibers, wherein at least one of the second insulating portion and the third insulating portion includes a resin coated copper (RCC) and a solder resist disposed on the RCC, wherein the circuit pattern is disposed on a surface of the solder resist, and wherein the via is formed passing through the solder
    Type: Application
    Filed: June 17, 2021
    Publication date: August 24, 2023
    Inventors: Yong Suk KIM, Jeong Han KIM
  • Publication number: 20230240005
    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.
    Type: Application
    Filed: June 10, 2021
    Publication date: July 27, 2023
    Inventors: Yong Suk KIM, Jeong Han KIM, Moo Seong KIM
  • Publication number: 20230240008
    Abstract: A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.
    Type: Application
    Filed: June 17, 2021
    Publication date: July 27, 2023
    Inventors: Jeong Han KIM, Yong Suk KIM, Moo Seong KIM
  • Patent number: 11705884
    Abstract: A bulk acoustic resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a protective layer disposed to cover at least the metal pad.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: July 18, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Sang Hyun Yi, Yong Suk Kim, Sung Jun Lee, Jae Hyoung Gil, Dong Hyun Park
  • Publication number: 20230216470
    Abstract: A bulk acoustic wave resonator includes a substrate; a central portion including a first portion of a first electrode, a first portion of a piezoelectric layer, and a first portion of a second electrode laminated in order on the substrate; and a reflective region disposed laterally of the central portion and including a second portion of the first electrode, an insertion layer, a second portion of the piezoelectric layer, and a second portion of the second electrode. A side surface of the insertion layer adjacent to the central portion has an inclined surface, the first portion of the second electrode and the second portion of the second electrode are coplanar, and an end of the second electrode overlaps the inclined surface of the insertion layer in the reflective region.
    Type: Application
    Filed: May 25, 2022
    Publication date: July 6, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won HAN, Hwa Sun LEE, Jeong Hoon RYOU, Moon Chul LEE, Tae Yoon KIM, Sang Kee YOON, Yong Suk KIM, Joung Hun KIM, Sung Jun LEE, Sung Joon PARK