Abstract: An insulator composition includes Al2O3 having a particle size of 120 to 500 nm. The insulator composition has a strength of 400 to 740 MPa and a particle size of 1 ?m or less.

Abstract: A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.

Abstract: A cell packing material and a method of manufacturing the same are provided. More particularly, a cell packing material including a sealant layer, a gas barrier layer formed on the sealant layer, and an outer layer formed on the gas barrier layer, the outer layer including a polyrotaxane-based compound, and a method of manufacturing the same are provided. The cell packing material includes the outer layer having excellent elongation, scratch resistance, and chemical resistance, and thus can be easily molded into a pouch, and exhibit improved durability, and the like.

Abstract: A bulk acoustic wave resonator includes: a substrate; a membrane layer forming a cavity together with the substrate; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on a flat surface of the lower electrode; and an upper electrode covering a portion of the piezoelectric layer and exposing a side of the piezoelectric layer to air, wherein the piezoelectric layer includes a step portion extended from the side of the piezoelectric layer and disposed on the flat surface of the lower electrode.

Abstract: A bulk acoustic wave resonator includes a membrane layer, together with a substrate, forming a cavity, a lower electrode disposed on the membrane layer, a piezoelectric layer disposed on a flat surface of the lower electrode and an upper electrode covering a portion of the piezoelectric layer. An overall region at a side of the piezoelectric layer is exposed to the air. The side of the piezoelectric layer has a gradient of 65° to 90° with respect to a top surface of the lower electrode.

Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.

Abstract: There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

Abstract: The present invention introduces a touch sensing apparatus capable of adjusting an Rx frequency band, and the touch sensing apparatus can adjust the width of the Rx frequency band of a driving signal which is applied from a driving electrode of a touch screen panel and transferred to a receiving electrode of the touch screen panel, using a high pass filter and a low pass filter which are implemented with a differentiator and an integrator, respectively. The touch sensing apparatus can adjusting the resistances of a plurality of resistors and the capacitance of a capacitor, thereby selectively receiving a driving signal at each frequency and amplifying the received driving signal to a predetermined magnitude. Thus, since the touch sensing apparatus does not requires a separate filter for removing noise contained in the driving signal, the system can be simplified.

Abstract: A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: An insulator composition includes Al2O3 having a particle size of 120 to 500 nm. The insulator composition has a strength of 400 to 740 MPa and a particle size of 1 ?m or less.

Abstract: A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external surface of the body. The body contains the magnetic metal and a resin, and the pillar-shaped core part has magnetic permeability higher than that of a portion of the body disposed outside of the winding coil part.

Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.

Abstract: A method for manufacturing an inductor including preparing an insulating layer; forming a polymer layer including a coil pattern on the insulating layer; forming a stacked structure by heat treating the insulating layer and the polymer layer; and forming an external electrode to electrically connect the coil pattern for the stacked structure.

Abstract: The present invention introduces a touch sensing apparatus capable of adjusting an Rx frequency band, and the touch sensing apparatus can adjust the width of the Rx frequency band of a driving signal which is applied from a driving electrode of a touch screen panel and transferred to a receiving electrode of the touch screen panel, using a high pass filter and a low pass filter which are implemented with a differentiator and an integrator, respectively. The touch sensing apparatus can adjusting the resistances of a plurality of resistors and the capacitance of a capacitor, thereby selectively receiving a driving signal at each frequency and amplifying the received driving signal to a predetermined magnitude. Thus, since the touch sensing apparatus does not requires a separate filter for removing noise contained in the driving signal, the system can be simplified.

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

Abstract: A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder.

Abstract: Disclosed is a touch panel. The touch panel includes a substrate, a sensor part on the substrate, a connection electrode to connect the sensor part on the substrate, and an anti-view part on the connection electrode. A position of the connection electrode corresponds to a position of the anti-view part. A method of fabricating the touch panel includes forming the sensor part on the substrate, forming a connection electrode layer on the substrate, and patterning the connection electrode layer. The connection electrode layer includes a conductive layer and an anti-view layer.

Abstract: A power connection structure of a driver IC chip including a first power terminal unit formed on one side thereof, a second power terminal unit formed on the other side thereof, and a dummy power terminal unit formed between the first power terminal unit and the second power terminal unit. The driver IC chip is mounted to a liquid crystal panel of a liquid crystal display device in a chip-on-glass (COG) type. Both of the first power terminal unit and the dummy power terminal unit and both of the dummy power terminal unit and the second power terminal unit are connected through routing lines in the driver IC chip.