Patents by Inventor Yong-suk Yang

Yong-suk Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12132072
    Abstract: A display device and a method of fabricating the same are provided. The display device includes a substrate, a first electrode on the substrate, a second electrode on the substrate and spaced apart from the first electrode, a plurality of light emitting elements, at least a portion of each of which is between the first electrode and the second electrode, and contact electrodes on the first electrode, the second electrode and the light emitting elements, the contact electrodes including a conductive polymer, wherein the contact electrodes include a first contact electrode which contacts an end portion of a first portion of the light emitting elements and the first electrode and a second contact electrode which contacts an end portion of a second portion of the light emitting elements, and the second electrode and is spaced apart from the first contact electrode.
    Type: Grant
    Filed: June 5, 2023
    Date of Patent: October 29, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Si Kwang Kim, Min Suk Ko, Kab Jong Seo, Yong Hoon Yang
  • Patent number: 12050728
    Abstract: A haptic effect transmission method for providing real-time immersive content according to the present invention includes executing participatory content in which one or more users participate, collecting motion information of the users participating in the participatory content through a haptic device, multiplexing the motion information with video and audio files of the participatory content to obtain a multiplexed file, and demultiplexing the multiplexed file and providing the demultiplexed file to a display device and a haptic device of a client terminal.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 30, 2024
    Assignee: Korea Electronics Technology Institute
    Inventors: Woo Chool Park, Jun Hwan Jang, Yong Hwa Kim, Jin Wook Yang, Sang Pil Yoon, Hyun Wook Kim, Eun Kyung Cho, Min Su Choi, Jun Suk Lee, Jae Young Yang
  • Patent number: 11192300
    Abstract: Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: December 7, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Ji-Young Oh, Yong Suk Yang, Kyung Hyun Kim, Kyu Sung Lee
  • Patent number: 11110540
    Abstract: An extruder for a metal material includes a cylinder having a receiving space in which a solid metal material is provided, a nozzle extending from a lower end of the cylinder, an upper coil provided on an outer surface of the cylinder and melting the solid metal material to form a liquid metal material, and a first lower coil provided on an outer surface of the nozzle to control an extruded shape of the liquid metal material.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 7, 2021
    Assignees: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk Yang, hong hyun Shin, Bonjin Koo, In-Kyu You, sunghoon Hong
  • Patent number: 11106965
    Abstract: Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: August 31, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, Sunghoon Hong, Woo Seok Yang
  • Publication number: 20210064952
    Abstract: Provided are a radio frequency identification tag and a method of manufacturing the same. The radio frequency identification tag includes a substrate, an antenna unit provided on the substrate and configured to transmit and receive signals, an integrated circuit unit spaced apart from the antenna unit on the substrate, and an interrupter and a delay circuit unit connected in parallel between the antenna unit and the integrated circuit unit, wherein the interrupter includes a variable portion and a fixed portion opposite the variable portion, wherein the delay circuit unit includes a capacitor and a resistor.
    Type: Application
    Filed: July 10, 2020
    Publication date: March 4, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk YANG, Sunghoon HONG, Woo Seok YANG
  • Publication number: 20210055246
    Abstract: Provided is a humidity sensor including a support body, an RFID chip, an antenna, and a capacitor on the support body, a top cover sheet on the RFID chip and the antenna, and a hydrophobic material pattern on the capacitor, wherein the capacitor is exposed by the top cover sheet, the hydrophobic material pattern has a network shape including a plurality of holes, and an electrostatic capacitance of the capacitor changes according to humidity.
    Type: Application
    Filed: November 14, 2019
    Publication date: February 25, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Woo Seok YANG, Sunghoon HONG, Yong Suk YANG, Bonjin KOO
  • Publication number: 20200180223
    Abstract: Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.
    Type: Application
    Filed: February 12, 2020
    Publication date: June 11, 2020
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji-Young OH, Yong Suk YANG, Kyung Hyun KIM, Kyu Sung LEE
  • Patent number: 10612112
    Abstract: Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: April 7, 2020
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, DAELIM CHEMICAL CO., LTD.
    Inventors: Yong Suk Yang, Hong Hyun Shin, In-Kyu You, Sunghoon Hong
  • Patent number: 10563292
    Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 18, 2020
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, DAELIM CHEMICAL CO., LTD.
    Inventors: Yong Suk Yang, Hong Hyun Shin, In-Kyu You, Sunghoon Hong
  • Patent number: 10310141
    Abstract: A metamaterial structure may include a first nanoparticle and a second nanoparticle containing a different material from the first nanoparticle. The first and second nanoparticles may be provided to be adjacent to each other and to be in an electrically-coupled state.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: June 4, 2019
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Sunghoon Hong, Heon Lee, Yong Suk Yang, In-Kyu You, Soo-Jung Kim, Hak-Jong Choi
  • Patent number: 10276311
    Abstract: Disclosed are an apparatus for manufacturing electrodes and a method of manufacturing electrodes. The method of manufacturing electrodes includes providing a metal substrate having first and second surfaces opposite to each other, performing a patterning process on the first surface of the metal substrate, coating an electrode material on the first surface of the metal substrate, after the patterning process, and irradiating the electrode material, which is coated on the metal substrate, with light. The patterning process includes forming a plurality of holes to penetrate the metal substrate or forming a plurality of grooves to have a shape recessed from the first surface toward the second surface.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: April 30, 2019
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: In Gyoo Kim, In-Kyu You, Bit Na Kim, Ji Hwan Sul, Yong Suk Yang, Seok Hun Kang, sunghoon Hong
  • Publication number: 20180305563
    Abstract: Provided are a liquid metal mixture, and a method of forming a conductive pattern using the same. The liquid metal mixture includes a polymer powder of about 10 to about 90 wt %, and a liquid metal included in an amount of about 10 to about 90 wt % and covering surfaces of particles of the polymer powder, wherein the polymer powder has a polar functional group. The method includes preparing a liquid metal mixture, forming a first pattern on a substrate with the liquid metal mixture, and forming a second pattern by pressing or heating the first pattern.
    Type: Application
    Filed: April 16, 2018
    Publication date: October 25, 2018
    Inventors: Ji-Young OH, Rae-Man PARK, Kyung Hyun KIM, Hyun Woo DANG, Yong Suk YANG, Kyu Sung LEE
  • Publication number: 20180162050
    Abstract: Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.
    Type: Application
    Filed: October 18, 2017
    Publication date: June 14, 2018
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ji-Young OH, Yong Suk YANG, Kyung Hyun KIM, Kyu Sung LEE
  • Publication number: 20180053604
    Abstract: Disclosed are an apparatus for manufacturing electrodes and a method of manufacturing electrodes. The method of manufacturing electrodes includes providing a metal substrate having first and second surfaces opposite to each other, performing a patterning process on the first surface of the metal substrate, coating an electrode material on the first surface of the metal substrate, after the patterning process, and irradiating the electrode material, which is coated on the metal substrate, with light. The patterning process includes forming a plurality of holes to penetrate the metal substrate or forming a plurality of grooves to have a shape recessed from the first surface toward the second surface.
    Type: Application
    Filed: June 26, 2017
    Publication date: February 22, 2018
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: In Gyoo KIM, In-Kyu YOU, Bit Na KIM, Ji Hwan SUL, Yong Suk YANG, Seok Hun KANG, Sunghoon HONG
  • Publication number: 20180045856
    Abstract: A metamaterial structure may include a first nanoparticle and a second nanoparticle containing a different material from the first nanoparticle. The first and second nanoparticles may be provided to be adjacent to each other and to be in an electrically-coupled state.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 15, 2018
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIT UTE, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Sunghoon HONG, Heon LEE, Yong Suk YANG, In-Kyu YOU, Soo-Jung KIM, Hak-Jong CHOI
  • Publication number: 20170312849
    Abstract: An extruder for a metal material includes a cylinder having a receiving space in which a solid metal material is provided, a nozzle extending from a lower end of the cylinder, an upper coil provided on an outer surface of the cylinder and melting the solid metal material to form a liquid metal material, and a first lower coil provided on an outer surface of the nozzle to control an extruded shape of the liquid metal material.
    Type: Application
    Filed: May 1, 2017
    Publication date: November 2, 2017
    Applicants: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, hong hyun SHIN, Bonjin KOO, In-Kyu YOU, sunghoon HONG
  • Publication number: 20160298213
    Abstract: Provided is a noble metal material for 3D printing, the noble metal material including an alloy that contains gold (Au) and a first metal that is different from the gold, wherein the alloy contains about 50 wt % to about 100 wt % of the gold and contains more than about 0 wt % and at most about 50 wt % of the first metal, and the melting point of the alloy is at most 400° C.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Applicants: Electronics and Telecommunications Research Institute, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, Hong Hyun SHIN, In-Kyu YOU, Sunghoon HONG
  • Publication number: 20160298215
    Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daelim Chemical Co., Ltd.
    Inventors: Yong Suk YANG, Hong Hyun SHIN, In-Kyu YOU, Sunghoon HONG
  • Patent number: 9345123
    Abstract: A method for manufacturing a planarized printed electronic device includes performing a surface treatment on a base substrate to provide a surface treated base substrate and facilitate release during a delamination process; printing a layer having an electrode pattern onto the surface-treated base substrate; forming an organic material layer comprised of an organic material on the base substrate on which the printed layer is printed such that the printed layer is embedded therein to provide an embedded layer; providing a target substrate onto which the embedded layer is to be transferred; laminating by sandwiching the embedded layer between the base substrate on which the embedded layer is formed and the target substrate; delaminating by detaching the embedded layer from the base substrate; and transferring the printed layer onto the target substrate to provide a planarized printed layer. Large areas with reduced defects due to surface roughness are possible.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: May 17, 2016
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk Yang, In-Kyu You, Minseok Kim, Soon-Won Jung, Bock Soon Na, Sang Chul Lim