Patents by Inventor Yong-suk Yang

Yong-suk Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150303002
    Abstract: Provided is a method for manufacturing a capacitor. The method includes forming a separator on a first electrode, forming a second electrode on the separator, and filling pores with an electrolyte, wherein the separator includes patterns and pores defined by the patterns, and the patterns formed by directly applying an ink to the first electrode through a printing process.
    Type: Application
    Filed: August 25, 2014
    Publication date: October 22, 2015
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ho-Gyeong YUN, In-Kyu YOU, Yong Suk YANG, Sunghoon HONG
  • Publication number: 20150273833
    Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
    Type: Application
    Filed: June 12, 2015
    Publication date: October 1, 2015
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk YANG, In-Kyu YOU, Soon-Won JUNG, Bock Soon NA, Seok-Hwan MOON
  • Patent number: 9142801
    Abstract: Provided is a method for manufacturing a flexible electrode substrate. The method includes forming a microlens array under a film, forming a transparent electrode layer on the film so as to oppose the microlens array, and forming a grid electrode between the film and the transparent electrode layer or on the transparent electrode layer. Herein, the grid electrode and the microlens array are formed on the both sides of the film by performing at least one of an inkjet printing process, a roll-to-roll printing process, a screen printing process, and a stamping printing process.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: September 22, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Bon Koo, In-Kyu You, Yong Suk Yang, Minseok Kim
  • Patent number: 9085140
    Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: July 21, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk Yang, In-Kyu You, Soon-Won Jung, Bock Soon Na, Seok-Hwan Moon
  • Patent number: 9044964
    Abstract: A micro ballpoint pen enabling to print directly straight, oblique, curved, dashed, broken and wavy lines and a printing apparatus including the same. The micro ballpoint pen may include a tip body including a caulking portion, at least one inner protrusion, and at least one expansible or shrinkable elastic portion, a ball provided between the caulking portion and the inner protrusion, the ball contacting and rolling on a target printing object to eject ink onto the target printing object, a supporting bar pressing the ball toward the caulking portion to form an ink outflowing channel between the caulking portion and the ball, and a control part expanding or shrinking the elastic portion to control the ink outflowing channel.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: June 2, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: SangChul Lim, Yong Suk Yang, Seongdeok Ahn, Kyoung Ik Cho
  • Publication number: 20150109719
    Abstract: Provided is a method of forming a graphene electrode including providing a solution including graphenes on a substrate, pressing a mold having a pattern onto the substrate to fill up the solution in the pattern of the mold, applying a temperature and a pressure to the mold so that the graphenes are arranged in a vertical direction with respect to a surface of the substrate, removing the solution, and separating the mold from the substrate to form an electrode including the graphenes on the substrate.
    Type: Application
    Filed: April 29, 2014
    Publication date: April 23, 2015
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ho-Gyeong YUN, In-Kyu YOU, Yong Suk YANG, Sunghoon HONG
  • Publication number: 20140205747
    Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Su Jae LEE, Taeyoub KIM, Soon-Won JUNG, Kang-Jun BAEG
  • Patent number: 8786441
    Abstract: Provided is a radio frequency identification (RFID) tag. The RFID tags includes: a conductive layer and a conductive line disposed above and below an insulation layer, respectively; an antenna connected to one end of the conductive line; a resistor connected to the other end of the conductive line; a first conductive plate connected to the conductive line and constituting a first capacitor in conjunction with the conductive layer and the insulation layer; and a first sensing device connected between the conductive line and the conductive layer and having an impedance changed according to a sensing of a first target material.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: July 22, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo
  • Patent number: 8723042
    Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: May 13, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo, Su Jae Lee, Taeyoub Kim, Soon-Won Jung, Kang-Jun Baeg
  • Publication number: 20140076610
    Abstract: Disclosed are a method for manufacturing a planarizing printed electronic device and a planarizing printed electronic device manufactured by using the same by simply implementing a large-area embedded printed electronic device by coupling a printing process such as inkjet printing and gravure printing and a transferring process using a laminating device and particularly, solving defects due to large surface roughness and a thickness of a printed layer included in the printed electronic device, when manufacturing an embedded printed electronic device where a printed layer is embedded in a substrate.
    Type: Application
    Filed: July 3, 2013
    Publication date: March 20, 2014
    Inventors: Yong Suk YANG, In-Kyu You, Minseok Kim, Soon-Won Jung, Bock Soon Na, Sang Chul Lim
  • Patent number: 8673403
    Abstract: Provided is a method of forming a fine pattern of a polymer thin film using a phenomenon that another material having a large difference in surface energy in comparison with a polymer thin film pattern is dewetted on the polymer thin film pattern. Two polymer materials having a large difference in surface energy can be applied to readily and conveniently form a fine pattern of a polymer thin film of micrometer or sub-micrometer grade.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: March 18, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong Hyun Kim, Sang Chul Lim, Yong Suk Yang, Zin Sig Kim, Doo Hyeb Youn
  • Publication number: 20140063124
    Abstract: Provided are a large-area nano-scale active printing device, a fabricating method of the same, and a printing method using the same. The printing device may include a substrate, first interconnection lines extending along a first direction, on the substrate, an interlayered dielectric layer provided on the first interconnection lines to have holes partially exposing the first interconnection lines, second interconnection lines provided adjacent to the holes in the interlayered dielectric layer to cross the first interconnection lines, and wedge-shaped electrodes provided at intersections with the first and second interconnection lines and connected to the first interconnection lines. The wedge-shaped electrodes protrude upward at centers of the holes.
    Type: Application
    Filed: August 14, 2013
    Publication date: March 6, 2014
    Inventors: Yong Suk Yang, In-Kyu You, Soon-Won Jung, Bock Soon Na, Seok-Hwan Moon
  • Publication number: 20140062838
    Abstract: Provided is a mobile e-binder system including at least one display configured to display data, a docking system electrically connected to the at least one display to exchange the data using a standardized communication protocol, and a computing device configured to store and process the data and send the data to the at least one display. The at least one display may be configured to be attachable and detachable to the docking system.
    Type: Application
    Filed: July 19, 2013
    Publication date: March 6, 2014
    Inventors: In-Kyu YOU, Seok-Hwan Moon, Yong-Suk Yang, Soon-Won Jung
  • Publication number: 20130292160
    Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Yong-Young NOH
  • Patent number: 8516689
    Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: August 27, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Suk Yang, In-Kyu You, Jae Bon Koo, Yong-Young Noh
  • Publication number: 20130108777
    Abstract: Provided is a method for manufacturing a flexible electrode substrate. The method includes forming a microlens array under a film, forming a transparent electrode layer on the film so as to oppose the microlens array, and forming a grid electrode between the film and the transparent electrode layer or on the transparent electrode layer. Herein, the grid electrode and the microlens array are formed on the both sides of the film by performing at least one of an inkjet printing process, a roll-to-roll printing process, a screen printing process, and a stamping printing process.
    Type: Application
    Filed: July 20, 2012
    Publication date: May 2, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Bon KOO, In-Kyu YOU, Yong Suk YANG, Minseok KIM
  • Publication number: 20130092415
    Abstract: The inventive concept provides cables, methods of manufacturing the same, and apparatuses for depositing a dielectric layer. The cable may include a first electrode, a second electrode spaced apart from the first electrode, and a dielectric layer disposed between the first and second electrodes and including a polymer having xylene as a monomer.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 18, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Suk YANG, In-Kyu YOU, Jae Bon KOO, Soon-Won JUNG
  • Publication number: 20130081570
    Abstract: Provided are a micro ballpoint pen enabling to print directly straight, oblique, curved, dashed, broken and wavy lines and a printing apparatus including the same. The micro ballpoint pen may include a tip body including a caulking portion, at least one inner protrusion, and at least one expansible or shrinkable elastic portion, a ball provided between the caulking portion and the inner protrusion, the ball contacting and rolling on a target printing object to eject ink onto the target printing object, a supporting bar pressing the ball toward the caulking portion to form an ink outflowing channel between the caulking portion and the ball, and a control part expanding or shrinking the elastic portion to control the ink outflowing channel.
    Type: Application
    Filed: September 6, 2012
    Publication date: April 4, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: SangChul LIM, Yong Suk Yang, Seongdeok Ahn, Kyoung Ik Cho
  • Publication number: 20130056713
    Abstract: The inventive concept provides organic light emitting diodes and methods of fabricating the same. The method may include forming an insulating layer on a substrate, coating a metal ink on the insulating layer, thermally treating the substrate to permeate the metal ink into the insulating layer, thereby forming an assistant electrode layer the insulating layer and the metal ink embedded in the insulating layer, and sequentially forming a first electrode, an organic light emitting layer, a second electrode on the assistant electrode layer.
    Type: Application
    Filed: July 5, 2012
    Publication date: March 7, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Bon KOO, In-Kyu YOU, Yong Suk YANG, Tae-Youb KIM, Minseok KIM
  • Patent number: 8344366
    Abstract: Provided are an organic thin film transistor and a method of forming the same. The method comprises forming a gate electrode on a substrate, forming a gate dielectric, which covers the gate electrode and includes a recess region at an upper portion, on the substrate, forming a source electrode and a drain electrode in the recess region, and forming an organic semiconductor layer between the source electrode and the drain electrode in the recess region.
    Type: Grant
    Filed: August 18, 2010
    Date of Patent: January 1, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kang Dae Kim, In-Kyu You, Jae Bon Koo, Yong Suk Yang, Seung Youl Kang