Abstract: An optical image modulator and a method of manufacturing the same. The optical image modulator includes a substrate, an N electrode contact layer formed on the substrate, a lower distributed Bragg reflection (DBR) layer, a quantum well layer, an upper DBR layer, and a P electrode contact layer sequentially stacked on the N electrode contact layer, a P electrode formed on the P electrode contact layer, and an N electrode formed on the N electrode contact layer. The N electrode is a frame that surrounds the lower DBR layer.

Abstract: The present invention relates to a silicon multilayer anti-reflective film with a gradually varying refractive index and a manufacturing method therefor, and a solar cell having the same and a manufacturing method therefor, wherein: the refractive index of a silicon thin film is adjusted by depositing silicon on a semiconductor or glass substrate with a slight tilt; and an anti-reflective film with a gradually varying refractive index is implemented using a silicon multi-layer film in which multi-layer film are stacked with different tilt angles. In addition, the silicon multilayer anti-reflective film according to the present invention is applied to a silicon solar cell, thereby suppressing reflection in the inside of the solar cell and providing an excellent heat radiation characteristic using a high heat transfer coefficient.

Abstract: A method of fabricating nanostructure for antireflection and a method of fabricating a photo device integrated with the nanostructure for antireflection are provided. The fabrication of the nanostructure for antireflection includes coating a solution containing a combination of metal ions with organic or inorganic ions on a substrate, sintering the coated solution using an annealing process to grow nanoscale metal particles, and chemically etching the substrate using the metal particles as mask or accelerator to form a subwavelength nanostructure on the surface of the substrate, thereby manufacturing the nanostructure for antireflection without an apparatus requiring a vacuum state using a simple method for a short amount of time to minimize reflection of light at an interface between a semiconductor material and the air, and producing a photo device having good luminous efficiency and performance at low cost in large quantities by applying it to the photo device.

Abstract: An optical modulator that performs wide bandwidth optical modulation by using multiple Fabry-Perot resonant modes, and an apparatus for capturing a three-dimensional image including the optical modulator are provided. The optical modulator may include: a substrate; a first contact layer disposed on the substrate; a bottom distributed Bragg reflective (DBR) layer disposed on the first contact layer; an active layer disposed on the bottom DBR layer and includes a multiple quantum well layer; a top DBR layer disposed on the active layer; a cavity layer disposed in the top DBR layer; and a second contact layer disposed on the top DBR layer. Since the optical modulator achieves both a high contrast ratio and a wide bandwidth by using two or more Fabry-Perot resonant modes, the optical modulator may show a stable performance even when a resonant wavelength is changed during manufacture or due to an external environment such as temperature.

Abstract: The present invention provides an optical connection component which comprises a solid state laser component for emitting a modulated beam of light in response to an applied electrical signal. The optical connection component also comprises an optical lens positioned relative to the solid state laser component at a predetermined position in which the optical lens reduces divergence of the emitted beam of light. The optical lens is formed at the predetermined position in a manner such that the optical lens is immobile relative to the solid state laser component. The optical connection component further comprises an optical waveguide having a core for guiding the light. The optical waveguide has first and second end-portions. The first end-portion is positioned for coupling the modulated light from the optical lens into the core.

Abstract: An optical image modulator and a method of manufacturing the same. The optical image modulator includes a substrate, an N electrode contact layer formed on the substrate, a lower distributed Bragg reflection (DBR) layer, a quantum well layer, an upper DBR layer, and a P electrode contact layer sequentially stacked on the N electrode contact layer, a P electrode formed on the P electrode contact layer, and an N electrode formed on the N electrode contact layer. The N electrode is a frame that surrounds the lower DBR layer.

Abstract: The present invention relates to a wavelength conversion laser system and provides a wavelength conversion laser system including a semiconductor optical amplifier, an optical condenser that condenses light emitted from the optical amplifier, a diffraction grating plate that induces wavelength components of the light having passed through the optical condenser in different directions, and an optical very large scale integration (VLSI) processor.

Abstract: A wavelength-tunable laser system includes an optical fiber collimator array having at least two ports, an optical amplifier connected to one port of an optical fiber, an optical coupler for coupling light incident from the optical amplifier and transmitting the coupled light to another port, a diffraction grating plate for guiding each wavelength component of light incident from the optical fiber collimator array in a different direction, and an Opto-Very Large Scale Integration (Opto-VLSI) processor.

Abstract: The present disclosure provides an optical connection system which comprises optical components that include a plurality of vertical cavity surface emitting lasers (VCSELs) for emitting modulated light in response to applied electrical signals and a plurality of receivers for receiving the emitted light. The optical components are arranged in at least two monolithically integrated modules each comprising at least two of the optical components. The optical connection system further comprises at least one light guiding component for guiding the light between the VCSELs and the receivers. The optical connection system also comprises coupling elements for coupling the at least one light guiding component to the monolithically integrated modules such that in use light is transmitted between modules via the at least one light guiding component.

Abstract: Provided are a method of fabricating a microlens using selective etching of a compound semi-conductor and a method of fabricating a photoelectric device having the microlens. The formation of the microlens includes patterning a compound semiconductor layer and removing a lateral surface of the compound semiconductor layer to form a roughly hemispheric lens. The lateral surface of the compound semiconductor layer is removed by a digital alloy method. In particular, the lateral surface of the compound semiconductor layer is removed by a wet etching process.

Abstract: Optical modulator having wide bandwidth based on Fabry-Perot resonant reflection is disclosed. The optical modulator includes: a bottom Distributed Bragg Reflector (DBR) layer; a top DBR layer including at least one layer, and a modified layer; and an active layer disposed between bottom and top DBR layers, wherein the at least one layer includes at least one pair of a first refractive index layer having a first refractive index and a second refractive index layer having a second refractive index, the modified layer includes at least one pair of a third refractive index layer having a third refractive index and a fourth refractive index layer having a fourth refractive index, the third and the fourth refractive indexes being different, and at least one of the third and the fourth refractive index layers has a second optical thickness that is not ?/4 or that is not an odd multiple thereof.

Abstract: The present invention relates to the apparatus and method for optical interconnection. The present invention provides an optical interconnection structure comprising: a substrate on which double side perforated multi-hole through a predetermined region is formed; bottom hole which is etched and tapered for optical fiber array is bigger than upper hole which is etched for the optical devices. The present invention provides the optical interconnection structure that can facilitate the optical interconnection between the active optoelectronic devices that transmit/receive the optical signals and the optical fiber array, making it possible to align easily and acutely between the optical devices and optical fiber array.

Abstract: A method of fabricating an antireflective grating pattern and a method of fabricating an optical device integrated with an antireflective grating pattern are provided. The method of fabricating the antireflective grating pattern includes forming a photoresist (PR) pattern on a substrate using a hologram lithography process, forming a PR lens pattern having a predetermined radius of curvature by reflowing the PR pattern, and etching the entire surface of the substrate including the PR lens pattern to form a wedge-type or parabola-type antireflective subwavelength grating (SWG) pattern having a pointed tip on a top surface of the substrate. In this method, a fabrication process is simplified, the reflection of light caused by a difference in refractive index between the air and a semiconductor material can be minimized, and the antireflective grating pattern can be easily applied to optical devices.

Abstract: The present invention provides an optical connection component which comprises a solid state laser component for emitting a modulated beam of light in response to an applied electrical signal. The optical connection component also comprises an optical lens positioned relative to the solid state laser component at a predetermined position in which the optical lens reduces divergence of the emitted beam of light. The optical lens is formed at the predetermined position in a manner such that the optical lens is immobile relative to the solid state laser component. The optical connection component further comprises an optical waveguide having a core for guiding the light. The optical waveguide has first and second end-portions. The first end-portion is positioned for coupling the modulated light from the optical lens into the core.

Abstract: Provided are a method of fabricating a microlens using selective etching of a compound semi-conductor and a method of fabricating a photoelectric device having the microlens. The formation of the microlens includes patterning a compound semiconductor layer and removing a lateral surface of the compound semiconductor layer to form a roughly hemispheric lens. The lateral surface of the compound semiconductor layer is removed by a digital alloy method. In particular, the lateral surface of the compound semiconductor layer is removed by a wet etching process.

Abstract: Disclosed is a method of manufacturing a distributed feedback semiconductor laser device. In order to form a grating in only a channel, an etching mask, which is used when forming a ridge waveguide, is allowed to remain. A portion of sides of an ohmic contact layer is removed. A metal layer that remains at locations other than a location of the grating is removed by a lift-off method. According to an embodiment of the invention, a holographic exposure method or a nanoimprint method is used in forming a grating of the distributed feedback laser device, and the grating is formed in a self-aligned manner. The distributed feedback laser device that is manufactured according to the embodiment of the invention can be formed by using a technology and a structure that are suitable for mass production. Further, excellent reproducibility can be ensured and production costs can be decreased in the distributed feedback laser device, thereby complementing a disadvantage of an existing distributed feedback laser device.

Abstract: A ferroelectric memory device and a method of fabricating the same are disclosed. Four interlayer dielectric layers are stacked on cell array and peripheral circuit regions on a semiconductor substrate. A gate contact pad and a source/drain contact pad are connected to a gate electrode and a source/drain of the peripheral circuit transistor through the first interlayer dielectric layer. A gate contact plug and a source/drain contact plug are respectively connected to the gate contact pad and the source/drain contact pad through the second interlayer dielectric layer. First via holes expose the gate contact plug and the source contact plug through the third interlayer dielectric layer. A first interconnection extends between the third and fourth interlayer dielectric layers, covering the sidewalls of the first via holes and connected to at least one of the gate contact plug and the source/drain contact plug.

Abstract: The method of forming a ferroelectric memory device includes forming capacitor patterns over a substrate, each capacitor pattern having an adhesive assistant pattern, a lower electrode, a ferroelectric pattern, and an upper electrode. An oxygen barrier layer is formed over the substrate and is etched to expose a sidewall of the ferroelectric pattern but not a sidewall of the adhesive assistant pattern. Then, a thermal process for curing ferroelectricity of the ferroelectric pattern is performed.

Abstract: A ferroelectric memory device and a method of fabricating the same are disclosed. Four interlayer dielectric layers are stacked on cell array and peripheral circuit regions on a semiconductor substrate. A gate contact pad and a source/drain contact pad are connected to a gate electrode and a source/drain of the peripheral circuit transistor through the first interlayer dielectric layer. A gate contact plug and a source/drain contact plug are respectively connected to the gate contact pad and the source/drain contact pad through the second interlayer dielectric layer. First via holes expose the gate contact plug and the source contact plug through the third interlayer dielectric layer. A first interconnection extends between the third and fourth interlayer dielectric layers, covering the sidewalls of the first via holes and connected to at least one of the gate contact plug and the source/drain contact plug.

Abstract: The method of forming a ferroelectric memory device includes forming capacitor patterns over a substrate, each capacitor pattern having an adhesive assistant pattern, a lower electrode, a ferroelectric pattern, and an upper electrode. An oxygen barrier layer is formed over the substrate and is etched to expose a sidewall of the ferroelectric pattern but not a sidewall of the adhesive assistant pattern. Then, a thermal process for curing ferroelectricity of the ferroelectric pattern is performed.