Abstract: The present invention relates to an optical article, and an optical filter and an imaging device including the same. The optical article comprises: a near-infrared absorption glass substrate including a divalent copper ion as a chromatic ingredient; and a pigment dispersion layer formed on one surface or both surfaces of the near-infrared absorption glass substrate and having a near-infrared absorption pigment and an ultraviolet absorption pigment dispersed across the resin matrix thereof. Provided with a first and a second transmission cut-off region, the optical article has the advantage of allowing the fabrication of an excellent near-infrared cut-off filter that can effectively block light in near-infrared and ultraviolet bands and does not permit a difference in color sense with the change of incident angles.

Abstract: Disclosed are a method of manufacturing graphene and an apparatus therefor. The method of manufacturing graphene and the apparatus therefor according to the present disclosure allow production of high-quality graphene in a simple manner in a short time without addition of a separate additive.

Abstract: An optical film for efficiently and uniformly diffuses and collects the light from mini LEDs or micro LEDs, the bead diffusion layer and the pattern diffusion layer of the first diffusion sheet are formed such that a first diffusion rate of the light on the one surface of the first diffusion sheet is higher than a second diffusion rate of the light on the other surface of the first diffusion sheet.

Abstract: A device according to an embodiment of the present disclosure is for assisting in sitting on and getting up from a toilet stool and having a communication module for transmitting an emergency call signal. The device assists in sitting on and getting up from the toilet stool which is provided in a restroom for users with restricted mobility, such as the elderly and the weak, patients with arthritis, patients with spinal disorders, etc. More particularly, the device assists in sitting on and getting up from the toilet stool which assists the restroom users to sit on or get up from the toilet stool so that the users may use the toilet stool more conveniently and safely, and has a communication module provided therewith for the users to transmit an emergency call signal that may notify a guardian or a relevant organization when an emergency occurs.

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

Abstract: An optical film for transmitting light emitted from a mini or micro light-emitting diode comprises a first diffusion sheet allowing the light to be emitted at one surface thereof, having, on the one surface thereof, a bead diffusion layer, which includes beads for the diffusion of the light, and having, on the other surface thereof, a pattern diffusion layer which includes a pattern for the diffusion of the light; and a first prism sheet having a plurality of prisms arranged on one surface thereof in a predetermined direction in order to concentrate the light that has passed through the first diffusion sheet, wherein the bead diffusion layer and the pattern diffusion layer of the first diffusion sheet can be formed such that a first diffusion rate of the light on the one surface of the first diffusion sheet is higher than a second diffusion rate of the light on the other surface of the first diffusion sheet.

Abstract: The present invention relates to an optical article, and an optical filter and an imaging device including the same. The optical article comprises: a near-infrared absorption glass substrate including a divalent copper ion as a chromatic ingredient; and a pigment dispersion layer formed on one surface or both surfaces of the near-infrared absorption glass substrate and having a near-infrared absorption pigment and an ultraviolet absorption pigment dispersed across the resin matrix thereof. Provided with a first and a second transmission cut-off region, the optical article has the advantage of allowing the fabrication of an excellent near-infrared cut-off filter that can effectively block light in near-infrared and ultraviolet bands and does not permit a difference in color sense with the change of incident angles.

Abstract: Disclosed are a method of manufacturing graphene and an apparatus therefor. The method of manufacturing graphene and the apparatus therefor according to the present disclosure allow production of high-quality graphene in a simple manner in a short time without addition of a separate additive.

Abstract: A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

Abstract: A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

Abstract: A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.

Abstract: A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.

Abstract: A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.