Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

Abstract: A polarizing plate includes a polarizer, and a quarter wave film (QWF) layer and a +C (positive C) plate layer, which are disposed on a lower side of the polarizer, wherein a total refractive index ratio Nz of the polarizer, the quarter wave film layer, and the +C plate layer is 0.1 to 0.8, and thereby shows excellent antireflection effects in an oblique direction of a screen as well as in a front direction thereof, and an image display apparatus including the same.

Abstract: A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1×Td and D2×Td are greater than 20 ?m2, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

Abstract: A semiconductor package includes a first semiconductor chip including a first through-silicon via (TSV), a second semiconductor chip stacked on the first semiconductor chip and including a second TSV, and a non-conductive film formed between the first semiconductor chip and the second semiconductor chip. The non-conductive film includes two layers having different viscosities.

Abstract: A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.

Abstract: Disclosed are amorphous carbon nanofibers including copper nanoparticles or copper alloy nanoparticles, copper composite nanoparticles prepared by grinding the amorphous carbon nanofibers and implemented as surfaces of Cu-included particles are partially or wholly coated with amorphous carbons, a dispersed solution including the copper composite nanoparticles, and preparation methods thereof and the amorphous carbon nanofibers include nanoparticles including copper, copper nanoparticles or copper alloy nanoparticles, and, the copper composite nanoparticles are implemented as surfaces of Cu-included particles are partially or wholly coated with amorphous carbons.

Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Abstract: The present invention relates to an X-ray targeting device which includes a frame installed at an X-ray generator of an X-ray imaging device which outputs X-rays toward a patient to be measured, and a light radiation unit installed at the frame, and radiating guide light in accordance with a direction in which the X-rays are output to display a radiated position or radiated range of the X-rays with respect to the patient. According to the present invention, since an X-ray targeting device includes a light radiation unit radiating guide light in accordance with a radiated direction of X-rays, a worker can easily identify the radiated direction or the radiated range of the X-rays, thereby saving time and effort required for X-ray imaging.

Abstract: A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.

Abstract: Provided are a kit for measuring a titer of a human antibody, a humanized antibody, or a human Fc-fusion protein in human plasma or serum, and a method for measuring a titer of a human Fc-containing protein in human plasma or serum using the same, and more specifically, a kit for measuring a titer of human Fc-containing protein in human plasma or serum, the kit including a diluent for sample, a diluent for conjugate, and a cleansing solution and being used in analysis through an indirect enzyme-linked immunosorbent assay (indirect ELISA), and a method for measuring a titer of human Fc-containing protein in human plasma or serum using the same.

Abstract: The present invention relates to a touch sensing electrode with a polarizing plate, a display device comprising the same, and a method for fabricating the same. The touch sensing electrode with a polarizing plate according to the present invention comprises a touch sensing electrode capable of being folded and unfolded on its folding axis; a retardation film disposed on the touch sensing electrode and having a slow axis that forms an inclined angle with the folding axis; and a polarizing plate disposed on the retardation film.

Abstract: A method and apparatus for suppressing vocoder noise are provided. In the method, first information and second information are received from a channel decoder, the first information indicating whether a decoded data frame has an error and the second information being a channel quality metric, error concealment voice decoding is performed on the decoded data frame if the first information indicates that no channel decoding error has been generated and the second information is smaller than a predetermined first threshold, and normal voice decoding is performed on the decoded data frame if the first information indicates that no channel decoding error has been generated and the second information is equal to or larger than the first threshold.

Abstract: A tear collection device comprises: a body attached to an eyeball; a tear inlet for allowing tear to flow into the body; a storing space formed inside the body and capable of storing the tears having flowed into the body; and a pump forming a pressure difference inside the body such that tears flow into the body through the tear inlet, wherein the pump is driven by using, as power, eye blinking movements of a wearer so as to form the pressure difference inside the body, thereby allowing the tears to flow into the body.

Abstract: The present invention provides a waveguide slot array antenna having an excitation slot arrangement radiating a signal corresponding to an operating frequency in a radiation plate, the waveguide slot array antenna comprising: a first auxiliary radiation plate installed on a main radiation plate and rotating a polarization plane of a signal radiated from the excitation slot arrangement of the main radiation plate; and a second auxiliary radiation plate installed on the first auxiliary radiation plate and distributing and radiating the signal, the polarization plane of which has been rotated in the first auxiliary radiation plate.

Abstract: Disclosed are a method for manufacturing an electrode including mixing at least two electrode materials selected from a carbon material, a metal oxide precursor, and a conductive polymer with a solvent to prepare a mixture, coating the mixture on a current collector, and radiating IPL (intense pulsed light) on the mixture coated on the current collector, the electrode manufactured according to the method, and a supercapacitor and rechargeable lithium battery including the electrode.

Abstract: A system-on-chip includes a magnetic random access memory and a security interface. The magnetic random access memory includes a plurality of memory areas, each of the plurality of memory areas having a different security level. The security interface circuitry configured to: identify a memory area from among the plurality of memory areas based on a received memory address associated with a received memory command; determine a security level associated with the identified memory area; and perform a memory operation on received data based on the received memory command and the determined security level.

Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

Abstract: A method and apparatus for forming magnetic media substrates is provided. A patterned resist layer is formed on a substrate having a magnetically susceptible layer. A conformal protective layer is formed over the patterned resist layer to prevent degradation of the pattern during subsequent processing. The substrate is subjected to an energy treatment wherein energetic species penetrate portions of the patterned resist and conformal protective layer according to the pattern formed in the patterned resist, impacting the magnetically susceptible layer and modifying a magnetic property thereof. The patterned resist and conformal protective layers are then removed, leaving a magnetic substrate having a pattern of magnetic properties with a topography that is substantially unchanged.

Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.