Abstract: An apparatus for manufacturing a semiconductor device includes a chamber and an exhaust system for exhausting byproducts from the chamber and adjusting an internal pressure of the chamber. The exhaust system includes an exhaust pipe connected to the chamber, a pump unit coupled with the exhaust pipe, and a cleaning unit connected to a portion of the exhaust pipe or directly connected to the pump unit to supply a cleaning gas to the pump unit.

Abstract: A zoom lens optical system having a third lens unit including a first correction lens unit of negative (?) power and a second correcting lens unit arranged behind the first correcting lens unit in an optical path and having positive (+) power. The system can minimize aberration variation upon hand-shaking correction and obtain high resolution upon OIS application since the third lens unit for correcting the hand-shaking is formed with a lens group of plural lenses having negative (?) power and positive (+) power. Further, the system can enhance a response speed since the minimization of aberration variation upon the hand-shaking correction can reduce driving load when lenses move due to short movement distance of the third lens unit.

Abstract: Contactless cards and a corresponding anti-collision coupling method are provided, where the method includes requesting that the cards transmit their unique identifiers that each include a fixed number of bytes, receiving the unique identifiers simultaneously as byte-wise positive pulses, counting the received positive pulses, and determining that more than one card responded if the number of received positive pulses exceeds the fixed number of bytes; and where the contactless cards each include a unique identifier having a number of bytes, a receiver for receiving an anti-collision command indicative of a desired identifier byte, a comparator in signal communication with the receiver for comparing the desired identifier byte with a corresponding byte of the unique identifier, and a transmitter responsive to the comparator for transmitting the unique identifier as byte-wise positive pulses if the desired identifier byte matches the corresponding byte of the unique identifier.

Abstract: A zoom lens optical system includes a first optical group with a first lens having negative refraction, a second lens having positive refraction, and a light path changing unit to change the path of an incident light passing through the first lens to have light incident on the second lens. A second optical group is provided for varying magnification. The second optical group has a third lens having negative refraction, a fourth lens, and a fifth lens, wherein the fourth and fifth lenses are integrally connected and have negative refraction. A third optical group includes an iris diaphragm, a sixth lens having positive refraction, and a seventh lens having negative refraction. A fourth optical group is provided for focusing. The fourth optical group has an eighth lens and a ninth lens being integrally connected and both having positive refraction.

Abstract: Provided is a high voltage transistor in a flash memory device comprising: a source/drain junction of a DDD structure consisting of a high-concentration impurity region and a low-concentration impurity region surrounding the high-concentration impurity region, the high-concentration impurity region being formed in parallel with a gate electrode at a distance spaced by a location in which a contact hole is formed, and having a rectangular shape whose width is the same as or wider than that of the contact hole and whose length is the same as or narrower than that of an active region through which the gate electrode passes. Accordingly, a current density to pass the gate electrode neighboring the contact hole portion and a current density to pass the gate electrode at a portion where the contact hole cannot be formed become uniform. A uniform and constant saturation current can be obtained regardless of the number of the contact hole.

Abstract: The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.

Abstract: A zoom lens optical system includes a first optical group with a first lens having negative refraction, a second lens having positive refraction, and a light path changing unit to change the path of an incident light passing through the first lens to have light incident on the second lens. A second optical group is provided for varying magnification. The second optical group has a third lens having negative refraction, a fourth lens, and a fifth lens, wherein the fourth and fifth lenses are integrally connected and have negative refraction. A third optical group includes an iris diaphragm, a sixth lens having positive refraction, and a seventh lens having negative refraction. A fourth optical group is provided for focusing. The fourth optical group has an eighth lens and a ninth lens being integrally connected and both having positive refraction.

Abstract: An IC card system for transceiving data signal between an IC card processor and an IC card in the manner of non-contact are provided. The IC card modulates the signal to be transmitted to the processor in the manner of Quadrature Amplitude Modulation and generates the modulated signal. A card reader demodulates the signal received from the IC card in the manner of QAM. The rate of the data signal transmitted from the IC card to the card reader is improved.

Abstract: The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.

Abstract: Disclosed is a flash memory cell and method of manufacturing the same, and programming/erasing/reading method thereof. The flash memory cell comprises a first tunnel oxide film formed at a given region of a semiconductor substrate, a first floating gate formed on the first tunnel oxide film, a second tunnel oxide film formed over the semiconductor substrate and along one sidewall of the first floating gate, a second floating gate isolated from the first floating gate while contacting the second tunnel oxide film, a dielectric film formed on the first floating gate and the second floating gate, a control gate formed on the dielectric film, a first junction region formed in the semiconductor substrate below one side of the second tunnel oxide film, and a second junction region formed in the semiconductor substrate below one side of the first tunnel oxide film. Therefore, the present invention can implement 2-bit cell or 3-bit cell of a high density using the existing process technology.

Abstract: The present invention relates to a multilayer ceramic package providing an improved connection pattern structure between inside and outside terminals and a fabrication method thereof. The ceramic package internally mounts at least one component and is formed by stacking a plurality of ceramic sheets one atop another. Internal patterns are formed in at least a portion of the ceramic sheets. A lid is mounted on the layered structure above the cavity to maintain the cavity airtight. Outside connection terminals are formed in outer portions of the layered structure. Internal connection patterns are separately formed horizontally in at least two of the ceramic sheets to be electrically connected with the outside connection terminals. Inside connection terminals formed within the cavity to be electrically connected with the component and at least a portion of the internal connection pattern.

Abstract: Disclosed is a flash memory cell and method of manufacturing the same, and programming/erasing/reading method thereof. The flash memory cell comprises a first tunnel oxide film formed at a given region of a semiconductor substrate, a first floating gate formed on the first tunnel oxide film, a second tunnel oxide film formed over the semiconductor substrate and along one sidewall of the first floating gate, a second floating gate isolated from the first floating gate while contacting the second tunnel oxide film, a dielectric film formed on the first floating gate and the second floating gate, a control gate formed on the dielectric film, a first junction region formed in the semiconductor substrate below one side of the second tunnel oxide film, and a second junction region formed in the semiconductor substrate below one side of the first tunnel oxide film. Therefore, the present invention can implement 2-bit cell or 3-bit cell of a high density using the existing process technology.

Abstract: The present invention relates to a biodegradable film prepared by chemical bonding of starch and polyethylene chains using polyethylene, which is polyolefin having the most widest general application, coupling agent such as maleic anhydride, methacrylic anhydride or maleimide which bonds with starch and polyethylene, and acid catalytic comonomer like acrylic acid and/or methacrylic acid and to a process for preparing thereof.The present invention was accomplished varying coupling agent such as maleic anhydride, methacrylic anhydride or maleimide at an amount of 0.01-10 weight %, acid catalytic comonomer such as acrylic acid and/or methacrylic acid at an amount of 0.01-10 weight % and radical initiator at an amount of 0.01 1.0 weight % based on the amount of polyethylene, and the reactive extrusion was appelied to lower the production cost by process simplification.There was no difference in tensile strength and tensile elongation of the prepared biodegradable films comprising up to 20 wt.

Abstract: In the present invention, the lowering of physical properties is minimized by bonding matrix resin and starch chemically using a coupling agent in the presence of an organic acid catalyst, at the same time lowering of the production cost is achieved by simplyfing the process. In the prior arts, the problems associated with low physical properties caused by starch incorporation were approached only in terms of enhanced physical interacting strength between matrix resin and starch.The purposes of the present invention are to provide a biodegradable polyethylene composition chemically bonded with starch comprising 100 parts by weight of matrix resin, 5-400 parts by weight of biodegradable incorporating material, 0.01-10 parts by weight of coupling agent, 0.01-1.0 parts by weight of radical initiator, 0.01-5 parts by weight of Lewis acid catalyst, 0.01-10 parts by weight of autoxidizing agent and 0.01-10 parts by weight of plasticizer and to provide a process for preparing thereof.