Abstract: Disclosed are an access card processing method and an apparatus for performing the method. The access card processing method may, if a produced access card is issued by a partner terminal and then transferred/retransferred, or a user terminal holding the access card returns the access card, or the access card is retrieved by the partner terminal, provide a message related to the transfer/return/retrieval so as to enable a situation regarding the transfer/return/retrieval to be recognized.

Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.

Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.

Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Abstract: Provided is a coupling structure for easy installation and separation of a faucet. The coupling structure includes a connection body which is connected to a water supply pipe at one side and has a coupler at an opposite side. A connection pipe formed in the faucet is fitted to the coupler such that the faucet is coupled to the connection body to allow the faucet to be supplied with water and to discharge the water. A grab ring is formed in the coupler, and an actuation ring is installed in the connection pipe so as to be moved forward and backward. When the actuation ring is moved forward, the actuation ring expands the grab ring to allow the connection pipe to be separated from the coupler. Easy installation of the faucet enhances convenience in construction. Easy separation of the faucet, when necessary, enhances convenience in maintenance.

Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.

Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.

Abstract: Provided is a coupling structure for easy installation and separation of a faucet. The coupling structure includes a connection body which is connected to a water supply pipe at one side and has a coupler at an opposite side. A connection pipe formed in the faucet is fitted to the coupler such that the faucet is coupled to the connection body to allow the faucet to be supplied with water and to discharge the water. A grab ring is formed in the coupler, and an actuation ring is installed in the connection pipe so as to be moved forward and backward. When the actuation ring is moved forward, the actuation ring expands the grab ring to allow the connection pipe to be separated from the coupler. Easy installation of the faucet enhances convenience in construction. Easy separation of the faucet, when necessary, enhances convenience in maintenance.

Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.

Abstract: A multi-parts autotransferring apparatus for transferring parts to be mounted in a car body includes: a body configured to be mounted spaced apart from a ground by a plurality of supports; a vertical moving part configured to be mounted at the lower portion of the body to descend; a horizontal moving part configured to be mounted at a lower portion of the vertical moving part to be advanced and retreated in a front and rear direction; front jig parts configured to be each mounted at opposing sides of a front of the horizontal moving part; and rear jig parts configured to be each mounted at opposing sides of a rear of the horizontal moving part.

Abstract: A power supply control apparatus is connected to an electric device to control supply of power to the electric device. The apparatus includes a main power switch to apply or interrupt main power to the electric device, the main power being external input commercial AC power, an auxiliary power storage unit supplied and charged with the main power as auxiliary power, a charging/discharging unit including a charging circuit to convert the main power into DC power and charge the converted DC power in the auxiliary power storage unit, and a discharging circuit to convert the DC power in the auxiliary power storage unit into AC power and discharge the converted AC power to the electric device, and a controller to control the main power switch, and control the charging/discharging unit to selectively drive the charging circuit or the discharging circuit.

Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.

Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.

Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.

Abstract: A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.

Abstract: The present invention provides a stack memory device and a method for operating same. The stack memory device, according to the present invention, is provided with: a first memory chip in which first type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each first type memory cell; and a second memory chip in which second type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each second type memory cell, wherein first pads are connected to the dump lines of the first type memory cells and second pads are connected to the dump lines of the second type memory cells, the first pads and the second pads having one-to-one correspondence.

Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.

Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.

Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.