Patents by Inventor Yong-Woon Lee

Yong-Woon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138421
    Abstract: An in-line dumpling molding system is disclosed. The in-line dumpling molding system according to the present invention comprises: a dumpling wrapper cutting device, which cuts a supplied dough sheet to form dumpling wrappers; a dumpling-molding lower folding device, which is disposed below the dumpling wrapper cutting device, on which the cut dumpling wrappers are loaded, and which presses and folds the dumpling wrappers onto which dumpling fillings have been supplied; and a sealing device, which is disposed above the dumpling-molding lower folding device, and presses and seals the folded dumpling wrappers.
    Type: Application
    Filed: March 2, 2022
    Publication date: May 2, 2024
    Applicant: CJ CHEILJEDANG CORPORATION
    Inventors: Bong Jin JANG, Se Jin KIM, Da Woon JUNG, Soon Suk BAE, Sang Cheol KIM, Yong Gyu LEE
  • Patent number: 11928103
    Abstract: A method for configuring an observable object as a digital twin in a digital twin system of any one domain is provided. The method for configuring a digital twin includes defining a purpose for expressing the observable as a digital twin in the domain, organizing data based on a role of the observable object in the domain, configuring the observable object into the digital twin based on the data for the purpose, and synchronizing the observable object and the digital twin.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 12, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun Jeong Lee, Yong-Woon Kim, Sangkeun Yoo, Jun Seob Lee
  • Patent number: 10418920
    Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: September 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Je Hyung Cho, Alexey Bodrov, Sun Jin Kim, Yong Woon Lee
  • Patent number: 10313620
    Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: June 4, 2019
    Assignee: SK hynix Inc.
    Inventors: Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Heui-Gyun Ahn
  • Patent number: 10161117
    Abstract: Provided is a coupling structure for easy installation and separation of a faucet. The coupling structure includes a connection body which is connected to a water supply pipe at one side and has a coupler at an opposite side. A connection pipe formed in the faucet is fitted to the coupler such that the faucet is coupled to the connection body to allow the faucet to be supplied with water and to discharge the water. A grab ring is formed in the coupler, and an actuation ring is installed in the connection pipe so as to be moved forward and backward. When the actuation ring is moved forward, the actuation ring expands the grab ring to allow the connection pipe to be separated from the coupler. Easy installation of the faucet enhances convenience in construction. Easy separation of the faucet, when necessary, enhances convenience in maintenance.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: December 25, 2018
    Assignee: IDIN LAB, INC.
    Inventors: Yong Woon Lee, Jin Su Jeon, Jae Hee Won, Do Kyeong Lee
  • Patent number: 10165169
    Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: December 25, 2018
    Assignee: SK Hynix Inc.
    Inventors: Huy Chan Jung, Heui-Gyun Ahn, Sang Wook Ahn, Yong Woon Lee
  • Publication number: 20180269811
    Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.
    Type: Application
    Filed: March 22, 2018
    Publication date: September 20, 2018
    Inventors: Je Hyung CHO, Alexey BODROV, Sun Jin KIM, Yong Woon LEE
  • Patent number: 9966880
    Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Je Hyung Cho, Alexey Bodrov, Sun Jin Kim, Yong Woon Lee
  • Publication number: 20170218604
    Abstract: Provided is a coupling structure for easy installation and separation of a faucet. The coupling structure includes a connection body which is connected to a water supply pipe at one side and has a coupler at an opposite side. A connection pipe formed in the faucet is fitted to the coupler such that the faucet is coupled to the connection body to allow the faucet to be supplied with water and to discharge the water. A grab ring is formed in the coupler, and an actuation ring is installed in the connection pipe so as to be moved forward and backward. When the actuation ring is moved forward, the actuation ring expands the grab ring to allow the connection pipe to be separated from the coupler. Easy installation of the faucet enhances convenience in construction. Easy separation of the faucet, when necessary, enhances convenience in maintenance.
    Type: Application
    Filed: January 22, 2015
    Publication date: August 3, 2017
    Inventors: Yong Woon LEE, Jin Su JEON, Jae Hee WON, Do Kyeong LEE
  • Publication number: 20170179855
    Abstract: A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.
    Type: Application
    Filed: February 6, 2015
    Publication date: June 22, 2017
    Inventors: Je Hyung Cho, Alexey Bodrov, Sun Jin Kim, Yong Woon Lee
  • Patent number: 9669887
    Abstract: A multi-parts autotransferring apparatus for transferring parts to be mounted in a car body includes: a body configured to be mounted spaced apart from a ground by a plurality of supports; a vertical moving part configured to be mounted at the lower portion of the body to descend; a horizontal moving part configured to be mounted at a lower portion of the vertical moving part to be advanced and retreated in a front and rear direction; front jig parts configured to be each mounted at opposing sides of a front of the horizontal moving part; and rear jig parts configured to be each mounted at opposing sides of a rear of the horizontal moving part.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: June 6, 2017
    Assignee: Hyundai Motor Company
    Inventors: Yong Woon Lee, Kum Jong Lee
  • Patent number: 9660483
    Abstract: A power supply control apparatus is connected to an electric device to control supply of power to the electric device. The apparatus includes a main power switch to apply or interrupt main power to the electric device, the main power being external input commercial AC power, an auxiliary power storage unit supplied and charged with the main power as auxiliary power, a charging/discharging unit including a charging circuit to convert the main power into DC power and charge the converted DC power in the auxiliary power storage unit, and a discharging circuit to convert the DC power in the auxiliary power storage unit into AC power and discharge the converted AC power to the electric device, and a controller to control the main power switch, and control the charging/discharging unit to selectively drive the charging circuit or the discharging circuit.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In Joo Kim, Seok Gin Kang, Yong Woon Lee, Dong Ha
  • Patent number: 9613881
    Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: April 4, 2017
    Assignee: SK Hynix Inc.
    Inventors: Heui Gyun Ahn, Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Sung Chun Jun
  • Publication number: 20160373629
    Abstract: The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.
    Type: Application
    Filed: November 27, 2014
    Publication date: December 22, 2016
    Inventors: Huy Chan JUNG, Heui-Gyun AHN, Sang Wook AHN, Yong Woon LEE
  • Patent number: 9478464
    Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: October 25, 2016
    Assignee: SILICONFILE TECHNOLOGIES INC.
    Inventors: Heui Gyun Ahn, Sang Wook Ahn, Yong Woon Lee, Huy Chan Jung, Do Young Lee
  • Publication number: 20160301888
    Abstract: The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.
    Type: Application
    Filed: November 11, 2014
    Publication date: October 13, 2016
    Applicant: Siliconfile Technologies Inc.
    Inventors: Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG, Heui-Gyun AHN
  • Publication number: 20160267946
    Abstract: The present invention provides a stack memory device and a method for operating same. The stack memory device, according to the present invention, is provided with: a first memory chip in which first type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each first type memory cell; and a second memory chip in which second type memory cells are repeatedly arranged in row direction and column direction, and which comprises one or more cell arrays, in which a dump line is connected to the each second type memory cell, wherein first pads are connected to the dump lines of the first type memory cells and second pads are connected to the dump lines of the second type memory cells, the first pads and the second pads having one-to-one correspondence.
    Type: Application
    Filed: October 27, 2014
    Publication date: September 15, 2016
    Inventors: Sang Wook Ahn, Huy Chan Jung, Yong Woon Lee, Heui-Gyun Ahn, Do Young Lee
  • Publication number: 20160268373
    Abstract: A semiconductor apparatus having a heat dissipating function and electronic equipment comprising the same includes a front surface on which semiconductor devices constituting a circuit a circuit are formed; and a rear surface including a convexo-concave surface. Thus, the heat dissipation effect of the semiconductor apparatus can be maximized even without attaching a heat dissipation plate thereto.
    Type: Application
    Filed: October 2, 2014
    Publication date: September 15, 2016
    Inventors: Min Suk KO, Kyoung Sik PARK, Gab Hwan CHO, Heui Gyun AHN, Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG
  • Patent number: 9406652
    Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: August 2, 2016
    Assignee: SILICONFILE TECHNOLOGIES INC.
    Inventors: Sang Wook Ahn, Huy Chan Jung, Yong Woon Lee, Do Young Lee, Heui-Gyun Ahn
  • Publication number: 20160163595
    Abstract: A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.
    Type: Application
    Filed: April 30, 2014
    Publication date: June 9, 2016
    Inventors: Heui Gyun AHN, Sang Wook AHN, Yong Woon LEE, Huy Chan JUNG, Do Young LEE