Abstract: A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.

Abstract: A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.

Abstract: A multi-parts autotransferring apparatus for transferring parts to be mounted in a car body includes: a body configured to be mounted spaced apart from a ground by a plurality of supports; a vertical moving part configured to be mounted at the lower portion of the body to descend; a horizontal moving part configured to be mounted at a lower portion of the vertical moving part to be advanced and retreated in a front and rear direction; front jig parts configured to be each mounted at opposing sides of a front of the horizontal moving part; and rear jig parts configured to be each mounted at opposing sides of a rear of the horizontal moving part.

Abstract: A power supply control apparatus is connected to an electric device to control supply of power to the electric device. The apparatus includes a main power switch to apply or interrupt main power to the electric device, the main power being external input commercial AC power, an auxiliary power storage unit supplied and charged with the main power as auxiliary power, a charging/discharging unit including a charging circuit to convert the main power into DC power and charge the converted DC power in the auxiliary power storage unit, and a discharging circuit to convert the DC power in the auxiliary power storage unit into AC power and discharge the converted AC power to the electric device, and a controller to control the main power switch, and control the charging/discharging unit to selectively drive the charging circuit or the discharging circuit.

Abstract: MPEG data is compressed by obtaining difference values between succeeding adjacent data values of MPEG video data and store the difference value if the difference value is less than a predetermined range. By storing the difference values rather than the data values if the difference value is less than a predetermined range, compression may be provided for MPEG data. More specifically, a series of data values of MPEG video data is separated from an MPEG bitstream. Difference values are obtained between succeeding adjacent data values of the MPEG video data. For each data value, the data value is stored if the difference exceeds a predetermined range, and the difference value is stored if the difference value is less than the predetermined range. A conversion flag is also stored for each data value, to indicate whether the data value or the difference value is stored.

Abstract: An improved wafer boat for a vertical furnace has inner upper and lower corners formed as sloped surfaces, and has outer upper and lower corners formed as sloped surfaces. This prevents the formation and collection of particles off of the wafer boat that can generate a protrusion on the wafer boat. By preventing the formation of a protrusion, this improved wafer boat prevents damage to the wafers processed in the wafer boat and improves the reliability of semiconductor devices formed from those wafers. Also, holes are provided for locking pins on both the upper and lower plates of the wafer boat. This means that the wafer boat can be loaded into the furnace in both a rightside-up and upside-down orientation, thus increasing the lifespan of the boat and reducing boat maintenance costs.