Patents by Inventor Yong Zhou

Yong Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT PIPE
    Publication number: 20090166004
    Abstract: A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • HEAT SPREADER WITH VAPOR CHAMBER
    Publication number: 20090166008
    Abstract: A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • PUMP FOR LIQUID COOLING SYSTEM
    Publication number: 20090162225
    Abstract: A pump comprises a base (10), a case (20) fixed on the base, a rotor (30) received between the case and the base, and an inner stator (40) and an outer stator (50) accommodated in the case. The rotor is sandwiched between the inner stator and the outer stator. When the inner stator and the outer stator are energized to generate respective magnetic fields, the rotor is driven to rotate by turning torques that are produced by mutual actions between the rotor and the magnetic fields. Thus, the interior and exterior magnetic fields of the rotor can be utilized sufficiently, and an operation efficiency of the pump is enhanced accordingly.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • HEAT SINK HAVING BUMPS FOR POSITIONING HEAT PIPES THEREIN
    Publication number: 20090159252
    Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 25, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
  • HEAT SINK WITH VAPOR CHAMBER
    Publication number: 20090151906
    Abstract: A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • HEAT SINK WITH VAPOR CHAMBER
    Publication number: 20090151905
    Abstract: A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • PUMP FOR LIQUID COOLING SYSTEM
    Publication number: 20090155099
    Abstract: A pump includes a base (10), a case (20) fixed on the base, a stator (30) embedded into the case, a rotor unit (40) sandwiched between the base and the case. The rotor unit includes an inner rotor (42) surrounded by the stator and an outer rotor (44) surrounding the stator. Magnetic fields produced by the stator have interior parts interacting with the inner rotor, and exterior parts interlinking with the outer rotor. Therefore, the magnetic fields are able to be utilized sufficiently to drive the rotor unit to have a high speed rotation, and an operation efficiency of the pump is enhanced accordingly.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • HEAT SINK
    Publication number: 20090151898
    Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
  • HEAT SINK HAVING LOCKING DEVICE
    Publication number: 20090151921
    Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
  • LED LAMP WITH A HEAT SINK ASSEMBLY
    Publication number: 20090147522
    Abstract: An LED lamp includes a first heat sink, a pair of second heat sinks arranged at two opposite sides of the first heat sink, a plurality of heat pipes connecting the first heat sink to the pair of second heat sinks, and an LED module mounted on the first heat sink. With the help of good heat conducting capability of the heat pipes, heat generated by LEDs of the LED module can be conducted to the first heat sink and the pair of second heat sinks rapidly, which then dissipate the heat to the ambient air. Each second heat sink consists of a plurality of sheets defining a plurality of gaps therebetween; the gaps extend through top and bottom of each second heat sink. Each second heat sink has a lower portion below a bottom surface of the first heat sink.
    Type: Application
    Filed: March 4, 2008
    Publication date: June 11, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-JIANG SHUAI, GUANG YU, ZHI-YONG ZHOU
  • LED LAMP
    Publication number: 20090141494
    Abstract: An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.
    Type: Application
    Filed: February 1, 2008
    Publication date: June 4, 2009
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wen-Xiang Zhang, Guang Yu, Jin-Song Feng, Zhi-Yong Zhou
  • Heat dissipating light emitting diode module having fastened heat spreader
    Patent number: 7540636
    Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: June 2, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • SYSTEM AND METHOD FOR TRANSFERRING WIRELESS NETWORK ACCESS PASSWORDS
    Publication number: 20090137244
    Abstract: The present disclosure provides an access node for transferring and/or assigning network passwords. The access node includes a first interface for sending and receiving communication of a first type to and from a first node operating in a wireless local area network (WLAN). The access node also includes a second interface for sending and receiving communication of a second type to and from a second node in a mobile network, such as a GSM/GPRS network. The access node further includes a short messaging service (SMS) module for sending and receiving SMS messages to the second node carrying an OTP allocated. The access node also includes a mechanism to verify a precondition before the OTP is sent to the second node.
    Type: Application
    Filed: January 26, 2009
    Publication date: May 28, 2009
    Inventors: Yong Zhou, Prasanna J. Satarasinghe, Vladimir Alperovich, David Ka-Wai Hui, James Goss, John Baker
  • Liquid-cooling heat sink
    Patent number: 7537047
    Abstract: A liquid-cooling heat sink includes a base (10), a heat exchanger (30), a housing (20), an inlet (26) and an outlet (27). The heat exchanger (30) has a hollow (33) formed therein, and is thermally coupled to the base (10). The housing (20) has a chamber (24) formed therein, and is placed over the base (10). The chamber (24) is separated by the heat exchanger (30) into a first sub-chamber (241) and a second sub-chamber (242). The first sub-chamber (241) is in fluid communication with the second sub-chamber (242) through a plurality of microchannels (32) radially formed within the heat exchanger (30). The inlet (26) is fluidly connected to the first sub-chamber (241) so as to impinge liquid coolant to a top surface of the base (10).
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: May 26, 2009
    Assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou
  • Single-Pass Inkjet Printing
    Publication number: 20090109259
    Abstract: A single-pass print head has multiple orifice plates each serving some but not all of the area to be printed.
    Type: Application
    Filed: December 2, 2008
    Publication date: April 30, 2009
    Applicant: FUJIFILM DIMATIX, INC.
    Inventors: David Grose, Nathan Hine, Paul Hoisington, Peter N. Wallis, Yong Zhou
  • Locking device for heat sink
    Patent number: 7520313
    Abstract: A locking device (100) used for securing a heat sink (10) to a heat-generating component in accordance with an embodiment includes a pair of retainers (20). The locking device cooperates with a retention frame (30) to secure the heat sink to the heat-generating component. Each retainer (20) includes a handle (22) and a locking leg (24). The handle is pivotably mounted to fins of the heat sink via a pivot (225). The locking leg is made from a unitary sheet member and is connected to the handle at a location spaced apart from the pivot via which the handle is mounted to the heat sink. When the handle is brought to pivot about the pivot, the locking leg is driven to move in a direction to engage with the retention frame whereby the heat sink is firmly secured to the heat-generating component.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: April 21, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Jian Hu
  • HEAT DISSIPATION DEVICE FOR LED CHIPS
    Publication number: 20090095448
    Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 16, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • HEAT DISSIPATION DEVICE FOR LED CHIPS
    Publication number: 20090095959
    Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.
    Type: Application
    Filed: December 27, 2007
    Publication date: April 16, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • PIEZOELECTRIC INK JET MODULE WITH SEAL
    Publication number: 20090079801
    Abstract: A piezoelectric ink jet head that includes a polymer film, for example a flex print, located between the piezoelectric element and the reservoirs in the jet body. The film provides an efficient seal for the reservoirs and also positions the electrodes on the side of the piezoelectric element in which motion is effected, which can reduce the magnitude of the drive voltage. This location of the compliant flex print material also can enhance electrical and mechanical isolation between reservoirs, which improves jetting accuracy. The compliance of the polymer also reduces strain on the ink jet head.
    Type: Application
    Filed: December 2, 2008
    Publication date: March 26, 2009
    Inventors: Edward R. Moynihan, Paul A. Hoisington, Yong Zhou, Amy L. Brady, Robert G. Palifka
  • Heat dissipation device
    Patent number: 7489513
    Abstract: A heat dissipation device includes a first heat sink and a second heat sink juxtaposed with the first heat sink. The first heat sink includes a first base and a plurality of first fin extending from the first base with a plurality of first channels defined therebetween. The second heat sink includes a second base and a plurality of second fins extending from the second base with a plurality of second channels defined therebetween. The second fins extend beyond a common edge of the first base and the second base to extend into first channels of the first heat sink.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: February 10, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Cui-Jun Lu