Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.

Abstract: A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

Abstract: A liquid-cooling heat sink includes a base (10), a heat exchanger (30), a housing (20), an inlet (26) and an outlet (27). The heat exchanger (30) has a hollow (33) formed therein, and is thermally coupled to the base (10). The housing (20) has a chamber (24) formed therein, and is placed over the base (10). The chamber (24) is separated by the heat exchanger (30) into a first sub-chamber (241) and a second sub-chamber (242). The first sub-chamber (241) is in fluid communication with the second sub-chamber (242) through a plurality of microchannels (32) radially formed within the heat exchanger (30). The inlet (26) is fluidly connected to the first sub-chamber (241) so as to impinge liquid coolant to a top surface of the base (10).

Abstract: A miniature pump in accordance with the present invention comprises a pump casing (10) and a liquid circulating unit (20) received in the pump casing. The pump casing comprises a hollow main body (14) transversely forming a spacing plate (126) and a partition wall (144) spaced from the spacing plate. The liquid circulating unit comprises a shaft (25) mounted between the partition wall and the spacing plate, a bearing (27) rotatably mounted the shaft, an impeller (26) attached to the bearing, a first pair of spaced magnetic spacers (21,22) surrounding an upper portion of the shaft and positioned above the bearing, and a second pair of spaced magnetic spacers (23, 24) surrounding a lower portion of the shaft and positioned below the bearing. The two pairs of magnetic spacers properly suspend the impeller in a stable position in an axial direction of the pump when the impeller rotates.

Abstract: A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

Abstract: A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

Abstract: A mounting assembly includes a chassis, a cover slidably mounted to the chassis in a first direction, and a clamping member securely mounted on the cover. The chassis comprises a rear wall having a locking portion thereon. The clamping member has a positioning portion thereon for engaging with the locking portion, and a pressing portion for urging the positioning portion to disengage from the locking portion. When the pressing portion of the clamping member is pressed in a second direction perpendicular to the first direction, the positioning portion is resiliently bent in the second direction, thereby disengaging the positioning portion from the locking portion of the chassis.

Abstract: A heat dissipation device includes a heat sink (30) and a heat pipe (40) thermally attached to the heat sink. The heat sink includes a base (32) with an opening (3262) defined therethrough, and a plurality of fins (36) mounted on the base. The heat pipe comprises an evaporating portion (42) and a condensing portion (44) thermally connecting with the fins. The evaporating portion comprises a flat bottom surface (422) for directly contacting with an electronic unit (50) and an arc-shaped top surface (424) contacting with the fins at the opening of the base.

Abstract: A locking device (100) used for securing a heat sink (10) to a heat-generating component in accordance with an embodiment includes a pair of retainers (20). The locking device cooperates with a retention frame (30) to secure the heat sink to the heat-generating component. Each retainer (20) includes a handle (22) and a locking leg (24). The handle is pivotably mounted to fins of the heat sink via a pivot (225). The locking leg is made from a unitary sheet member and is connected to the handle at a location spaced apart from the pivot via which the handle is mounted to the heat sink. When the handle is brought to pivot about the pivot, the locking leg is driven to move in a direction to engage with the retention frame whereby the heat sink is firmly secured to the heat-generating component.

Abstract: A heat dissipation device includes a heat conducting plate (100) for contacting with an electronic component (400), a heat sink (200) mounted on the heat conducting plate and a heat pipe (300). The heat conducting plate comprises a groove (110) defined in. The heat pipe comprises an evaporating portion (310) sandwiched between the heat conducting plate and the heat sink, and a condensing portion (320) thermally connecting with the heat sink. The evaporating portion comprises a middle portion (3104) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions (3102) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.

Abstract: A mounting assembly includes a chassis having a rear wall, a cover slidably mounted to the chassis in a first direction, and a clamping member mounted on the cover. The rear wall has a positioning portion thereon. The clamping member has a cantilever thereon. The cantilever has a locking portion at a free end thereof for engaging with the positioning portion, and a pressing portion at an opposite end thereof for urging the locking portion to disengage from the positioning portion. When the pressing portion of the clamping member is pressed downward in a second direction perpendicular to the first direction, the locking portion is raised, thereby disengaging the locking portion from the positioning portion of the chassis.

Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.

Abstract: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract: The invention provides an isolated squirrel monkey prokineticin receptor 2 (PKR2) polypeptide containing the amino acid sequence referenced as SEQ ID NO:2. The invention also provides an isolated chimpanzee PKR2 containing the amino acid sequence referenced as SEQ ID NO:4. Also provided are methods of identifying PKR2 agonists and antagonists using the squirrel monkey PKR2 polypeptide. Additionally, the invention provides an isolated rhesus monkey PK2 polypeptide containing the amino acid sequence referenced as SEQ ID NO:6. Nucleic acid molecules encoding the disclosed polypeptides further are provided by the invention.

Abstract: A microinductor comprises a magnetic core and a coil which winds around the magnetic core. The magnetic core used in the microinductor is formed of FeCuNbCrSiB.

Abstract: A memory module assembly (1) includes a printed circuit board (30) having an electronic heat-generating component (40) thereon, a heat sink (20) and a clip (10) for securing the heat sink onto the heat-generating component mounted on the printed circuit board. The heat sink includes a base (22) and a plurality of fins (24) arranged on the base. A recess (28) is defined extending across the fins. The clip includes a retaining portion (12) resting against a face of the printed circuit board opposite the heat sink and an elastic pressing portion (16) spaced from the retaining portion. The pressing portion is received in the recess of the heat sink and resiliently presses the base of the heat sink toward the heat-generating component, whereby the clip clamps the heat sink and the printed circuit board therebetween.

Abstract: A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger includes a heat conductive member (10) thermally connecting with the cold plate to fins (60).

Abstract: A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting to a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set therebetween and thermally engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set therebetween and thermally engaging with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates therebetween and thermally engaging with the first and second base plates.