Abstract: A packaging method for segregating die paddles of a leadframe, includes (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are connected to each other by at least one connecting bar; (b) attaching a plurality of dies onto the die paddles; (c) forming a molding compound to encapsulate the dies on the die paddles, and exposing the bottom surface of the connecting bar outside the molding compound; and (d) removing part of the connecting bar so as to segregate the die paddles. The die paddles are thus rendered stable during the steps of die attaching, wire bonding and molding, and the yield is raised.

Abstract: A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor package and a second portion exposed from the lower surface of the semiconductor package. Both of the first portion and the second portion of each lead can be utilized for making external electrical connection.

Abstract: A method for manufacturing a stacked package structure is disclosed, comprising: forming a first chip package structure, comprising: providing a chip carrier having a first and a second surface in opposition to each other; forming bonding wires on the first surface; providing at least one chip on and electrically connected to the first surface; and forming an encapsulant covering the first surface, the chip and the bonding wires, wherein a top end of each bonding wire is exposed at a surface of the encapsulant; forming a plurality of electrical connections respectively deposed on the top end of each bonding wire; and providing a second chip structure electrically jointed with the electrical connections and stacked on the first chip package structure.

Abstract: A stacked package structure and a method for manufacturing the same are disclosed. The package structure comprises: a substrate having a first surface and a second surface in opposition to each other; at least one chip deposed on and electrically connected to the first surface of the substrate; a plurality of electrical connection devices deposed on the first surface and periphery of the substrate, wherein each electrical connection device is higher than the at least one chip in altitude; and an encapsulant covering the first surface of the substrate, the at least one chip and the electrical connection devices, wherein a top end of each electrical connection device is exposed at a surface of the encapsulant.

Abstract: A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. After a wire bonding step and an encapsulating step are conducted, a portion of each lead of the lead frame is etched away to form a first connection pad and a second connection pad which are separated from each other but are still electrically connected to each other via the first metal layer therebetween. Then, a second metal layer is electroplated on the connection pads and the die pads by using the first metal layer as an electrical path. Finally, the first metal layer between the first connection pads and the second connection pads is removed, and a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.

Abstract: The present invention relates to a packaging method for segregating die paddles of a leadframe. The method comprising: (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are connected to each other by at least one connecting bar; (b) attaching a plurality of dies onto the die paddles; (c) forming a molding compound to encapsulating the dies on the die paddles, and exposing the bottom surface of the connecting bar outside the molding compound; and (d) removing part of the connecting bar so as to segregate the die paddles, Whereby the die paddles are stable during the steps of die attaching, wire bonding and molding, and the yield is raised.

Abstract: A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a first portion exposed from the upper surface of the semiconductor package and a second portion exposed from the lower surface of the semiconductor package. Both of the first portion and the second portion of each lead can be utilized for making external electrical connection.

Abstract: The present invention relates to a lid and a package structure having the same. The package structure comprises a first substrate, a first chip, a lid and a second package. The first chip is disposed on and electrically connected to the top surface of the first substrate. The lid is disposed on the top surface of the first substrate and comprises a body, a plurality of through holes and a cavity. The through holes penetrate the body and have a conductive material therein. The cavity accommodates the first chip. The second package is on the lid and is electrically connected to the first substrate through the conductive material in the through holes. As a result, the amount of the signal path between the second package and the first substrate is increased, and the manufacturing cost of the package structure is low.

Abstract: A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. Each lead of the lead frame has a first portion, a second portion and a third portion connecting the first portion and the second portion, wherein the first metal layer is not provided on the third portion. After a wire bonding step and an encapsulating step are conducted, a second metal layer is selectively plated on the first portions and the second portions of the leads and the die pads exposed from the bottom of the molded product. Then, the third portion of each lead is selectively etched away such that the first portion and the second portion are electrically isolated from each other. Finally, a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.

Abstract: A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. After a wire bonding step and an encapsulating step are conducted, a portion of each lead of the lead frame is etched away to form a first connection pad and a second connection pad which are separated from each other but are still electrically connected to each other via the first metal layer therebetween. Then, a second metal layer is electroplated on the connection pads and the die pads by using the first metal layer as an electrical path. Finally, the first metal layer between the first connection pads and the second connection pads is removed, and a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.