Abstract: A quantum device includes: a quantum chip, provided with an I/O port; and a superconducting substrate, provided with transmission lines on the superconducting substrate. Each of the transmission lines includes a first section and a second section that form an included angle, a bonding connection structure is formed between one end of the first section and the I/O port, a pad for connecting to a connector is formed at one end of the second section, and a distribution spacing between the first sections is smaller than a distribution spacing between the second sections. The second sections are distributed in a region away from the quantum chip. The first section connected to the 1/0 port via aluminum wire bonding can be wired at higher density. The size of the pad on a wiring spacing is reduced, and density of the transmission lines on the superconducting substrate is increased.

Abstract: The present disclosure discloses a rolling ring shrink fitting tool for rotary equipment, including a lifting frame; a movement slot is formed in a bottom surface of a top of the lifting frame; an output end of a first motor is connected with a main gear; guide rollers are embedded in a lifting seat through bearings; shrink fitting plates are two semicircular structures; lifting lugs are welded on outer sides of the shrink fitting plates; tooth rings are arranged outside the shrink fitting plates; stop rods are fixed on inner walls of the tooth rings; supporting screw rods are embedded at sunken positions on inner walls of the shrink fitting plates through bearings.

Abstract: The present disclosure discloses a rolling ring shrink fitting tool for rotary equipment, including a lifting frame; a movement slot is formed in a bottom surface of a top of the lifting frame; an output end of a first motor is connected with a main gear; guide rollers are embedded in a lifting seat through bearings; shrink fitting plates are two semicircular structures; lifting lugs are welded on outer sides of the shrink fitting plates; tooth rings are arranged outside the shrink fitting plates; stop rods are fixed on inner walls of the tooth rings; supporting screw rods are embedded at sunken positions on inner walls of the shrink fitting plates through bearings.

Abstract: A manufacturing method for low-magnetostrictive oriented silicon steel is provided, wherein the oriented silicon steel comprises a silicon steel substrate and an insulating coating on the surface of the silicon steel substrate. The manufacturing method comprises: performing single-sided laser etching on the silicon steel substrate, wherein the side of the silicon steel substrate, on which single-sided laser etching is performed, is a first surface, and the side opposite to the first surface is a second surface; determining a deflection difference between the first surface and the second surface based on the power of the laser etching, and determining a difference in the amount of the insulating coatings on the first surface and the second surface based on the deflection difference; and forming insulating coatings on the first surface and the second surface.

Abstract: Disclosed are a superconducting quantum chip structure and a fabrication method for a superconducting quantum chip. The superconducting quantum chip structure includes a first structural member, a second structural member, and a support and connection member, where the first structural member is provided with a qubit, a read cavity, and a first connection terminal, the qubit is coupled to the read cavity, and the qubit is electrically connected to the first connection terminal; the second structural member is provided with a signal transmission line and a second connection terminal electrically connected to each other; and two ends of the support and connection member are electrically connected to the first connection terminal and the second connection terminal, respectively, and the support and connection member is configured to transmit a control signal received on the signal transmission line to the qubit.

Abstract: Disclosed are a quantum chip test structure and a fabrication method therefor, and a test method and a fabrication method for a quantum chip. The quantum chip test structure includes: a superconducting Josephson junction and a connection structure of the superconducting Josephson junction that are located on a substrate; a first isolation layer located on the connection structure, where a connection window penetrating through the first isolation layer is formed in the first isolation layer; a second isolation layer located on the first isolation layer, where a deposition window is formed in the second isolation layer; and an electrical connection portion located in the connection window and an electrical connection layer located in the deposition window, and the electrical connection layer is configured to implement electrical contact with a test device.

Abstract: Embodiments of the present specification provide a quantum chip controller, a quantum computing processing system, and an electronic apparatus. The quantum chip controller includes: an instruction execution unit for executing a quantum instruction to generate a quantum event and its corresponding time point; and a quantum chip queue control unit including: an event queue for storing a quantum event to be executed, a time queue for storing a time point corresponding to the quantum event to be executed, and a time counter for counting time, wherein when time being counted in the time counter is equal to a time point in the time queue, a quantum event corresponding to the time point is read out from the event queue and is to be executed by a quantum chip, and wherein the time counter includes an enabling control section for controlling starting and pausing of counting of the time counter.

Abstract: Embodiments of the disclosure provide a quantum chip system, a quantum computing processing system and an electronic apparatus, wherein one quantum chip system includes at least one first qubit, each first qubit includes at least two control electrodes, and a first event register for controlling the control electrode, wherein each first event register is configured for storing a control signal of the control electrode, and each first qubit corresponds to at least two first event registers.