Patents by Inventor Yongli Huang

Yongli Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120299439
    Abstract: Some examples include at least one capacitive micro-electro-mechanical transducer (cMUT). For instance, the cMUT may include a substrate, a plate, and a resilient structure therebetween. In some examples, an integrated circuit may be formed on or integrated with the plate or other portion of the cMUT. Furthermore, in some examples, two cMUTs may be arranged in a stacked configuration. For instance, one cMUT may be operable for transmission, while a second cMUT may be operable for reception.
    Type: Application
    Filed: August 7, 2012
    Publication date: November 29, 2012
    Applicant: KOLO TECHNOLOGIES, INC.
    Inventor: Yongli Huang
  • Patent number: 8247945
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a resilient structure therebetween. The resilient structure has multiple connectors distributed over the device element area to vertically transport the top player with distributed support. The resilient structure may be cantilevers formed using a middle spring layer covering cavities on the substrate. Connectors define a transducing space below the top plate. The resilient structure enables a vertical displacement of the connectors, which transports the top plate in a piston-like motion to change the transducing space and to effectuate energy transformation. No separate cells are necessary for each addressable transducer element. Multiple device elements can be made on the same substrate.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: August 21, 2012
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20120112324
    Abstract: A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.
    Type: Application
    Filed: January 12, 2012
    Publication date: May 10, 2012
    Applicant: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8120229
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a substrate, a top plate, and a middle spring layer therebetween. The substrate and the middle spring layer define cavities therebetween sidewalled by standing features. The middle spring layer is anchored by the standing features to create cantilevers over the cavities to enable a vertical displacement of connectors placed on the middle spring layer. The connectors define a transducing space between the middle spring layer and the top plate. The top plate is transported by the vertical displacement of the connectors in a piston-like motion to change the transducing space and to effectuate energy transformation. Various configurations of cantilevers, including single cantilevers, back-to-back double cantilevers and head-to-head double cantilevers (bridges) are possible.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: February 21, 2012
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8105941
    Abstract: A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: January 31, 2012
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20120013218
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) having a non-flat surface is disclosed. The non-flat surface may include a variable curve or slope in an area where a spring layer contacts a support, thus making a variable spring model as the spring layer vibrates. The non-flat surface may be that of a non-flat electrode optimized to compensate the dynamic deformation of the other electrode during operation and thus enhance the uniformity of the dynamic electrode gap during operation. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate.
    Type: Application
    Filed: September 9, 2011
    Publication date: January 19, 2012
    Applicant: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8018301
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a spring-mass connector. The base includes a first electrode. The spring layer or the mass layer includes a second electrode. The base and the spring layer form a gap therebetween and are connected through a spring anchor. The mass layer provides a substantially independent spring mass contribution to the spring model without affecting the equivalent spring constant. The mass layer also functions as a surface plate interfacing with the medium to improve transducing performance. Fabrication methods to make the same are also disclosed.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: September 13, 2011
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8008105
    Abstract: A method for fabricating a micro-electro-mechanical device (such as a cMUT) is disclosed. The method combines a substrate, a middle spring layer and a top plate using wafer bonding technology or sacrificial technology. A cavity is formed on either the top of the substrate or the bottom of the middle spring layer. A connector is formed on either the top of the middle spring layer or the bottom of the top plate. Upon joining the three layers, the connector defines a transducing space between the top plate and the middle spring layer. The connector is horizontally distanced from the sidewall to define a cantilever anchored at the sidewall. The cantilever and the cavity allow a vertical displacement of the connector, which transports the top wafer in a piston-like motion to change the transducing space. Multiple device elements can be made on the same substrate.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: August 30, 2011
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8004373
    Abstract: A MEMS ultrasonic device has an array of PZT transducer elements and a cMUT structure bonded to the array of PZT transducer elements. The MEMS ultrasonic device can be adapted for ultrasonic imaging. The cMUT structure may serve as an active MEMS acoustic filter having at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. An array of MEMS acoustic filters may be designed to function as an acoustic lens. Fabrication methods to make the same are also disclosed.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: August 23, 2011
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20110136284
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a spring-mass connector. The base includes a first electrode. The spring layer or the mass layer includes a second electrode. The base and the spring layer form a gap therebetween and are connected through a spring anchor. The mass layer provides a substantially independent spring mass contribution to the spring model without affecting the equivalent spring constant. The mass layer also functions as a surface plate interfacing with the medium to improve transducing performance. Fabrication methods to make the same are also disclosed.
    Type: Application
    Filed: January 31, 2011
    Publication date: June 9, 2011
    Applicant: KOLO TECHNOLOGIES, INC.
    Inventor: Yongli Huang
  • Patent number: 7956510
    Abstract: A capacitive micromachined ultrasonic transducer (cMUT) system uses a modulation technique to increase cMUT sensitivity. An AC carrier signal is applied to the cMUT through a modulation signal port to modulate the signal. The higher frequency of the AC carrier signal carries the real signal to a high frequency range to increase the output current signal level. The real signal is later recovered by demodulation. The technique is applicable in both the reception mode and the transmission mode.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: June 7, 2011
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 7880565
    Abstract: A micro-electro-mechanical transducer (such as a cMUT) is disclosed. The transducer has a base, a spring layer placed over the base, and a mass layer connected to the spring layer through a spring-mass connector. The base includes a first electrode. The spring layer or the mass layer includes a second electrode. The base and the spring layer form a gap therebetween and are connected through a spring anchor. The mass layer provides a substantially independent spring mass contribution to the spring model without affecting the equivalent spring constant. The mass layer also functions as a surface plate interfacing with the medium to improve transducing performance. Fabrication methods to make the same are also disclosed.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: February 1, 2011
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20100280388
    Abstract: Ultrasonic scanners and methods of manufacturing ultra-sonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.
    Type: Application
    Filed: December 3, 2008
    Publication date: November 4, 2010
    Applicant: Kolo Technologies, Inc
    Inventor: Yongli Huang
  • Publication number: 20100278015
    Abstract: A cMUT and a cMUT operation method use an input signal that has two components with different frequency characteristics. The first component has primarily acoustic frequencies within a frequency response band of the cMUT, while the second component has primarily frequencies out of the frequency response band. The bias signal and the second component of the input signal together apply an operation voltage on the cMUT. The operation voltage is variable between operation modes, such as transmission and reception modes. The cMUT allows variable operation voltage by requiring only one AC component. This allows the bias signal to be commonly shared by multiple cMUT elements, and simplifies fabrication. The implementations of the cMUT and the operation method are particularly suitable for ultrasonic harmonic imaging in which the reception mode receives higher harmonic frequencies.
    Type: Application
    Filed: November 26, 2008
    Publication date: November 4, 2010
    Applicant: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20100262014
    Abstract: Ultrasonic scanners and methods of manufacturing ultrasonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.
    Type: Application
    Filed: December 3, 2008
    Publication date: October 14, 2010
    Inventor: Yongli Huang
  • Publication number: 20100251537
    Abstract: A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.
    Type: Application
    Filed: December 3, 2008
    Publication date: October 7, 2010
    Applicant: Kolo Technologies, Inc
    Inventor: Yongli Huang
  • Publication number: 20100254222
    Abstract: Implementations of a cMUT have dual operation modes. The cMUT has two different switchable operating conditions depending on whether a spring member in the cMUT contacts an opposing surface at a contact point in the cMUT. The two different operating conditions have different frequency responses due to the contact. The cMUT can be configured to operate in transmission mode when the cMUT in the first operating condition and to operate in reception mode when the cMUT is in the second operating condition. The implementations of the dual operation mode cMUT are particularly suitable for ultrasonic harmonic imaging in which the reception mode receives higher harmonic frequencies.
    Type: Application
    Filed: November 26, 2008
    Publication date: October 7, 2010
    Inventor: Yongli Huang
  • Publication number: 20100255623
    Abstract: Embodiments of a method for packaging cMUT arrays allow packaging multiple cMUT arrays on the same packaging substrate introduced over a side of the cMUT arrays. The packaging substrate is a dielectric layer on which openings are patterned for depositing a conductive layer to connect a cMUT array to VO pads interfacing with external devices. Auxiliary system components may be packaged together with the cMUT arrays. Multiple cMUT arrays and optionally multiple auxiliary system components can be held in place by a larger support structure for batch production. The support structure can be made of an arbitrary size using inexpensive materials.
    Type: Application
    Filed: December 3, 2008
    Publication date: October 7, 2010
    Inventor: Yongli Huang
  • Publication number: 20100246332
    Abstract: Implementations include a capacitive micromachined ultrasonic transducer (CMUT) having an additional transducing device overlaid in a vertically stacked relationship. In some implementations the additional transducing device is a second CMUT configured to operate at a different frequency from the first CMUT.
    Type: Application
    Filed: December 3, 2008
    Publication date: September 30, 2010
    Applicant: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Publication number: 20100244623
    Abstract: Implementations of a capacitive micromachined ultra-sonic transducer (CMUT) include a feedback component connected in series with the CMUT. The feedback component applies a feedback on a voltage applied on the CMUT for affecting the voltage applied on the CMUT as a capacitance of the CMUT changes during actuation of the CMUT.
    Type: Application
    Filed: December 3, 2008
    Publication date: September 30, 2010
    Applicant: Kolo Technologies, Inc.
    Inventor: Yongli Huang