Abstract: A capacitive micromachined ultrasonic transducers (cMUT) system has two cMUTs connected to each other. The first cMUT is adapted for operation in a transmission mode, and the second cMUT is adapted for operation in the reception mode. The first cMUT and the second cMUT share a common signal line and are connected in a manner to allow the first cMUT and the second cMUT to have bias voltages that can be independently set. In one embodiment, one of the cMUTs is connected to a voltage controller to regulator the voltage applied there on. Various connection configurations, including connections in series and connections in parallel, are disclosed. The cMUT system configurations allow separate optimization for transmission and reception and better flexibility in operation.

Abstract: A capacitive micromachined ultrasonic transducers (cMUT) uses signal control methods to reduce harmonic distortion of the output signal. The method uses an AC transmission input signal characterized with a frequency ? and takes the second-order frequency component with frequency 2?, rather than the first-order frequency component with the base frequency ?, as the desired output pressure signal. A frequency ? is preferably equal to ?0/2, where ? is the desired cMUT output frequency. Various examples of AC transmission input signals, in combination with or without a DC bias signal, that are suitable for producing a large second-order frequency component and small (ideally zero) first-order frequency component are disclosed.

Abstract: A capacitive micromachined ultrasonic transducer (cMUT) has an acoustic decoupling feature. A cavity is introduced underneath the regular cMUT element, preferably in the substrate, to provide acoustic decoupling. Trenches are also introduced to separate the cMUT elements and to provide further acoustic decoupling. The acoustic decoupling feature may be used in both conventional membrane-based cMUT and the newer embedded-spring cMUT (ESCMUT). Exemplary fabrication methods are also described.

Abstract: Structure for capacitive micromachined ultrasonic transducer (CMUT) device or other vibrating membrane device having non-uniform membrane so that membrane mass and stiffness characteristics may be substantially independently adjusted. CMUT having trenched membrane and/or membrane with non-uniform thickness or density. Method for operating transducer or vibrating membrane device. Array of devices at least some of which have non-uniform membrane properties. CMUT comprising substrate, support for membrane, and membrane extending over support to create cavity, membrane having non-uniform membrane thickness resulting from at least one of: thickening on upper surface of the membrane outside of cavity, thickening on lower surface of membrane inside cavity, trench on upper surface of membrane, trench on lower surface of the membrane, and any combination of two or more of these. Method for fabricating CMUT or vibrating membrane device having non-uniform membrane.

Abstract: A MEMS acoustic filter has a MEMS resonator and at least two acoustic I/O ports to alter an input acoustic signal to an output acoustic signal. The first I/O port is adapted for interfacing with a medium, and the second I/O port for passing an acoustic signal to an acoustic transducer. Multiple MEMS resonators may be stacked to form a high order acoustic filter. An array of MEMS acoustic filters may be designed to function as an acoustic lens. The MEMS acoustic filter is particularly useful with an ultrasonic transducer, such as PZT and MUT. Fabrication methods to make the same are also disclosed.

Abstract: A curved or bendable micro-electro-mechanical transducer (such as the cMUT) is disclosed. The transducer has a plurality of transducer elements built on a substrate. The substrate has a slot below every two neighboring device elements. Each slot is at least at least partially filled with a flexible material to allow bending of the substrate. A bending actuator may be included to facilitate the bending of the substrate. An exemplary bending actuator uses a nonuniformly shrinkable material to bend the substrate. A curved or bendable cMUT of the present invention can be configured to be an intravascular ultrasound (IVUS) device.

Abstract: The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.

Abstract: There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.

Abstract: A capacitive ultrasonic transducer is described which include one or more cells including a cavity defined by a membrane electrode supported spaced from a support electrode by insulating walls with a patterned isolation layer having isolation posts or areas located in said cavity to prevent the electrodes for coming into contact during operation of the transducer, and to minimize the accumulation of charge as compared to a non-patterned isolation layer for preventing contact of the electrodes during operation of the transducer.

Abstract: There is described a micromachined ultrasonic transducers (MUTS) and a method of fabrication. The membranes of the transducers are fusion bonded to cavities to form cells. The membranes are formed on a wafer of sacrificial material. This permits handling for fusions bonding. The sacrificial material is then removed to leave the membrane. Membranes of silicon, silicon nitride, etc. can be formed on the sacrificial material. Also described are cMUTs, pMUTs and mMUTs.

Abstract: A translational optical shutter for a fiber optic switch uses movable mirrors at all matrix cross-points formed by micro electromechanical techniques from a single crystal silicon wafer which is of the 110 crystal plane type and which has been preferentially etched in the 111 plane to provide the appropriate mirror switching surface at the same time as the actuator for the mirror.

Abstract: An angular rate sensor made from a structural wafer of single crystal silicon has a pair of proof masses lying in an X-Y plane and supported by a circular frame. The masses are driven into oscillation in the X-direction using an interdigitated comb drive. Rotation of the sensor about the Z-axis induces Coriolis forces which cause the frame to rotate, the rotation of the frame being indicative of the angular rate of the sensor. A parallel plate sensor located outside of the circular frame senses rotation of the frame.

Abstract: A silicon monolithic miniature intra-ocular pressure sensing probe utilizes pressure sensing piezoresistors attached to a silicon pressure sensing membrane which is directly exposed to the irrigating fluid used during an eye operation, for example. From a silicon fabrication point of view, this is a micro electromechanical (MEM) device and the integration of the piezoresistive pressure sensor directly into the cannula which is inserted into the eye is partially made possible by providing p++ etch stops to gain access for electrical connection to the piezoresistive elements arranged in a Wheatstone bridge configuration. The silicon sensing membrane forms a smooth surface to avoid turbulence and is close to the eye to minimize error.