Abstract: A flow generator according to an embodiment of the present invention includes an upper fan configured to suction upper air and generate a first airflow, an upper fan housing configured to accommodate the upper fan from a lower side thereof and comprising a first discharge part through which the suctioned upper air is discharged, a lower fan configured to suction lower air and generate a second airflow, a lower fan housing configured to accommodate the lower fan from an upper side thereof and comprising a second discharge part through which the suctioned lower air is discharged, an air guide disposed between the upper fan and the lower fan to guide generation of a third airflow in which the first airflow and the second airflow are mixed with each other, and a control unit configured to control a rotational speed of the lower fan or the upper fan to adjust a discharge direction of the third airflow, wherein the first discharge part is disposed to face the second discharge part with respect to the flow guide par

Abstract: A flow generator according to an embodiment of the present invention includes an upper fan configured to suction upper air and generate a first airflow, an upper fan housing configured to accommodate the upper fan from a lower side thereof and comprising a first discharge part through which the suctioned upper air is discharged, a lower fan configured to suction lower air and generate a second airflow, a lower fan housing configured to accommodate the lower fan from an upper side thereof and comprising a second discharge part through which the suctioned lower air is discharged, an air guide disposed between the upper fan and the lower fan to guide generation of a third airflow in which the first airflow and the second airflow are mixed with each other, and a control unit configured to control a rotational speed of the lower fan or the upper fan to adjust a discharge direction of the third airflow, wherein the first discharge part is disposed to face the second discharge part with respect to the flow guide par

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A supported catalyst includes: (1) a catalyst support; and (2) deposits of a catalyst covering the catalyst support, wherein the deposits have an average thickness of about 2 nm or less, and the deposits are spaced apart from one another.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: An air conditioner includes a humidifying assembly and a control unit to control the humidifying assembly. The humidifying assembly includes a humidifying-receiving unit including a water tank configured to receive water and a humidifying-sterilizing unit configured to irradiate light to sterilize water received in the water tank. The control unit is configured to control a driving time of the humidifying-sterilizing unit based on an amount of water received in the water tank.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A method of manufacturing an organic light-emitting diode (OLED) display includes forming a thin film transistor and a first storage capacitor electrode, forming a second storage capacitor electrode overlapping the first storage capacitor electrode with a passivation layer covering the first storage capacitor electrode, the passivation layer being interposed between the second storage capacitor electrode and the first storage capacitor electrode, sequentially forming a first anode electrode and an insulating layer to overlap the second storage capacitor electrode on an overcoat layer covering the second storage capacitor, forming a pixel contact hole exposing a drain electrode of the thin film transistor through the overcoat layer and the passivation layer, and forming a second anode electrode coming in contact with the drain electrode and the first anode electrode and overlapping the first anode electrode with the insulating layer interposed between the second anode electrode and the first anode electrode.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A catalyst structure includes: (1) a substrate; (2) a catalyst layer on the substrate; and (3) an adhesion layer disposed between the substrate and the catalyst layer. In some implementations, an average thickness of the adhesion layer is about 1 nm or less. In some implementations, a material of the catalyst layer at least partially extends into a region of the adhesion layer. In some implementations, the catalyst layer is characterized by a lattice strain imparted by the adhesion layer.

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A membrane electrode assembly manufacturing device includes a loading apparatus for supplying an MEA roll on which a membrane electrode assembly is arranged by a predetermined pitch, a hot press apparatus for pressing a surface corresponding to the membrane electrode assembly of the MEA roll at a set temperature, a buffer apparatus to which the MEA roll is supplied to one side and exhausted at the other side, and for performing a buffer function of absorbing a difference between supply and exhaustion, and a cutting apparatus for cutting a portion of the membrane electrode assembly arranged at the MEA roll.

Abstract: A method includes (1) functionalizing a substrate to yield a functionalized substrate; and (2) depositing a catalyst on the functionalized substrate by atomic layer deposition to form a thin film of the catalyst covering the functionalized substrate.

Abstract: Provided is an air conditioning apparatus. The air conditioning apparatus includes an air cleaner and an air washer coupled to the air cleaner.

Abstract: A manufacturing device of a membrane-electrode assembly for fuel cell includes a membrane unwinder unwinding and supplying a polymer electrolyte membrane of a roll shape; a film unwinder unwinding and supplying a release film of a roll shape respectively coated with an anode catalyst electrode layer and a cathode catalyst electrode layer with a predetermined interval in an upper and lower sides of the polymer electrolyte membrane; upper and lower bonding rolls respectively disposed at the upper and lower sides of a progressing path of the polymer electrolyte membrane and the release film and pressed to an upper surface and a lower surface of the polymer electrolyte membrane; and a protection film unwinder unwinding and supplying a protection film between adhered surfaces of the release film and the upper and lower bonding rolls.

Abstract: Provided is a humidification and air cleaning apparatus. The humidification and air cleaning apparatus includes an intake flow passage suctioning external air, a discharge flow passage discharging internal air, a blower unit flowing air flowing to the intake flow passage to the discharge flow passage, a discharge humidification medium disposed on the discharge flow passage to additionally humidify flowing air, a water tank humidification medium disposed between the blower unit and the discharge humidification medium to humidify flowing air, and a watering unit spraying water between the water tank humidification medium and the discharge humidification medium.

Abstract: A method of manufacturing an organic light-emitting diode (OLED) display includes forming a thin film transistor and a first storage capacitor electrode, forming a second storage capacitor electrode overlapping the first storage capacitor electrode with a passivation layer covering the first storage capacitor electrode, the passivation layer being interposed between the second storage capacitor electrode and the first storage capacitor electrode, sequentially forming a first anode electrode and an insulating layer to overlap the second storage capacitor electrode on an overcoat layer covering the second storage capacitor, forming a pixel contact hole exposing a drain electrode of the thin film transistor through the overcoat layer and the passivation layer, and forming a second anode electrode coming in contact with the drain electrode and the first anode electrode and overlapping the first anode electrode with the insulating layer interposed between the second anode electrode and the first anode electrode.

Abstract: A display device includes a display panel, a printed circuit board under the display panel and having one surface on which a driving chip is mounted, a first reinforcing member between the display panel and the printed circuit board, and a second reinforcing member under the printed circuit board, configured to face the printed circuit board having the driving chip therebetween, the second reinforcing member having a recessed groove in one surface facing the driving chip and the driving chip being in the recessed groove.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.