Patents by Inventor Yongqi Hu
Yongqi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11826875Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: October 5, 2021Date of Patent: November 28, 2023Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Publication number: 20230278158Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: ApplicationFiled: April 3, 2023Publication date: September 7, 2023Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Patent number: 11618124Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: GrantFiled: August 6, 2020Date of Patent: April 4, 2023Assignee: Applied Materials, Inc.Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Patent number: 11593278Abstract: Some embodiments provide a method of providing distributed storage services to a host computer from a network interface card (NIC) of the host computer. At the NIC, the method accesses a set of one or more external storages operating outside of the host computer through a shared port of the NIC that is not only used to access the set of external storages but also for forwarding packets not related to an external storage. In some embodiments, the method accesses the external storage set by using a network fabric storage driver that employs a network fabric storage protocol to access the external storage set. The method presents the external storage as a local storage of the host computer to a set of programs executing on the host computer. In some embodiments, the method presents the local storage by using a storage emulation layer on the NIC to create a local storage construct that presents the set of external storages as a local storage of the host computer.Type: GrantFiled: January 9, 2021Date of Patent: February 28, 2023Assignee: VMWARE, INC.Inventors: Jinpyo Kim, Claudio Fleiner, Marc Fleischmann, Anjaneya P. Gondi, Yongqi Hu
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Publication number: 20220206962Abstract: Some embodiments provide a method of providing distributed storage services to a host computer from a network interface card (NIC) of the host computer. At the NIC, the method accesses a set of one or more external storages operating outside of the host computer through a shared port of the NIC that is not only used to access the set of external storages but also for forwarding packets not related to an external storage. In some embodiments, the method accesses the external storage set by using a network fabric storage driver that employs a network fabric storage protocol to access the external storage set. The method presents the external storage as a local storage of the host computer to a set of programs executing on the host computer. In some embodiments, the method presents the local storage by using a storage emulation layer on the NIC to create a local storage construct that presents the set of external storages as a local storage of the host computer.Type: ApplicationFiled: January 9, 2021Publication date: June 30, 2022Inventors: Jinpyo Kim, Claudio Fleiner, Marc Fleischmann, Anjaneya P. Gondi, Yongqi Hu
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Publication number: 20220023990Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: ApplicationFiled: October 5, 2021Publication date: January 27, 2022Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 11161218Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: January 18, 2019Date of Patent: November 2, 2021Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Publication number: 20200361054Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: ApplicationFiled: August 6, 2020Publication date: November 19, 2020Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Patent number: 10744618Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: GrantFiled: August 14, 2017Date of Patent: August 18, 2020Assignee: Applied Materials, Inc.Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Patent number: 10399202Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (?in).Type: GrantFiled: March 18, 2016Date of Patent: September 3, 2019Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Simon Yavelberg, Gangadhar Sheelavant, Kadthala R. Narendrnath
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Publication number: 20190152017Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: ApplicationFiled: January 18, 2019Publication date: May 23, 2019Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 10213894Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: GrantFiled: February 26, 2016Date of Patent: February 26, 2019Assignee: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 10029346Abstract: An external clamp ring for a chemical mechanical polishing (CMP) carrier head having a hydrophobic coating, and a carrier head having the same are described herein. In one embodiment, an external clamp ring is provided that includes a cylindrical body having an outer cylindrical wall and an inner cylindrical wall. A hydrophobic layer disposed is on the outer cylindrical wall.Type: GrantFiled: June 8, 2016Date of Patent: July 24, 2018Assignee: Applied Materials, Inc.Inventors: Patrick Ala, Bo B. Ding, Yongqi Hu, Simon Yavelberg, Mats Larsson
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Publication number: 20180065227Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: ApplicationFiled: August 14, 2017Publication date: March 8, 2018Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Publication number: 20180056479Abstract: A semiconductor fabrication system includes a chemical mechanical polishing system, a cassette holding area enclosed by a wall and having a door openable by an operator to place one or more cassettes into the cassette holding area, a robot configured to transfer substrates between a cassette in the cassette holding area to the chemical mechanical polishing system, a computer controller configured to cause the robot to move to a home position, a circuit breaker in a power supply line to the robot, a door sensor to detect whether the door is open, a robot presence sensor to detect whether the robot is in the home position, and control circuitry configured to receive signals from the door sensor and the robot presence sensor and cause the circuit breaker to cut power to the robot if the door is open and the robot is not in the home position.Type: ApplicationFiled: August 25, 2017Publication date: March 1, 2018Inventors: Yongqi Hu, Thomas Lawrence Terry
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Publication number: 20170246722Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.Type: ApplicationFiled: February 26, 2016Publication date: August 31, 2017Applicant: Applied Materials, Inc.Inventors: Yongqi Hu, Kadthala Ramaya Narendrnath, Thomas Lawrence Terry
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Patent number: 9744640Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.Type: GrantFiled: October 16, 2015Date of Patent: August 29, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Gangadhar Sheelavant, Simon Yavelberg, Yongqi Hu
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Patent number: 9731397Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.Type: GrantFiled: January 12, 2015Date of Patent: August 15, 2017Assignee: Applied Materials, Inc.Inventors: Rajkumar Alagarsamy, Yongqi Hu, Simon Yavelberg, Periya Gopalan, Christopher R. Mahon
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Publication number: 20170106495Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.Type: ApplicationFiled: October 16, 2015Publication date: April 20, 2017Inventors: Gangadhar SHEELAVANT, Simon YAVELBERG, Yongqi HU
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Publication number: 20170106496Abstract: An external clamp ring for a chemical mechanical polishing (CMP) carrier head having a hydrophobic coating, and a carrier head having the same are described herein. In one embodiment, an external clamp ring is provided that includes a cylindrical body having an outer cylindrical wall and an inner cylindrical wall. A hydrophobic layer disposed is on the outer cylindrical wall.Type: ApplicationFiled: June 8, 2016Publication date: April 20, 2017Inventors: Patrick ALA, Bo B. DING, Yongqi HU, Simon YAVELBERG, Mats LARSSON