Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.

Abstract: The present disclosure relates to microphones and electronic devices having the same. The microphone may include a housing for receiving sound signals, at least two transducers for vibrating to generate electrical signals in response to the sound signals, and a processing circuit for processing the electrical signals. Each of the at least two transducers may provide a distinctive resonance peak to the microphone.

Abstract: The present disclosure relates to microphones and electronic devices having the same. The microphone may include a housing for receiving sound signals, at least two transducers for vibrating to generate electrical signals in response to the sound signals, and a processing circuit for processing the electrical signals. Each of the at least two transducers may provide a distinctive resonance peak to the microphone.

Abstract: The present disclosure provides a vibration component. The vibration component may include: a mass element; and an elastic element, the elastic element including a connection region and a first preprocessing region, wherein the connection region is configured to support the mass element; and a deformation quantity of the first preprocessing region is greater than a deformation quantity of a region of the elastic element other than the first preprocessing region when the mass element vibrates.

Abstract: Vibration sensors are provided. The vibration sensor may include: a vibration assembly, the vibration assembly including a mass element and an elastic element, and the mass element being connected to the elastic element; a first acoustic cavity, the elastic element constituting one of sidewalls of the first acoustic cavity, and the vibration assembly vibrating to make a volume of the first acoustic cavity change in response to an external vibration signal; an acoustic transducer, the acoustic transducer being in communication with the first acoustic cavity and the acoustic transducer generating an electrical signal in response to a volume change of the first acoustic cavity; and a buffer, the buffer limiting a vibration amplitude of the vibration assembly, wherein the acoustic transducer has a first resonance frequency, the vibration assembly has a second resonance frequency, and the second resonance frequency of the vibration assembly is smaller than the first resonance frequency.

Abstract: The present disclosure provides a vibration sensor including a vibration assembly including a mass element and an elastic element, a first acoustic chamber, an acoustic transducer, and a buffer member. In response to an external vibration signal, the vibration assembly vibrates such that a volume of the first acoustic chamber changes. The acoustic transducer is in communication with the first acoustic chamber. In response to a volume change of the first acoustic chamber, the acoustic transducer may generate an electrical signal. The buffer member is connected to the mass element or the elastic element. The buffer member reduces an impact force of the mass element acting on the elastic element during a vibration process of the vibration assembly. The acoustic transducer has a first resonance frequency, the vibration assembly has a second resonance frequency, and the second resonance frequency is less than the first resonance frequency.

Abstract: A vibration sensor is provided and includes an acoustic transducer, a vibration component, and a housing. The vibration component is connected to the acoustic transducer and configured to transmit an external vibration signal to the acoustic transducer to generate an electrical signal. The housing is configured to accommodate the acoustic transducer and the vibration component and generate vibrations based on the external vibration signal. The vibration component and the acoustic transducer form a plurality of acoustic cavities including a first acoustic cavity spatially connected to the acoustic transducer. The vibration component causes a sound pressure change of the first acoustic cavity in response to the vibrations of the housing. The acoustic transducer generates an electrical signal based on the sound pressure change of the first acoustic cavity. The vibration component includes a first hole part through which the first acoustic cavity is spatially connected to other acoustic cavities.

Abstract: One or more embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a housing structure, an acoustic transducer, and a vibration unit. The acoustic transducer may be physically connected to the housing structure. An acoustic cavity may be formed at least partially by the housing structure and the acoustic transducer. The vibration unit may be configured to divide the acoustic cavity into a plurality of acoustic cavities. The plurality of acoustic cavities may include a first acoustic cavity. The first acoustic cavity may be in acoustic communication with the acoustic transducer. The vibration unit may include an elastic element and a mass element. The elastic element and the mass element may be located in the acoustic cavity, and the mass element may be connected to the housing structure or the acoustic transducer through the elastic element.

Abstract: The embodiments of the present disclosure provide a sensor device, including: a sensor assembly with a first resonant frequency and a sound pickup assembly configured to communicate with an external sound of the sensor device through a sound inlet, wherein an acoustic cavity may be formed between the sound pickup assembly and the sensor assembly, when the sound pickup assembly vibrates in response to an air conduction sound transmitted through the sound inlet, vibrations of the sound pickup assembly may change a sound pressure in the acoustic cavity, and the sensor assembly may convert the air conduction sound into an electrical signal based on changes of the sound pressure in the acoustic cavity, wherein the sound pickup assembly may provide the sensor device with a second resonant frequency, and a difference between the second resonant frequency and the first resonant frequency may be in a range of 1000 Hz-10000 Hz.

Abstract: The present disclosure discloses a sensing device, comprising a sensor configured to convert a sound signal into an electrical signal, the sensor having a first resonant frequency; and a resonant system including a vibration pickup unit and configured to generate a vibration in response to a vibration of a housing of the sensing device. The vibration pickup unit may include at least an elastic diaphragm and a mass block. The elastic diaphragm may be connected to the housing the sensing device through a peripheral side of the elastic diaphragm. The mass block may be at least made of a polymer material. A first acoustic cavity may be defined between the elastic diaphragm and the sensor. When the housing of the sensing device generates a vibration in response to an external sound signal, the elastic diaphragm and the mass block may generate a vibration in response to the vibration of the housing of the sensing device.

Abstract: The present disclosure provides a sensing device, comprising: a housing, an accommodation cavity being provided inside the housing; a transduction unit, including a vibration-pickup structure used to pick up vibration of the housing to generate an electrical signal, wherein the transduction unit divides the accommodation cavity into a front cavity and a rear cavity located on opposite sides of the vibration-pickup structure, at least one of the front cavity or the rear cavity is filled with liquid, and the liquid is in contact with the vibration-pickup structure; and one or more pipeline structures, each pipeline structure being configured to connect the accommodation cavity to an outside of the housing, the liquid being at least partially located in the one or more pipeline structures.

Abstract: One of the embodiments of the present disclosure provides a sensor device, including: a housing and a transducer unit, wherein the housing has an accommodating cavity inside, the transducer unit includes a vibration pickup structure configured to pick up a vibration of the housing and produce an electrical signal, and the transducer unit in the accommodating cavity separates the accommodating cavity to form a front cavity and a rear cavity on opposite sides of the vibration pickup structure. At least one cavity of the front cavity and the rear cavity is filled with liquid, the liquid is in contact with the vibration pickup structure, and an air cavity is formed between the liquid and the housing.

Abstract: The present disclosure provides a microphone comprising: an acoustoelectric transducer configured to convert an sound signal to an electrical signal; an acoustic structure, the acoustic structure comprising a sound guiding tube and an acoustic cavity, the acoustic cavity being acoustically communicated with the acoustoelectric transducer and acoustically communicated with the outside of the microphone through the sound guiding tube; wherein the acoustic structure has a first resonant frequency, the acoustoelectric transducer has a second resonant frequency, and an absolute value of the difference between the first resonant frequency and the second resonant frequency is not greater than 1000 Hz.

Abstract: An embodiment of the present disclosure provides a vibration sensing device, which may include a vibration sensor and at least one vibration component. The vibration sensor has a first resonant frequency, at least one vibration component may be configured to transmit the received vibration to the vibration sensor, and the at least one vibration component may include a liquid arranged in the target cavity and a plate body forming a part of the cavity wall of the target cavity. The at least one vibration component may provide at least one second resonant frequency for the vibration sensing device, and at least one second resonant frequency may be different from the first resonant frequency.

Abstract: A vibration sensor and a microphone are provided. The vibration sensor includes a piezoelectric system and a capacitive system. The piezoelectric system includes a vibration component and a piezoelectric sensing component collecting a first electrical signal generated due to deformation of the vibration component. The capacitive system uses the vibration component in the piezoelectric system as a movable capacitive plate and a fixed substrate opposite to the vibration component to form a capacitive vibration sensor. The deformation of the vibration component changes a distance between the vibration component and the fixed substrate. A capacitive sensing component collects a second electrical signal generated due to the distance change. The capacitive sensing component is disposed in a region where the first electrical signal in the piezoelectric system is low, thereby better using space of the vibration sensor, and enhancing the second electrical signal without affecting output of the first electrical signal.

Abstract: Embodiments of the present disclosure provide a vibration sensor. The vibration sensor may include a transducer; and a vibration component connected with the transducer, wherein the vibration component may be configured to transmit an external vibration signal to the transducer to generate an electrical signal, and include one or more plate structures and one or more mass blocks physically connected with each of the one or more plate structures; and the vibration component may be further configured to make a sensitivity of the vibration sensor greater than a sensitivity of the transducer within one or more target frequency bands.

Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.

Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.

Abstract: The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.

Abstract: The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 kHz.