Patents by Inventor Yongshuai YUAN

Yongshuai YUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230247352
    Abstract: The present disclosure is of a bone conduction microphone. The bone conduction microphone comprises of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, the vibration unit deforms in response to the vibration of the base structure, and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit. A resonant frequency of the bone conduction microphone is within a range of 2.5 kHz-4.5 kHz.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 3, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yongshuai YUAN, Wenbing ZHOU, Wenjun DENG
  • Patent number: 11698292
    Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: July 11, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenjun Deng, Yongshuai Yuan, Wenbing Zhou, Yujia Huang
  • Publication number: 20230217163
    Abstract: The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device includes of a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. The base structure is configured to load the laminated structure. At least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 6, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG
  • Publication number: 20230217147
    Abstract: A vibration sensor includes a vibration receiver and an acoustic transducer. The vibration receiver includes a housing and a vibration unit. The housing forms an acoustic cavity. The vibration unit is located in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer is acoustically connected to the first acoustic cavity. The housing is configured to generate vibration based on an external vibration signal. The vibration unit vibrates in response to the vibration of the housing and transmits, through the first acoustic cavity, the vibration to the acoustic transducer to generate an electrical signal. The vibrating unit includes a mass element and an elastic element. A deviation between cross-sectional areas of the mass element and the first acoustic cavity perpendicular to a vibration direction of the mass unit is less than 25%.
    Type: Application
    Filed: March 9, 2023
    Publication date: July 6, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenjun DENG, Yongshuai YUAN, Wenbing ZHOU, Yujia HUANG, Jinbo ZHENG, Fengyun LIAO, Xin QI
  • Publication number: 20230213611
    Abstract: Some embodiments of the present disclosure provide a method for locating a vibration signal source. The method may include obtaining sensing signals of at least two vibration sensing devices located at different locations, each of the sensing signals being generated by one of the at least two vibration sensing devices by sensing a vibration signal generated by a vibration, which is from the same vibration signal source; determining, based on the sensing signals, a time difference between time points when the at least two vibration sensing devices located at different locations receive the vibration signal; and determining, based on the time difference, a location of the vibration signal source.
    Type: Application
    Filed: November 10, 2022
    Publication date: July 6, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Le XIAO, Yongshuai YUAN, Yujia HUANG, Fengyun LIAO, Xin QI
  • Publication number: 20230199360
    Abstract: A vibration sensor (200) is provided, comprising: a vibration receiver (210) including a housing (211) and a vibration unit (212), the housing (211) forming an acoustic cavity, the vibration unit (212) being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) acoustically connected to the first acoustic cavity (213). The housing (211) is configured to generate a vibration based on an external vibration signal, the vibration unit (212) changes an acoustic pressure within the first acoustic cavity (213) in response to the vibration of the housing (211), causing the acoustic transducer (220) to generate an electrical signal. The vibration unit (212) includes a quality element (2121) and an elastic element (2122), an area of the quality element (2121) on a side away from the acoustic transducer (220) is smaller than an area of the quality element (2121) on a side close to the acoustic transducer.
    Type: Application
    Filed: February 22, 2023
    Publication date: June 22, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: WenJun DENG, Yongshuai YUAN, Yujia HUANG, Wenbing ZHOU, Fengyun LIAO, Xin QI
  • Publication number: 20230199370
    Abstract: The present disclosure provides a vibration sensor. The vibration sensor may include a vibration receiver and an acoustic transducer. The vibration receiver may include a housing, a limiter and a vibration unit. The housing and the acoustic transducer may form an acoustic cavity. The vibration unit may be located in the acoustic cavity to separate the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer may be acoustically connected to the first acoustic cavity. The housing may be configured to generate a vibration based on an external vibration signal. The vibration unit may change an acoustic pressure within the first acoustic cavity in response to the vibration of the housing, such that the acoustic transducer generates an electrical signal. The vibration unit may include a mass element and an elastic element. A first side of the elastic element may be connected around a side wall of the mass element.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenjun DENG, Yongshuai YUAN, Yujia HUANG, Wenbing ZHOU, Fengyun LIAO, Xin QI
  • Publication number: 20230188911
    Abstract: The present disclosure is of a bone conduction sound transmission device. The bone conduction sound transmission device comprises a laminated structure and a base structure. The laminated structure is formed by a vibration unit and an acoustic transducer unit. A base structure is configured to load the laminated structure, and at least one side of the laminated structure is physically connected to the base structure. The base structure vibrates based on an external vibration signal, and the vibration unit deforms in response to the vibration of the base structure; and the acoustic transducer unit generates an electrical signal based on the deformation of the vibration unit.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
  • Patent number: 11671746
    Abstract: The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: June 6, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing Zhou, Xin Qi, Fengyun Liao, Yongshuai Yuan
  • Patent number: 11662248
    Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: May 30, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yongshuai Yuan, Wenjun Deng, Wenbing Zhou, Yujia Huang, Fengyun Liao, Xin Qi
  • Publication number: 20230047687
    Abstract: The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yujia HUANG, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
  • Publication number: 20230045906
    Abstract: The present disclosure provides a microphone including at least one acoustoelectric transducer and an acoustic structure. The acoustoelectric transducer is configured to convert a sound signal to an electrical signal. The acoustic structure includes a sound guiding tube and an acoustic cavity. The acoustic cavity is in acoustic communication with the acoustoelectric transducer, and is in acoustic communication with outside of the microphone through the sound guiding tube. The acoustic structure has a first resonance frequency, the acoustoelectric transducer has a second resonance frequency, and an absolute value of a difference between the first resonance frequency and the second resonance frequency is not less than 100 Hz. By disposing different acoustic structures, resonance peaks in different frequency ranges may be added to the microphone, which improves a sensitivity of the microphone near multiple resonance peaks, thereby improving a sensitivity of the microphone in the entire wide frequency band.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yujia HUANG, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
  • Publication number: 20230046902
    Abstract: The embodiments of the present disclosure may disclose a vibration sensor, including: an acoustic transducer and a vibration assembly connected with the acoustic transducer. The vibration assembly may be configured to transmit an external vibration signal to the acoustic transducer to generate an electric signal, the vibration assembly includes one or more groups of vibration diaphragms and mass blocks, and the mass blocks may be physically connected with the vibration diaphragms. The vibration assembly may be configured to make a sensitivity degree of the vibration sensor greater than a sensitivity degree of the acoustic transducer in one or more target frequency bands.
    Type: Application
    Filed: July 25, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
  • Publication number: 20230049441
    Abstract: The embodiments of the present disclosure disclose a system and method. The system may include at least one storage device configured to storage computer instruction; and at least one processor, in communication with the storage device. When executing the computer instructions, the at least one processor is configured to direct the system to perform operations including: obtaining a sensing signal of at least one sensing device; identifying a signal feature of the sensing signal; and determining, based on the signal feature, an operation of a target object associated with the at least one sensing device.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
  • Publication number: 20230049593
    Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Yujia HUANG, Xin QI, Fengyun LIAO
  • Publication number: 20230013504
    Abstract: The embodiment of the present disclosure discloses a sensing device, comprising: an elastic component; a sensing cavity, wherein the elastic component forms a first sidewall of the sensing cavity; and an energy conversion component configured to obtain a sensing signal and convert the sensing signal into an electrical signal, the energy conversion component being in communication with the sensing cavity, and the sensing signal relating to a change of a volume of the sensing cavity, wherein at least one convex structure is arranged on one side of the elastic component facing toward the sensing cavity, the elastic component drives the at least one convex structure to move in response to an external signal, and the movement of the at least one convex structure changing the volume of the sensing cavity.
    Type: Application
    Filed: July 13, 2022
    Publication date: January 19, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenjun DENG, Yongshuai YUAN, Wenbing ZHOU, Yujia HUANG
  • Publication number: 20220341964
    Abstract: The present disclosure discloses an acoustic device and a support assembly. The support assembly may include a shell configured to provide a space for accommodating one or more components of the acoustic device. The support assembly may further include an interaction assembly configured to realize an interaction between a user and the acoustic device, wherein the interaction assembly include a first component and one or more second components, in response to receiving an operation of the user, the first component is configured to trigger at least one of the one or more second components to cause the acoustic device to perform a function corresponding to the at least one of the one or more second components.
    Type: Application
    Filed: July 13, 2022
    Publication date: October 27, 2022
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Wenjun DENG, Yongshuai YUAN, Yujia HUANG, Xin QI, Fengyun LIAO
  • Publication number: 20220286772
    Abstract: A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Xin QI, Fengyun LIAO
  • Publication number: 20220248136
    Abstract: The present disclosure relates to microphones and electronic devices having the same. The microphone may include a housing for receiving sound signals, at least two transducers for vibrating to generate electrical signals in response to the sound signals, and a processing circuit for processing the electrical signals. Each of the at least two transducers may provide a distinctive resonance peak to the microphone.
    Type: Application
    Filed: April 23, 2022
    Publication date: August 4, 2022
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Xin QI, Fengyun LIAO, Yongshuai YUAN
  • Publication number: 20220174401
    Abstract: The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Xin QI, Fengyun LIAO, Yongshuai YUAN